Stacked photoelectric converter
    1.
    发明授权
    Stacked photoelectric converter 有权
    堆叠光电转换器

    公开(公告)号:US07550665B2

    公开(公告)日:2009-06-23

    申请号:US10530283

    申请日:2004-07-15

    IPC分类号: H01L31/00 H02N6/00

    摘要: In a stacked-layer type photoelectric conversion device, a plurality of photoelectric conversion units are stacked on a substrate, each of which includes a one conductivity-type layer, a photoelectric conversion layer of substantially intrinsic semiconductor and an opposite conductivity-type layer in this order from a light-incident side. At least one of the opposite conductivity-type layer in a front photoelectric conversion unit arranged relatively closer to the light-incident side and the one conductivity-type layer in a back photoelectric conversion unit arranged adjacent to the front photoelectric conversion unit includes a silicon composite layer at least in a part thereof. The silicon composite layer has a thickness of more than 20 nm and less than 130 nm and an oxygen concentration of more than 25 atomic % and less than 60 atomic %, and includes silicon-rich phase parts in an amorphous alloy phase of silicon and oxygen.

    摘要翻译: 在堆叠层型光电转换装置中,在基板上层叠多个光电转换单元,每个基板包括一个导电型层,本质上为半导体的光电转换层和相反的导电型层 从光线一方的命令。 在与前光电转换单元相邻布置的背光电转换单元中相对靠近光入射侧的前光电转换单元中的至少一个导电类型层和一个导电型层中的至少一个包括硅复合物 至少在其一部分。 硅复合层的厚度大于20nm且小于130nm,氧浓度大于25原子%且小于60原子%,并且包括在硅和氧的非晶合金相中的富硅相部分 。

    Stacked photoelectric converter
    2.
    发明申请

    公开(公告)号:US20060043517A1

    公开(公告)日:2006-03-02

    申请号:US10530283

    申请日:2004-07-15

    IPC分类号: H01L31/105

    摘要: In a stacked-layer type photoelectric conversion device, a plurality of photoelectric conversion units are stacked on a substrate, each of which includes a one conductivity-type layer, a photoelectric conversion layer of substantially intrinsic semiconductor and an opposite conductivity-type layer in this order from a light-incident side. At least one of the opposite conductivity-type layer in a front photoelectric conversion unit arranged relatively closer to the light-incident side and the one conductivity-type layer in a back photoelectric conversion unit arranged adjacent to the front photoelectric conversion unit includes a silicon composite layer at least in a part thereof. The silicon composite layer has a thickness of more than 20 nm and less than 130 nm and an oxygen concentration of more than 25 atomic % and less than 60 atomic %, and includes silicon-rich phase parts in an amorphous alloy phase of silicon and oxygen.

    Method for manufacturing photoelectric conversion device
    4.
    发明授权
    Method for manufacturing photoelectric conversion device 有权
    制造光电转换装置的方法

    公开(公告)号:US08691613B2

    公开(公告)日:2014-04-08

    申请号:US13877148

    申请日:2011-08-31

    IPC分类号: H01L21/00

    摘要: A crystalline-based silicon photoelectric conversion device comprises: an intrinsic silicon-based layer and a silicon-based layer of a first conductivity type, on one surface of a single-crystal silicon substrate of the first conductivity type; and an intrinsic silicon-based and a silicon-based layer of an opposite conductivity type, in this order on the other surface of the silicon substrate. At least one of forming the intrinsic silicon-based layer of the first conductivity type layer-side forming the intrinsic silicon-based layer of the opposite conductivity type layer-side includes: forming a first intrinsic silicon-based thin-film layer having a thickness of 1-10 nm on the silicon substrate; plasma-treating the silicon substrate in a gas containing mainly hydrogen; and forming a second intrinsic silicon-based thin-film layer on the first intrinsic silicon-based thin-film.

    摘要翻译: 晶体硅光电转换装置包括:在第一导电类型的单晶硅衬底的一个表面上的本征硅基层和第一导电类型的硅基层; 以及相反导电类型的本征硅基和硅基层,依次在硅衬底的另一表面上。 形成形成相反导电型层侧的本征硅基层的第一导电型层侧的本征硅基层中的至少一个包括:形成具有厚度的第一本征硅基薄膜层 在硅衬底上为1-10nm; 在主要包含氢气的气体中等离子体处理硅衬底; 以及在所述第一本征硅基薄膜上形成第二本征硅基薄膜层。

    METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE
    5.
    发明申请
    METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE 有权
    制造光电转换装置的方法

    公开(公告)号:US20130210185A1

    公开(公告)日:2013-08-15

    申请号:US13877148

    申请日:2011-08-31

    IPC分类号: H01L31/18

    摘要: A crystalline-based silicon photoelectric conversion device comprises: an intrinsic silicon-based layer and a silicon-based layer of a first conductivity type, on one surface of a single-crystal silicon substrate of the first conductivity type; and an intrinsic silicon-based and a silicon-based layer of an opposite conductivity type, in this order on the other surface of the silicon substrate. At least one of forming the intrinsic silicon-based layer of the first conductivity type layer-side forming the intrinsic silicon-based layer of the opposite conductivity type layer-side includes: forming a first intrinsic silicon-based thin-film layer having a thickness of 1-10 nm on the silicon substrate; plasma-treating the silicon substrate in a gas containing mainly hydrogen; and forming a second intrinsic silicon-based thin-film layer on the first intrinsic silicon-based thin-film.

