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1.发明申请Pretreating Agent For Electroless Plating, Method Of Electroless Plating Using The Same And Product Of Electroless Plating 有权化学镀预处理剂，使用该化学镀的无电镀方法和无电解电镀产品公开(公告)号：US20080014362A1
公开(公告)日：2008-01-17
申请号：US10586379
申请日：2004-11-11
申请人： Toshifumi Kawamura , Jun Suzuki , Toru Imori
发明人： Toshifumi Kawamura , Jun Suzuki , Toru Imori
IPC分类号： C23C18/18
CPC分类号： C23C18/31 , C23C18/1651 , C23C18/1879 , C23C18/1882 , C23C18/2066 , C23C18/30
摘要： The object of the present invention is to provide a pretreating agent for electroless plating that is stable and soluble in organic solvents, a method of electroless plating with excellent adhesiveness using it and an electroless plated product. An object to be plated is pre-treated using a pretreating agent for electroless plating comprising a noble metal soap of a fatty acid having 5 to 25 carbon atoms or preferably using a pretreating agent for electroless plating additionally comprising an imidazole silane coupling agent or other silane coupling agent having metal capturing ability, and then electroless plated. The noble metal soap is preferably a palladium soap.
摘要翻译： 本发明的目的是提供一种稳定且可溶于有机溶剂的化学镀的预处理剂，使用它的具有优异粘合性的无电电镀方法和无电镀产品。 使用包含具有5〜25个碳原子的脂肪酸的贵金属皂或优选使用还含有咪唑硅烷偶联剂或其它硅烷的化学镀的预处理剂的化学镀预处理剂进行预镀处理 具有金属捕获能力的偶联剂，然后进行无电镀。 贵金属皂优选为钯皂。
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2.发明授权公开(公告)号：US07713340B2
公开(公告)日：2010-05-11
申请号：US10586379
申请日：2004-11-11
申请人： Toshifumi Kawamura , Jun Suzuki , Toru Imori
发明人： Toshifumi Kawamura , Jun Suzuki , Toru Imori
IPC分类号： C23C18/28
CPC分类号： C23C18/31 , C23C18/1651 , C23C18/1879 , C23C18/1882 , C23C18/2066 , C23C18/30
摘要： The object of the present invention is to provide a pretreating agent for electroless plating that is stable and soluble in organic solvents, a method of electroless plating with excellent adhesiveness using it and an electroless plated product. An object to be plated is pre-treated using a pretreating agent for electroless plating comprising a noble metal soap of naphthenic acid or a fatty acid having 5 to 25 carbon atoms or preferably using a pretreating agent for electroless plating additionally comprising an imidazole silane coupling agent or other silane coupling agent having metal capturing ability, and then electroless plated. The noble metal soap is preferably a palladium soap.
摘要翻译： 本发明的目的是提供一种稳定且可溶于有机溶剂的化学镀的预处理剂，使用它的具有优异粘合性的无电电镀方法和无电镀产品。 使用包含环烷酸的贵金属皂或碳原子数5〜25的脂肪酸的贵金属皂进行化学镀的预处理剂进行预镀处理，优选使用还含有咪唑硅烷偶联剂的化学镀的预处理剂 或具有金属捕获能力的其它硅烷偶联剂，然后进行无电镀。 贵金属皂优选为钯皂。
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3.发明申请Electroless Plating Pretreatment Agent and Copper-Clad Laminate for Flexible Substrate 审中-公开用于柔性基板的化学镀层预处理剂和铜包层压板公开(公告)号：US20070269680A1
公开(公告)日：2007-11-22
申请号：US11662046
申请日：2005-08-22
申请人： Toshifumi Kawamura , Toru Imori
发明人： Toshifumi Kawamura , Toru Imori
CPC分类号： H05K3/389 , C23C18/1653 , C23C18/208 , C23C18/2086 , C23C18/30 , C23C18/38 , H05K1/0393 , H05K3/181 , H05K3/387 , Y10T428/12903
摘要： Provided are an electroless plating pretreatment liquid used in a copper-clad laminate for a flexible substrate whose initial adhesive force between the substrate material and copper plating layer in an ordinary state as well as the adhesive force in a peel test after aging (in the atmosphere at 150° C. for 168 hours) are at least 0.4 kgf/cm, and a copper-clad laminate for a flexible substrate produced using same. The electroless plating pretreatment agent used in a substrate material of a copper-clad laminate for a flexible substrate comprising a thermoset resin and a silane coupling agent having a metal capturing capability. The copper-clad laminate for a flexible substrate wherein a substrate material is treated with the electroless plating pretreatment agent, a copper plating layer is then formed by electroless plating, and a copper plating layer is formed thereon by electroplating.
