Process for producing molded object with embedded member
    3.
    发明申请
    Process for producing molded object with embedded member 有权
    具有嵌入部件的成形体的制造方法

    公开(公告)号:US20090115106A1

    公开(公告)日:2009-05-07

    申请号:US11918972

    申请日:2005-09-13

    IPC分类号: B29C45/00

    摘要: A process for producing a molding having an embedded member which comprises: a first step in which a mold (1) having pins (3) which extend from the outside to the inside of the mold and can be withdrawn outward is heated to a given temperature; a second step in which a member (2) to be embedded is held in a given position within the mold by supporting the member, including an upper part thereof, with the pins (3); a third step in which a thermoplastic resin is packed through a gate (1d) first into that part of the cavity of the mold (1) which is located under the member to be embedded to thereby cause the thermoplastic resin to press the member against the pin (3) located in an upper part of the mold; a fourth step in which the thermoplastic resin is packed into the remaining part of the cavity of the mold (1); and a fifth step in which the pins (3) are withdrawn successively from the lower side of the mold before cooling to a temperature at which the thermoplastic resin solidifies and loses its flowability.

    摘要翻译: 一种具有嵌入构件的模制品的制造方法,包括:第一步骤,其中具有从模具的外部延伸到内部并可向外取出的销(3)的模具(1)被加热至给定温度 ; 第二步骤,其中通过将包括其上部的构件与所述销(3)支撑而将待嵌入的构件(2)保持在所述模具内的给定位置; 第三步骤,其中热塑性树脂首先通过浇口(1d)填充到位于待嵌入构件下方的模具(1)的空腔的那部分中,从而使热塑性树脂按压该构件 销(3)位于模具的上部; 第四步,将热塑性树脂填充到模具(1)的空腔的剩余部分中; 以及在冷却至热塑性树脂固化并失去其流动性的温度之前,将销(3)从模具的下侧依次取出的第五步骤。

    Process for producing molded object with embedded member
    4.
    发明授权
    Process for producing molded object with embedded member 有权
    具有嵌入部件的成形体的制造方法

    公开(公告)号:US08038921B2

    公开(公告)日:2011-10-18

    申请号:US11918972

    申请日:2005-09-13

    IPC分类号: B29C45/14

    摘要: A process for producing a molding having an embedded member which comprises: a first step in which a mold (1) having pins (3) which extend from the outside to the inside of the mold and can be withdrawn outward is heated to a given temperature; a second step in which a member (2) to be embedded is held in a given position within the mold by supporting the member, including an upper part thereof, with the pins (3); a third step in which a thermoplastic resin is packed through a gate (1d) first into that part of the cavity of the mold (1) which is located under the member to be embedded to thereby cause the thermoplastic resin to press the member against the pin (3) located in an upper part of the mold; a fourth step in which the thermoplastic resin is packed into the remaining part of the cavity of the mold (1); and a fifth step in which the pins (3) are withdrawn successively from the lower side of the mold before cooling to a temperature at which the thermoplastic resin solidifies and loses its flowability.

    摘要翻译: 一种具有嵌入构件的模制品的制造方法,包括:第一步骤,其中具有从模具的外部延伸到内部并可向外取出的销(3)的模具(1)被加热至给定温度 ; 第二步骤,其中通过将包括其上部的构件与所述销(3)支撑而将待嵌入的构件(2)保持在所述模具内的给定位置; 第三步骤,其中热塑性树脂首先通过浇口(1d)填充到位于待嵌入构件下方的模具(1)的空腔的那部分中,从而使热塑性树脂按压该构件 销(3)位于模具的上部; 第四步,将热塑性树脂填充到模具(1)的空腔的剩余部分中; 以及在冷却至热塑性树脂固化并失去其流动性的温度之前,将销(3)从模具的下侧依次取出的第五步骤。

    Epoxy resin composition
    7.
    发明授权
    Epoxy resin composition 失效
    环氧树脂组合物

