公开(公告)号：US06833582B2

公开(公告)日：2004-12-21

申请号：US10766188

申请日：2004-01-29

申请人： Toshiyuki Mine ,  Takashi Hashimoto ,  Senichi Nishibe ,  Nozomu Matsuzaki ,  Hitoshi Kume ,  Jiro Yugami

发明人： Toshiyuki Mine ,  Takashi Hashimoto ,  Senichi Nishibe ,  Nozomu Matsuzaki ,  Hitoshi Kume ,  Jiro Yugami

IPC分类号： H01L29792

CPC分类号： H01L29/66833 ,  G11C16/0466 ,  H01L21/28282 ,  H01L29/792

摘要： A nonvolatile semiconductor memory device configured by a select MOS transistor provided with a gate insulator film and a select gate electrode, as well as a memory MOS transistor provided with a capacitor insulator film comprising a lower potential barrier film, a charge trapping film, and an upper potential barrier film, as well as a memory gate electrode. The charge trapping film is formed with a silicon oxynitride film and the upper potential barrier film is omitted or its thickness is limited to 1 nm and under to prevent the Gm degradation to be caused by the silicon oxynitride film, thereby lowering the erasure gate voltage. The charge trapping film is formed with a silicon oxynitride film used as a main charge trapping film and a silicon nitride film formed on or beneath the silicon oxynitride film so as to form a potential barrier effective only for holes. And, a hot-hole erasing method is employed to lower the erasure voltage.

公开(公告)号：US06657248B1

公开(公告)日：2003-12-02

申请号：US09432460

申请日：1999-11-02

申请人： Nozomu Matsuzaki ,  Takashi Kobayashi ,  Hitoshi Kume ,  Toshiyuki Mine ,  Kikuo Kusukawa ,  Norio Suzuki ,  Kenji Takahashi ,  Toshiaki Nishimoto ,  Masataka Kato

发明人： Nozomu Matsuzaki ,  Takashi Kobayashi ,  Hitoshi Kume ,  Toshiyuki Mine ,  Kikuo Kusukawa ,  Norio Suzuki ,  Kenji Takahashi ,  Toshiaki Nishimoto ,  Masataka Kato

IPC分类号： H01L27108

CPC分类号： H01L27/105 ,  H01L27/10897

摘要： There was a problem that sharpening of a substrate and localized increase in the thickness of a gate oxide film become more remarkable as the thickness of the gate oxide film is increased to degrade the gate withstand voltage at the surface edge of shallow groove isolation structure. In the present invention, a bird's beak is disposed at the surface edge of a shallow isolation structure GROX11 just below gate electrode POLY11 and in contact with the gate insulation film HOX1 to form the gate insulation film HOX1 previously. This can ensure normal gate withstand voltage of the MOS transistor and favorable device isolation withstand voltage and increased integration degree simultaneously.

摘要翻译： 存在栅极氧化膜的厚度增加以使栅极氧化膜的厚度急剧增加并且栅极氧化膜的厚度局部增加以降低浅沟槽隔离结构的表面边缘处的栅极耐受电压的问题。 在本发明中，将鸟嘴设置在正好位于栅电极POLY11正下方的浅隔离结构GROX11的表面边缘处，并且与栅极绝缘膜HOX1接触以预先形成栅极绝缘膜HOX1。 这可以确保MOS晶体管的正常栅极耐受电压，并且同时具有良好的器件隔离耐受电压和增加的积分度。