摘要翻译： 提供一种用于柔性基板的覆铜层压板中的化学镀预处理液体，其在通常状态下的基板材料和镀铜层之间的初始粘合力以及老化后的剥离试验中的粘合力（在大气中 在150℃下进行168小时）为至少0.4kgf / cm，以及使用其制造的用于柔性基板的覆铜层压板。 用于柔性基材的覆铜层压板的基板材料中的无电镀预处理剂，其包含热固性树脂和具有金属捕获能力的硅烷偶联剂。 用无电镀处理剂处理基板材料的柔性基板用覆铜层压板，然后通过无电解电镀形成铜镀层，通过电镀在其上形成镀铜层。
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4.发明授权公开(公告)号：US08043705B2
公开(公告)日：2011-10-25
申请号：US11795355
申请日：2006-02-27
申请人： Toshifumi Kawamura , Toru Imori
发明人： Toshifumi Kawamura , Toru Imori
CPC分类号： C23C18/2066 , C23C18/30 , C23C18/31 , C23C18/40 , H05K3/181 , H05K3/389 , H05K3/4661 , Y10T428/31511 , Y10T428/31522 , Y10T428/31529 , Y10T428/31663 , Y10T428/31678 , Y10T428/31721
摘要： There is provided a technology that can be applied as a substrate material to ordinary resin substrate materials and allows the adhesive strength between this substrate material and a plating metal layer to be increased; more specifically, there is provided an ordinary resin substrate material with an increased adhesive strength between the substrate material and a plating metal layer. The present invention relates to a resin substrate material such as an epoxy resin whose surface is swellable in a solution containing imidazolesilane and a palladium or other noble metal compound having a catalytic action in electroless plating and which has been surface-treated with the solution, and to an electronic component substrate material manufactured by performing electroless plating on this resin substrate material.
摘要翻译： 提供了可用作普通树脂基板材料的基板材料的技术，并且允许该基板材料和电镀金属层之间的粘合强度增加; 更具体地，提供了在基板材料和电镀金属层之间具有增加的粘合强度的普通树脂基板材料。 本发明涉及一种树脂基板材料，例如环氧树脂，其表面在包含咪唑烷的溶液中可膨胀，并且具有在化学镀中具有催化作用的钯或其它贵金属化合物，并且已经用溶液进行了表面处理， 涉及通过在该树脂基板材料上进行无电解电镀制造的电子部件基板材料。
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5.发明申请公开(公告)号：US20080138629A1
公开(公告)日：2008-06-12
申请号：US11795355
申请日：2006-02-27
申请人： Toshifumi Kawamura , Toru Imori
发明人： Toshifumi Kawamura , Toru Imori
CPC分类号： C23C18/2066 , C23C18/30 , C23C18/31 , C23C18/40 , H05K3/181 , H05K3/389 , H05K3/4661 , Y10T428/31511 , Y10T428/31522 , Y10T428/31529 , Y10T428/31663 , Y10T428/31678 , Y10T428/31721
摘要： There is provided a technology that can be applied as a substrate material to ordinary resin substrate materials and allows the adhesive strength between this substrate material and a plating metal layer to be increased; more specifically, there is provided an ordinary resin substrate material with an increased adhesive strength between the substrate material and a plating metal layer. The present invention relates to a resin substrate material such as an epoxy resin whose surface is swellable in a solution containing imidazolesilane and a palladium or other noble metal compound having a catalytic action in electroless plating and which has been surface-treated with the solution, and to an electronic component substrate material manufactured by performing electroless plating on this resin substrate material.