    摘要翻译: 晶体硅光电转换装置包括:在第一导电类型的单晶硅衬底的一个表面上的本征硅基层和第一导电类型的硅基层; 以及相反导电类型的本征硅基和硅基层,依次在硅衬底的另一表面上。 形成形成相反导电型层侧的本征硅基层的第一导电型层侧的本征硅基层中的至少一个包括:形成具有厚度的第一本征硅基薄膜层 在硅衬底上为1-10nm; 在主要包含氢气的气体中等离子体处理硅衬底; 以及在所述第一本征硅基薄膜上形成第二本征硅基薄膜层。

    Thin-film photoelectric converter
    6.
    发明申请
    Thin-film photoelectric converter 有权
    薄膜光电转换器

    公开(公告)号:US20060097259A1

    公开(公告)日:2006-05-11

    申请号:US10543516

    申请日:2004-05-28

    IPC分类号: H01L29/76 H01L29/10

    摘要: A thin film photoelectric converter, especially an integrated thin film photoelectric converter having improved photoelectric conversion efficiency is provided by controlling an open-circuit voltage and a fill factor so as not be small in a thin film photoelectric converter including a crystalline silicon photoelectric conversion unit. The thin film photoelectric converter by the present invention has at least a transparent electrode film, a crystalline silicon photoelectric conversion unit, and a back electrode film formed sequentially on one principal surface of a transparent substrate, and the converter has a whitish discoloring area on a part of a surface of the converter after formation of the crystalline silicon photoelectric conversion unit. A percentage of dimensions of the whitish discoloring area preferably is not more than 5% of a dimension of the photoelectric conversion area. A thin film photoelectric converter of the present invention is preferably an integrated thin film photoelectric converter.

    摘要翻译: 通过在包括晶体硅光电转换单元的薄膜光电转换器中控制开路电压和填充因子以不小而提供薄膜光电转换器,特别是具有改进的光电转换效率的集成薄膜光电转换器。 本发明的薄膜光电转换器至少在透明基板的一个主表面上依次形成透明电极膜,晶体硅光电转换单元和背面电极膜,并且转换器具有白色变色区域 形成晶体硅光电转换单元后的转换器表面的一部分。 白色变色区域的尺寸的百分比优选不大于光电转换区域的尺寸的5%。 本发明的薄膜光电转换器优选为集成薄膜光电转换器。

    Thin-film photoelectric converter
    7.
    发明授权
    Thin-film photoelectric converter 有权
    薄膜光电转换器

    公开(公告)号:US07678992B2

    公开(公告)日:2010-03-16

    申请号:US10543516

    申请日:2004-05-28

    IPC分类号: H01L31/00

    摘要: A thin film photoelectric converter, especially an integrated thin film photoelectric converter having improved photoelectric conversion efficiency is provided by controlling an open-circuit voltage and a fill factor so as not be small in a thin film photoelectric converter including a crystalline silicon photoelectric conversion unit. The thin film photoelectric converter by the present invention has at least a transparent electrode film, a crystalline silicon photoelectric conversion unit, and a back electrode film formed sequentially on one principal surface of a transparent substrate, and the converter has a whitish discoloring area on a part of a surface of the converter after formation of the crystalline silicon photoelectric conversion unit. A percentage of dimensions of the whitish discoloring area preferably is not more than 5% of a dimension of the photoelectric conversion area. A thin film photoelectric converter of the present invention is preferably an integrated thin film photoelectric converter.

    摘要翻译: 通过在包括晶体硅光电转换单元的薄膜光电转换器中控制开路电压和填充因子以不小而提供薄膜光电转换器,特别是具有改进的光电转换效率的集成薄膜光电转换器。 本发明的薄膜光电转换器至少在透明基板的一个主表面上依次形成透明电极膜,晶体硅光电转换单元和背面电极膜,并且转换器具有白色变色区域 形成晶体硅光电转换单元后的转换器表面的一部分。 白色变色区域的尺寸的百分比优选不大于光电转换区域的尺寸的5%。 本发明的薄膜光电转换器优选为集成薄膜光电转换器。

    Method for manufacturing thin film photovoltaic device
    9.
    发明授权
    Method for manufacturing thin film photovoltaic device 有权
    制造薄膜光伏器件的方法

    公开(公告)号:US06187150B1

    公开(公告)日:2001-02-13

    申请号:US09414092

    申请日:1999-10-07

    IPC分类号: C23C1408

    摘要: A method for manufacturing a thin film photovoltaic device comprising a transparent conductive film, a thin film photovoltaic unit, and a back transparent conductive film and a back metal electrode which are successively formed on a substrate, wherein the back transparent conductive film is formed by sputtering comprising steps of forming an initial back transparent conductive film under a pressure of 5×10−2 Torr or more for 1 to 30 seconds in the initial stage and forming a main back transparent conductive film having the remainder thickness under a pressure reduced to {fraction (1/10)} the initial pressure or less.

    摘要翻译: 一种薄膜光伏器件的制造方法,其特征在于,在基板上依次形成有透明导电膜,薄膜光电单元,背面透明导电膜和背面金属电极,其中,所述背面透明导电膜通过溅射形成 包括在初始阶段在5×10 -2 Torr以上的压力下形成初始背面透明导电膜1〜30秒的步骤,并且在压力降低到{部分(1)的情况下形成剩余厚度的主背面透明导电膜 / 10)}初始压力或更小。