公开(公告)号：US07130223B2

公开(公告)日：2006-10-31

申请号：US11251963

申请日：2005-10-18

申请人： Tetsuya Ishimaru ,  Nozomu Matsuzaki ,  Hitoshi Kume

发明人： Tetsuya Ishimaru ,  Nozomu Matsuzaki ,  Hitoshi Kume

IPC分类号： G11C11/34

CPC分类号： G11C16/0433 ,  G11C16/0466 ,  G11C16/10 ,  G11C16/14 ,  H01L27/11568 ,  H01L29/513 ,  H01L29/518 ,  H01L29/792

摘要： Characteristics of a nonvolatile semiconductor memory device are improved. The memory cell comprises: an ONO film constituted by a silicon nitride film SIN for accumulating charge and by oxide films BOTOX and TOPOX disposed thereon and thereunder; a memory gate electrode MG disposed at an upper portion thereof; a select gate electrode SG disposed at a side portion thereof through the ONO film; a gate oxide film SGOX disposed thereunder. By applying a potential to a select gate electrode SG of a memory cell having a source region MS and a drain region MD and to the source region MS and by accelerating electrons flowing in a channel through a high electric field produced between a channel end of the select transistor and an end of an n-type doped region ME disposed under the memory gate electrode MG, hot holes are generated by impact ionization, and the hot holes are injected into a silicon nitride film SIN by a negative potential applied to the memory gate electrode MG, and thereby an erase operation is performed.

摘要翻译： 提高了非易失性半导体存储器件的特性。 存储单元包括：由用于累积电荷的氮化硅膜SIN和其上设置的氧化膜BOTOX和TOPOX构成的ONO膜; 设置在其上部的存储栅极电极MG; 通过ONO膜设置在其侧部的选择栅电极SG; 设置在其下方的栅氧化膜SGOX。 通过向具有源极区域MS和漏极区域MD的存储单元的选择栅极SG施加电位，并且通过在通道的沟道端之间产生的高电场加速在沟道中流动的电子， 选择晶体管和设置在存储栅电极MG下方的n型掺杂区ME的端部，通过冲击电离产生热孔，并且通过施加到存储栅的负电位将热孔注入氮化硅膜SIN 电极MG，从而进行擦除操作。

公开(公告)号：US06617632B2

公开(公告)日：2003-09-09

申请号：US10005300

申请日：2001-12-07

申请人： Yasuhiro Taniguchi ,  Kazuyoshi Shiba ,  Nozomu Matsuzaki ,  Hidenori Takada ,  Hitoshi Kume ,  Shoji Shukuri

发明人： Yasuhiro Taniguchi ,  Kazuyoshi Shiba ,  Nozomu Matsuzaki ,  Hidenori Takada ,  Hitoshi Kume ,  Shoji Shukuri

IPC分类号： H01L27108

CPC分类号： H01L27/11526 ,  G11C16/10 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11546

摘要： A parallel connection-type nonvolatile memory semiconductor device comprises a plurality of memory cells disposed on a semiconductor substrate in matrix form, each including a gate insulating film, a floating gate electrode, an interlayer film and a control gate electrode successively formed so as to cover a channel region on a main surface of the semiconductor substrate, of a first conductivity type; a second conductivity type source and drain regions formed on the semiconductor substrate on both sides opposite to each other, of the floating gate electrode so as to interpose a channel region located under the floating gate electrode therebetween; a first semiconductor region which is adjacent to the drain region and formed by introducing a second conductivity type impurity in the direction of the channel region placed under the floating gate electrode from an end on the drain side, of the floating gate electrode, and which is substantially lower than the drain region in impurity concentration; and a punch-through stopper layer which is adjacent to the first semiconductor region and formed by introducing a first conductivity type impurity in the direction of the channel region placed under the floating gate electrode from an end on the drain side, of the floating gate electrode, and which is substantially higher than the channel region in impurity concentration, and wherein the source regions and drain regions of the plurality of nonvolatile memory cells are parallel-connected to one another in respective columns, word lines some of which constitute the control gate electrodes of the plurality of nonvolatile memory cells, extend in respective rows, a voltage is applied to at least one word line, which is set so as to serve as a selected word line, and when carriers are stored in a floating gate electrode of each selected memory cell, a negative voltage is applied to other non-selected word lines other than the selected word line.