摘要翻译： 提供了可用作普通树脂基板材料的基板材料的技术，并且允许该基板材料和电镀金属层之间的粘合强度增加; 更具体地，提供了在基板材料和电镀金属层之间具有增加的粘合强度的普通树脂基板材料。 本发明涉及一种树脂基板材料，例如环氧树脂，其表面在包含咪唑烷的溶液中可膨胀，并且具有在化学镀中具有催化作用的钯或其它贵金属化合物，并且已经用溶液进行了表面处理， 涉及通过在该树脂基板材料上进行无电解电镀制造的电子部件基板材料。
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公开(公告)号：US20070120880A1
公开(公告)日：2007-05-31
申请号：US10576658
申请日：2004-10-22
申请人： Toshifumi Kawamura , Toru Imori
发明人： Toshifumi Kawamura , Toru Imori
CPC分类号： C09D11/38 , H05K1/097 , H05K3/125 , H05K3/182 , H05K2201/0239 , H05K2203/013 , H05K2203/124
摘要： An object is to provide an inkjet ink composition to uniformly form a wiring pattern having excellent adhesion on a substrate, and to provide a method to form a wiring pattern by using this ink composition. This ink composition is an inkjet ink composition for drawing a wiring pattern on a substrate, the ink composition comprising an azole-based silane coupling agent as coupling agent for an activator.
摘要翻译： 目的是提供一种喷墨油墨组合物以均匀地形成在基材上具有优异粘合性的布线图案，并提供通过使用该油墨组合物形成布线图案的方法。 该油墨组合物是用于在基材上拉伸布线图案的喷墨油墨组合物，该油墨组合物包含作为活化剂偶联剂的唑类硅烷偶联剂。
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7.发明授权公开(公告)号：US08814997B2
公开(公告)日：2014-08-26
申请号：US13501139
申请日：2011-03-14
申请人： Toru Imori , Jun Suzuki , Ryu Murakami , Akihiro Aiba , Junichi Ito
发明人： Toru Imori , Jun Suzuki , Ryu Murakami , Akihiro Aiba , Junichi Ito
CPC分类号： C23C18/1608 , C23C18/1635 , C23C18/1879 , C23C18/1882 , C23C18/2066 , C23C18/30
摘要： An electroless plating pretreatment agent that can retain stably Pd(II) over a long period of time in an organic solvent, an electroless plating method using the same that is capable of forming an electroless plated film having excellent adhesion, and an electroless plated object. The electroless plating pretreatment agent contains an organic palladium compound and a coordination compound having a functional group with a metal-capturing capability dissolved in an organic solvent, the coordination compound being selected from the group consisting of the imidazole analogs, polyethyleneamines, ethyleneimines and polyethyleneimines.
摘要翻译： 一种能够在有机溶剂中长时间稳定地保持Pd（II）的化学镀预处理剂，使用该化学镀方法能够形成具有优异粘接性的无电解电镀膜的化学镀方法，以及无电电镀对象。 化学镀预处理剂含有有机钯化合物和具有溶解在有机溶剂中的具有金属捕获能力的官能团的配位化合物，配位化合物选自咪唑类似物，聚乙烯胺，乙烯亚胺和聚乙烯亚胺。
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公开(公告)号：US20080023669A1
公开(公告)日：2008-01-31
申请号：US11629948
申请日：2005-06-15
申请人： Toru Imori , Jun Suzuki , Kazunori Iida
发明人： Toru Imori , Jun Suzuki , Kazunori Iida
CPC分类号： D07B1/0666 , C08K5/16 , C09D4/00 , C09D7/63 , C09D183/08 , C23C2222/20 , C08G77/26
摘要： A surface treatment agent for metal is provided which is capable of improving the strength of adhesion between metal and rubber. A metal surface treatment agent for promoting adhesion between the metal and rubber comprising a cobalt or other metal compound and a silane coupling agent having a metal-capturing functional group in the molecule, and a metal surface treatment agent for promoting adhesion between the metal and rubber comprising a silane coupling agent having in the molecule a metal-capturing functional group with a captured metal such as a cobalt. The metal-capturing functional group is preferably an amino, amide or azole group.
