摘要:
A film cartridge storage apparatus for storing a plurality of film cartridges 20 stacked one on another. The stored film cartridges 20 are extracted from the apparatus one after another from the lowermost cartridge in association with a pivotal member 83 of an individual feed mechanism 80; 18; 280 having a first arm portion 83a and a second arm portion 83b. The first arm portion 83a of the pivotal member 83 pivots between a first area and a second area to hold the lowermost film cartridge in the first area and also to feed the lowermost film cartridge in the second area. The second arm portion 83b of the pivotal member allows a film cartridge to fall toward the first arm portion in the first area and also prevents a film cartridge from falling toward the first arm portion in the second area. An elastic escape means 90; 190; 290 is provided for avoiding mutual interference between a film cartridge contacting the second arm portion and a pivotal locus of the second arm portion in the course of the pivotal movement of the second arm portion from the first area to the second area.
摘要:
A magnetic information recorder/reproducer can reduce the possibility of breakage of parts and thus lessen the need for maintenance. A resilient member for pressing a magnetic medium against a magnetic head has a resilient, hard guide layer provided on one side thereof facing the magnetic medium. The guide layer prevents the magnetic medium from coming into contact with the resilient member. The resilient member is thus less like to be broken or worn because it does not contact the magnetic medium.
摘要:
A semiconductor package that has a superior high frequency characteristics and that can obtain a large area for an internal wiring pattern is provided. According to the present invention, a semiconductor package includes: a multilayer printed wiring board 12, and an IC chip, mounted on the obverse face of the multilayer wiring board 12, and multiple bump terminals 16, mounted on the reverse face. Each bump terminal 16 includes an insulating core 42 having a flat face 40 and a conductive coating deposited on all external surfaces except that of the flat face 40. The end faces of the conductive coatings 44 appear like rings around the insulating cores 42, and are soldered to annular connection pads 52 formed on the reverse face of the multilayer printed wiring board 12. Vias 36 are arranged immediately above the bump terminals 16, and clearance holes 34, the diameter of which is smaller than the diameter of the bump terminals 16, are formed in internal wiring patterns 28 and 30 to permit the passage of the vias 36.
摘要:
A semiconductor package that has a superior high frequency characteristics and that can obtain a large area for an internal wiring pattern is provided. According to the present invention, a semiconductor package includes: a multilayer printed wiring board 12, and an IC chip, mounted on the obverse face of the multilayer wiring board 12, and multiple bump terminals 16, mounted on the reverse face. Each bump terminal 16 includes an insulating core 42 having a flat face 40 and a conductive coating deposited on all external surfaces except that of the flat face 40. The end faces of the conductive coatings 44 appear like rings around the insulating cores 42, and are soldered to annular connection pads 52 formed on the reverse face of the multilayer printed wiring board 12. Vias 36 are arranged immediately above the bump terminals 16, and clearance holes 34, the diameter of which is smaller than the diameter of the bump terminals 16, are formed in internal wiring patterns 28 and 30 to permit the passage of the vias 36.
摘要:
A photographic printing apparatus can process any of a roll of films, a strip of film and a film in a cartridge. A feed speed adjusting unit is provided between a scanner unit and a printing/exposure unit. A cartridge supply unit is provided upstream of the scanner unit and upstream of the printing/exposure unit. A strip of film is fed by a film carrier and a cartridge film is fed by a feed roller of a cartridge holder.
摘要:
A carrier device can receive cartridges each containing a film from a lateral direction and send them reliably, efficiently and continuously to a photoprinting machine in a straight line, while holding them in position with an arm. Cartridges are supplied one by one into the carrier device from a cartridge housing device located at the side of the carrier device. A cartridge set in a carriage or the carrier device is retained in position by the arms and transferred to the printing machine by driving the carriage with a motor of a driving unit along a guide path. The carriage has a cartridge retaining mechanism and an arm locking mechanism.
摘要:
A semiconductor package that has a superior high frequency characteristics and that can obtain a large area for an internal wiring pattern is provided. According to the present invention, a semiconductor package includes: a multilayer printed wiring board 12, and an IC chip, mounted on the obverse face of the multilayer wiring board 12, and multiple bump terminals 16, mounted on the reverse face. Each bump terminal 16 includes an insulating core 42 having a flat face 40 and a conductive coating deposited on all external surfaces except that of the flat face 40. The end faces of the conductive coatings 44 appear like rings around the insulating cores 42, and are soldered to annular connection pads 52 formed on the reverse face of the multilayer printed wiring board 12. Vias 36 are arranged immediately above the bump terminals 16, and clearance holes 34, the diameter of which is smaller than the diameter of the bump terminals 16, are formed in internal wiring patterns 28 and 30 to permit the passage of the vias 36.
摘要:
A method of cleaning a film transport unit (5), in which a cleaning leader (80) formed of a synthetic fiber (81) hardened with a resin (82) is transported through a transport path of the film transport unit, and the cleaning leader (80) removes substances adhering to a magnetic head (32a) disposed in the transport path, with said cleaning leader. Preferably, the synthetic fiber is hardened by being impregnated with a resin (82) selected from urethane resin, acrylic resin and silicone resin. Preferably, the cleaning leader (80) is elongated to be an identical or similar shape to a film (2) transported through the film transport unit (5). At least a leading end of the cleaning leader is hardened.
摘要:
To provide a semiconductor module, a terminal strip, a method for manufacturing the terminal strip, and a method for manufacturing the semiconductor module in which loop inductance is decreased.A terminal strip includes a grounding (GND) conductor, power supply (VDD) conductors, signal line conductors, and insulators. The insulators intervene between the GND conductor and the VDD conductors. Similarly, the insulators intervene between the GND conductor and the signal line conductors. In the terminal strip, since the GND conductor and the VDD conductors are disposed close to each other, mutual inductance between GND wiring and VDD wiring can be increased. Thus, loop inductance can be decreased.
摘要:
A photographic film processing apparatus for processing long developed film (10b) formed by joining photographic films with a splicing material (13). The apparatus includes a first transport device (40a) for transporting the long developed film. A region of the splicing material in the long developed film is detected in order to cut the long film. A main cutter (60) cuts the long developed film transported by the first transport device, in the region of the splicing material into short films (10a) prior to an exposing process. A second transport device (40b) is provided for transporting the short films to exposure processing units (20, 30). Further, an auxiliary cutter (70) is provided for cutting lateral portions of the region of the splicing material in the long developed film. The region of the splicing material is cut such that a width of an upstream short film is contained within a width at a forward end of a downstream short film.