公开(公告)号：US07692234B2

公开(公告)日：2010-04-06

申请号：US11862928

申请日：2007-09-27

申请人： Tetsuo Adachi ,  Masataka Kato ,  Toshiaki Nishimoto ,  Nozomu Matsuzaki ,  Takashi Kobayashi ,  Yoshimi Sudou ,  Toshiyuki Mine

发明人： Tetsuo Adachi ,  Masataka Kato ,  Toshiaki Nishimoto ,  Nozomu Matsuzaki ,  Takashi Kobayashi ,  Yoshimi Sudou ,  Toshiyuki Mine

IPC分类号： H01L29/788

CPC分类号： H01L21/28273 ,  G11C11/5628 ,  G11C16/0466 ,  G11C16/10 ,  G11C16/3454 ,  H01L21/28061 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11519 ,  H01L27/11526 ,  H01L27/11529 ,  H01L27/11536 ,  H01L27/11546 ,  H01L29/6659 ,  H01L29/66825 ,  H01L29/7833

摘要： A semiconductor device, which ensures device reliability especially in fine regions and enables great capacitance and high-speed operations, has memory cells including, in a first region of a main surface of a semiconductor substrate, a gate insulating film, a floating gate electrode, an interlayer insulating film, a control gate electrode, and source and drain regions of the second conduction type arranged in a matrix, with a shallow isolation structure for isolating the memory cells. When using a shallow structure buried with an insulating film for element isolation, the isolation withstand voltage in fine regions can be prevented from lowering and the variation in threshold level of selective transistors can be reduced. When the memory cells in a memory mat are divided by means of selective transistors, the disturb resistance of the memory cells can be improved.

摘要翻译： 一种半导体器件，其特别是确保器件的可靠性，特别是在微细的区域中并且能够实现大的电容和高速操作，具有在半导体衬底的主表面的第一区域中包括栅绝缘膜，浮栅电极， 层间绝缘膜，控制栅极电极以及以矩阵形式布置的第二导电类型的源极和漏极区域，具有用于隔离存储单元的浅隔离结构。 当使用用绝缘膜掩埋的浅结构用于元件隔离时，可以防止微细区域中的隔离耐受电压降低，并且可以降低选择性晶体管的阈值电平的变化。 当通过选择性晶体管分配存储器垫中的存储单元时，可以提高存储单元的干扰电阻。

公开(公告)号：US07528036B2

公开(公告)日：2009-05-05

申请号：US11107826

申请日：2005-04-18

申请人： Tetsuo Adachi ,  Masataka Kato ,  Toshiaki Nishimoto ,  Nozomu Matsuzaki ,  Takashi Kobayashi ,  Yoshimi Sudou ,  Toshiyuki Mine

发明人： Tetsuo Adachi ,  Masataka Kato ,  Toshiaki Nishimoto ,  Nozomu Matsuzaki ,  Takashi Kobayashi ,  Yoshimi Sudou ,  Toshiyuki Mine

IPC分类号： H01L21/336

CPC分类号： H01L21/28273 ,  G11C11/5628 ,  G11C16/0466 ,  G11C16/10 ,  G11C16/3454 ,  H01L21/28061 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11519 ,  H01L27/11526 ,  H01L27/11529 ,  H01L27/11536 ,  H01L27/11546 ,  H01L29/6659 ,  H01L29/66825 ,  H01L29/7833

摘要： A semiconductor device, which ensures device reliability especially in fine regions and enables great capacitance and high-speed operations, has memory cells including, in a first region of a main surface of a semiconductor substrate, a gate insulating film, a floating gate electrode, an interlayer insulating film, a control gate electrode, and source and drain regions of the second conduction type arranged in a matrix, with a shallow isolation structure for isolating the memory cells. When using a shallow structure buried with an insulating film for element isolation, the isolation withstand voltage in fine regions can be prevented from lowering and the variation in threshold level of selective transistors can be reduced. When the memory cells in a memory mat are divided by means of selective transistors, the disturb resistance of the memory cells can be improved.