摘要翻译： 提供了一种能够提高金属与橡胶之间的粘合强度的金属表面处理剂。 一种金属表面处理剂，用于促进包含钴或其它金属化合物的金属和橡胶之间的粘合性和在分子中具有金属捕获官能团的硅烷偶联剂，以及金属表面处理剂，用于促进金属和橡胶之间的粘合 包括在分子中具有捕获金属如钴的金属捕获官能团的硅烷偶联剂。 金属捕获官能团优选为氨基，酰胺或唑基。
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9.发明申请ELECTROLESS PLATING PRETREATMENT AGENT, ELECTROLESS PLATING METHOD USING SAME, AND ELECTROLESS PLATED OBJECT 有权电镀镀层预处理剂，使用同样方法的电镀法和电镀物体公开(公告)号：US20120192758A1
公开(公告)日：2012-08-02
申请号：US13501139
申请日：2011-03-14
申请人： Toru Imori , Jun Suzuki , Ryu Murakami , Akihiro Aiba , Junichi Ito
发明人： Toru Imori , Jun Suzuki , Ryu Murakami , Akihiro Aiba , Junichi Ito
CPC分类号： C23C18/1608 , C23C18/1635 , C23C18/1879 , C23C18/1882 , C23C18/2066 , C23C18/30
摘要： It is an object of the present invention to provide an electroless plating pretreatment agent that can retain stably Pd(II) over a long period of time in an organic solvent, an electroless plating method using the same that is capable of forming an electroless plated film having excellent adhesion, and an electroless plated object. The object is achieved by an electroless plating pretreatment agent comprising an organic palladium compound and a coordination compound having a functional group with a metal-capturing capability dissolved in an organic solvent, the coordination compound being selected from the group consisting of the imidazole analogs, polyethyleneamines, ethyleneimines and polyethyleneimines.
摘要翻译： 本发明的目的是提供一种能够在有机溶剂中长期保持Pd（II）的化学镀预处理剂，使用该化学镀处理能够形成无电镀膜的化学镀方法 具有优异的粘附性，以及无电镀物。 该目的是通过包含有机钯化合物和具有溶解在有机溶剂中的具有金属捕获能力的官能团的配位化合物的化学镀预处理剂来实现的，该配位化合物选自咪唑类似物，聚乙烯胺 ，乙烯亚胺和聚乙烯亚胺。
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公开(公告)号：US08736057B2
公开(公告)日：2014-05-27
申请号：US12734560
申请日：2008-11-26
申请人： Junichi Ito , Atsushi Yabe , Junnosuke Sekiguchi , Toru Imori
发明人： Junichi Ito , Atsushi Yabe , Junnosuke Sekiguchi , Toru Imori
CPC分类号： H01L21/288 , C23C14/0036 , C23C14/165 , C23C18/1601 , C23C18/1637 , C23C18/165 , C23C18/1653 , C23C18/40 , C23C18/54 , H01L21/2855 , H01L21/76843 , H01L21/76874 , H01L23/53238 , H01L2221/1089 , H01L2924/0002 , H01L2924/00
摘要： A substrate having, on a base material, a barrier film for preventing copper diffusion containing one or more metal elements selected from tungsten, molybdenum and niobium, a metal element having a catalytic function in electroless plating such as platinum, gold, silver and palladium, and nitrogen contained in the form of a nitride of the aforementioned one or more metal elements selected from tungsten, molybdenum and niobium. The barrier film for preventing copper diffusion is manufactured by sputtering in a nitrogen atmosphere using a target containing one or more metal elements selected from tungsten, molybdenum and niobium and the aforementioned metal element having a catalytic function in electroless plating.
摘要翻译： 在基材上具有防止含有选自钨，钼，铌中的一种以上的金属元素的铜扩散用阻挡膜的基板，具有铂，金，银，钯等无电镀的催化功能的金属元素， 以及选自钨，钼和铌的上述一种或多种金属元素的氮化物形式的氮。 通过使用含有选自钨，钼和铌中的一种或多种金属元素的靶和在化学镀中具有催化功能的上述金属元素在氮气气氛中溅射来制造防止铜扩散的阻挡膜。
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