    公开(公告)号:US4681904A

    公开(公告)日:1987-07-21

    申请号:US843754

    申请日:1986-03-25

    CPC分类号: H01B3/40 C08L63/00

    摘要: A novel epoxy resin composition is prepared by first mixing 100 parts by weight of an epoxy resin having an epoxy equivalent of no more than 200 with 0.5-10 parts by weight of a phenoxy resin to form a uniform mixture, then blending the mixture with a curing agent (i.e., a condensation product of a polybasic carboxylic acid and bisphenol A) and an inorganic filler. The epoxy resin composition has a suitable degree of rigidity and softness within the molecular chain without sacrificing its resistance to heat or thermal shock and will not cause precipitation of any portion of the filler in the resin composition. This resin composition is useful in the making of cast insulators employed in electric machines.

    摘要翻译: 通过首先将100重量份环氧当量不大于200的环氧树脂与0.5-10重量份苯氧基树脂混合以制备均匀的混合物,然后将混合物与 固化剂(即多元羧酸和双酚A的缩合产物)和无机填料。 环氧树脂组合物在分子链内具有合适的刚度和柔软度,而不会牺牲其耐热或热冲击性,并且不会导致树脂组合物中任何部分填料的沉淀。 该树脂组合物可用于制造用于电机的铸造绝缘子。

    Molded products for high voltage apparatus comprising brominated epoxy
resins
    9.
    发明授权
    Molded products for high voltage apparatus comprising brominated epoxy resins 失效
    包含溴化环氧树脂的高压设备的成型产品

    公开(公告)号:US5880179A

    公开(公告)日:1999-03-09

    申请号:US774068

    申请日:1996-12-23

    摘要: "Molded products for high voltage apparatus comprising an" epoxy resin composition for molding comprising an epoxy resin (A), an acid anhydride (B), a curing accelerator (C), at least one coupling agent (D) and a filler (E). The epoxy resin (A) is a bifunctional brominated bisphenol A or a brominated bisphenol F, "epoxy resin and at least one bisphenol A, bisphenol F or bisphenol epoxy resin". The coupling agent (D) is selected from the group consisting of epoxysilane type coupling agents, phenylaminosilane type coupling agents, mercaptosilane type coupling agents and titanate type coupling agents, which has an average particle diameter of not more than 60 .mu.m and in which the content of particles having a diameter of not more than 5 .mu.m is not less than 5% by weight. The filler (E) comprises at least one of silica fillers or alumina fillers. The ratio of the number of acid anhydride groups of the acid anhydride (B) to the number of epoxy groups of the epoxy resin (A) is 0.5 to 1.5; the amount of the curing accelerator (C) is 0.5 to 10 parts by weight based on 100 parts by weight of the epoxy resin (A); the amount of the coupling agent (D) is 0.05 to 5 parts by weight based on 100 parts by weight of the filler (E); and the content of the filler (E) is 35 to 95% by weight of the resin composition. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and toughness, and excellent thermal resistance.

    摘要翻译: “包含环氧树脂(A),酸酐(B),固化促进剂(C),至少一种偶联剂(D)和填料(E))的成型用环氧树脂组合物的高压设备用成型体 )。 环氧树脂(A)是双官能溴化双酚A或溴化双酚F“环氧树脂和至少一种双酚A,双酚F或双酚环氧树脂”。 偶联剂(D)选自环氧硅烷型偶联剂,苯基氨基硅烷型偶联剂,巯基硅烷型偶联剂和钛酸酯型偶联剂,其平均粒径不大于60μm,其中 直径不大于5μm的颗粒的含量不小于5重量%。 填料(E)包括二氧化硅填料或氧化铝填料中的至少一种。 酸酐(B)的酸酐基与环氧树脂(A)的环氧基数的比例为0.5〜1.5; 相对于100重量份的环氧树脂(A),固化促进剂(C)的使用量为0.5〜10重量份。 相对于100重量份的填料(E),偶联剂(D)的量为0.05〜5重量份。 填料(E)的含量为树脂组合物的35〜95重量%。 环氧树脂组合物具有优异的机械强度和韧性等机械性能,耐热性优异。