公开(公告)号：US06972997B2

公开(公告)日：2005-12-06

申请号：US10743783

申请日：2003-12-24

申请人： Tetsuya Ishimaru ,  Nozomu Matsuzaki ,  Hitoshi Kume

发明人： Tetsuya Ishimaru ,  Nozomu Matsuzaki ,  Hitoshi Kume

IPC分类号： G11C11/34 ,  G11C16/02 ,  G11C16/04 ,  G11C16/10 ,  G11C16/14 ,  H01L21/8246 ,  H01L21/8247 ,  H01L27/115 ,  H01L29/51 ,  H01L29/788 ,  H01L29/792

CPC分类号： G11C16/0433 ,  G11C16/0466 ,  G11C16/10 ,  G11C16/14 ,  H01L27/11568 ,  H01L29/513 ,  H01L29/518 ,  H01L29/792

摘要： Characteristics of a nonvolatile semiconductor memory device are improved. The memory cell comprises: an ONO film constituted by a silicon nitride film SIN for accumulating charge and by oxide films BOTOX and TOPOX disposed thereon and thereunder; a memory gate electrode MG disposed at an upper portion thereof; a select gate electrode SG disposed at a side portion thereof through the ONO film; a gate oxide film SGOX disposed thereunder. By applying a potential to a select gate electrode SG of a memory cell having a source region MS and a drain region MD and to the source region MS and by accelerating electrons flowing in a channel through a high electric field produced between a channel end of the select transistor and an end of an n-type doped region ME disposed under the memory gate electrode MG, hot holes are generated by impact ionization, and the hot holes are injected into a silicon nitride film SIN by a negative potential applied to the memory gate electrode MG, and thereby an erase operation is performed.

摘要翻译： 提高了非易失性半导体存储器件的特性。 存储单元包括：由用于累积电荷的氮化硅膜SIN和其上设置的氧化膜BOTOX和TOPOX构成的ONO膜; 设置在其上部的存储栅极电极MG; 通过ONO膜设置在其侧部的选择栅电极SG; 设置在其下方的栅氧化膜SGOX。 通过向具有源极区域MS和漏极区域MD的存储单元的选择栅极SG施加电位，并且通过在通道的沟道端之间产生的高电场加速在沟道中流动的电子， 选择晶体管和设置在存储栅电极MG下方的n型掺杂区ME的端部，通过冲击电离产生热孔，并且通过施加到存储栅的负电位将热孔注入氮化硅膜SIN 电极MG，从而进行擦除操作。

公开(公告)号：US20060051977A1

公开(公告)日：2006-03-09

申请号：US11266430

申请日：2005-11-04

申请人： Tetsuo Adachi ,  Masataka Kato ,  Toshiaki Nishimoto ,  Nozomu Matsuzaki ,  Takashi Kobayashi ,  Yoshimi Sudou ,  Toshiyuki Mine

发明人： Tetsuo Adachi ,  Masataka Kato ,  Toshiaki Nishimoto ,  Nozomu Matsuzaki ,  Takashi Kobayashi ,  Yoshimi Sudou ,  Toshiyuki Mine

IPC分类号： H01L21/31

CPC分类号： H01L21/28273 ,  G11C11/5628 ,  G11C16/0466 ,  G11C16/10 ,  G11C16/3454 ,  H01L21/28061 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11519 ,  H01L27/11526 ,  H01L27/11529 ,  H01L27/11536 ,  H01L27/11546 ,  H01L29/6659 ,  H01L29/66825 ,  H01L29/7833

摘要： A semiconductor device, which ensures device reliability especially in fine regions and enables great capacitance and high-speed operations, has memory cells including, in a first region of a main surface of a semiconductor substrate, a gate insulating film, a floating gate electrode, an interlayer insulating film, a control gate electrode, and source and drain regions of the second conduction type arranged in a matrix, with a shallow isolation structure for isolating the memory cells. When using a shallow structure buried with an insulating film for element isolation, the isolation withstand voltage in fine regions can be prevented from lowering and the variation in threshold level of selective transistors can be reduced. When the memory cells in a memory mat are divided by means of selective transistors, the disturb resistance of the memory cells can be improved.

公开(公告)号：US20050189579A1

公开(公告)日：2005-09-01

申请号：US11107826

申请日：2005-04-18

申请人： Tetsuo Adachi ,  Masataka Kato ,  Toshiaki Nishimoto ,  Nozomu Matsuzaki ,  Takashi Kobayashi ,  Yoshimi Sudou ,  Toshiyuki Mine

发明人： Tetsuo Adachi ,  Masataka Kato ,  Toshiaki Nishimoto ,  Nozomu Matsuzaki ,  Takashi Kobayashi ,  Yoshimi Sudou ,  Toshiyuki Mine

IPC分类号： H01M10/0525 ,  G11C11/56 ,  G11C16/04 ,  G11C16/10 ,  G11C16/34 ,  G11C27/00 ,  H01L21/00 ,  H01L21/28 ,  H01L21/283 ,  H01L21/336 ,  H01L21/8247 ,  H01L27/105 ,  H01L27/115 ,  H01L29/76 ,  H01L29/78 ,  H01L29/788 ,  H01L29/792 ,  H01L29/94 ,  H01L31/062 ,  H01L31/119 ,  H01M2/16

CPC分类号： H01L21/28273 ,  G11C11/5628 ,  G11C16/0466 ,  G11C16/10 ,  G11C16/3454 ,  H01L21/28061 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11519 ,  H01L27/11526 ,  H01L27/11529 ,  H01L27/11536 ,  H01L27/11546 ,  H01L29/6659 ,  H01L29/66825 ,  H01L29/7833

摘要： A semiconductor device, which ensures device reliability especially in fine regions and enables great capacitance and high-speed operations, has memory cells including, in a first region of a main surface of a semiconductor substrate, a gate insulating film, a floating gate electrode, an interlayer insulating film, a control gate electrode, and source and drain regions of the second conduction type arranged in a matrix, with a shallow isolation structure for isolating the memory cells. When using a shallow structure buried with an insulating film for element isolation, the isolation withstand voltage in fine regions can be prevented from lowering and the variation in threshold level of selective transistors can be reduced. When the memory cells in a memory mat are divided by means of selective transistors, the disturb resistance of the memory cells can be improved.

公开(公告)号：US20060050557A1

公开(公告)日：2006-03-09

申请号：US11251963

申请日：2005-10-18

申请人： Tetsuya Ishimaru ,  Nozomu Matsuzaki ,  Hitoshi Kume

发明人： Tetsuya Ishimaru ,  Nozomu Matsuzaki ,  Hitoshi Kume

IPC分类号： G11C16/04

CPC分类号： G11C16/0433 ,  G11C16/0466 ,  G11C16/10 ,  G11C16/14 ,  H01L27/11568 ,  H01L29/513 ,  H01L29/518 ,  H01L29/792

摘要： Characteristics of a nonvolatile semiconductor memory device are improved. The memory cell comprises: an ONO film constituted by a silicon nitride film SIN for accumulating charge and by oxide films BOTOX and TOPOX disposed thereon and thereunder; a memory gate electrode MG disposed at an upper portion thereof; a select gate electrode SG disposed at a side portion thereof through the ONO film; a gate oxide film SGOX disposed thereunder. By applying a potential to a select gate electrode SG of a memory cell having a source region MS and a drain region MD and to the source region MS and by accelerating electrons flowing in a channel through a high electric field produced between a channel end of the select transistor and an end of an n-type doped region ME disposed under the memory gate electrode MG, hot holes are generated by impact ionization, and the hot holes are injected into a silicon nitride film SIN by a negative potential applied to the memory gate electrode MG, and thereby an erase operation is performed.