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公开(公告)号：US20130097857A1
公开(公告)日：2013-04-25
申请号：US13807223
申请日：2012-04-19
IPC分类号： H05K3/40
CPC分类号： H01B1/02 , H01B1/12 , H05K1/092 , H05K3/4069 , H05K3/4084 , H05K3/4652 , H05K2203/178 , Y02P70/611 , Y02P70/613 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167
摘要： A method of manufacturing a circuit board includes the steps of preparing a fiber piece housing paste, fabricating a filtered recovery paste, fabricating a reuse paste, sticking a protective film, forming a hole, and filling the hole with the reuse paste. Furthermore, the method includes the steps of forming a protruded portion constituted of the reuse paste, disposing a metallic foil on both sides of a second prepreg to carry out pressurization, heating the second prepreg to cure the second prepreg and the reuse paste, and processing the metallic foil into a wiring pattern.
摘要翻译： 制造电路板的方法包括以下步骤：制备纤维片外壳糊，制备过滤的回收膏，制备再利用膏，粘贴保护膜，形成孔，并用再利用膏填充孔。 此外，该方法包括以下步骤：形成由再利用糊料构成的突出部分，在第二预浸料坯的两侧设置金属箔以进行加压，加热第二预浸料以固化第二预浸料和再利用浆料，以及加工 金属箔成为布线图案。
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公开(公告)号：US08393078B2
公开(公告)日：2013-03-12
申请号：US13446562
申请日：2012-04-13
IPC分类号： H01K3/10
CPC分类号： H05K3/4069 , B23K35/025 , B23K35/302 , H05K3/4652 , H05K2203/178 , Y02P70/613 , Y10T29/49126 , Y10T29/49158 , Y10T29/49165
摘要： In a method of manufacturing a circuit board, a conductive paste is filled in a first hole formed on a first prepreg having both sides to which a first protective film is caused to stick so that a first circuit board is manufactured. A fiber piece housing paste obtained by mixing a fiber piece is recovered to obtain a recovery paste; filtration is carried out through a filter; a solvent or the like is added; and a viscosity, a composition ratio or the like is adjusted so that a reuse paste is fabricated. The reuse paste is filled in a second hole formed on a second prepreg having both sides to which a second protective film is caused to stick.
摘要翻译： 在制造电路板的方法中，将导电浆料填充在形成有第一预浸料坯的第一孔中，该第一预浸料坯具有使第一保护膜粘合的两侧，从而制造第一电路板。 回收通过混合纤维片获得的纤维片外壳糊，得到回收膏; 过滤通过过滤器进行; 加入溶剂等; 并且调节粘度，组成比等，从而制造再利用浆料。 将再利用糊料填充在形成有第二预浸料坯的第二孔中，所述第二预浸料坯具有使第二保护膜粘附的两侧。
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公开(公告)号：US20120272520A1
公开(公告)日：2012-11-01
申请号：US13446562
申请日：2012-04-13
IPC分类号： H01K3/10
CPC分类号： H05K3/4069 , B23K35/025 , B23K35/302 , H05K3/4652 , H05K2203/178 , Y02P70/613 , Y10T29/49126 , Y10T29/49158 , Y10T29/49165
摘要： In a method of manufacturing a circuit board, a conductive paste is filled in a first hole formed on a first prepreg having both sides to which a first protective film is caused to stick so that a first circuit board is manufactured. A fiber piece housing paste obtained by mixing a fiber piece is recovered to obtain a recovery paste; filtration is carried out through a filter; a solvent or the like is added; and a viscosity, a composition ratio or the like is adjusted so that a reuse paste is fabricated. The reuse paste is filled in a second hole formed on a second prepreg having both sides to which a second protective film is caused to stick.
摘要翻译： 在制造电路板的方法中，将导电浆料填充在形成有第一预浸料坯的第一孔中，该第一预浸料坯具有使第一保护膜粘合的两侧，从而制造第一电路板。 回收通过混合纤维片获得的纤维片外壳糊，得到回收膏; 过滤通过过滤器进行; 加入溶剂等; 并且调节粘度，组成比等，从而制造再利用浆料。 将再利用糊料填充在形成有第二预浸料坯的第二孔中，所述第二预浸料坯具有使第二保护膜粘附的两侧。
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公开(公告)号：US20130146817A1
公开(公告)日：2013-06-13
申请号：US13807647
申请日：2012-04-19
IPC分类号： H01B1/12
CPC分类号： H01B1/02 , H01B1/12 , H05K1/092 , H05K3/4069 , H05K3/4084 , H05K3/4652 , H05K2203/178 , Y02P70/611 , Y02P70/613 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167
摘要： A method of manufacturing a reuse paste includes the steps of preparing a fiber piece housing paste, fabricating a filtered recovery paste and fabricating a reuse paste. At the step of preparing a fiber piece housing paste, there is prepared a fiber piece housing paste including a conductive paste having conductive powder and a resin, and a fiber piece taken away from a prepreg to be used for manufacturing a circuit board. At the step of fabricating a filtered recovery paste, the fiber piece housing paste in a paste state is filtered as it is by using a filter and a filtered recovery paste is thus fabricated. At the step of fabricating a reuse paste, at least one of a solvent, a resin and a paste having a different composition from the filtered recovery paste is added to the filtered recovery paste, and the reuse paste is thus fabricated.
摘要翻译： 制造再利用浆料的方法包括以下步骤：制备纤维片收容浆料，制备过滤的回收浆料并制备再利用浆料。 在制备纤维片外壳膏的步骤中，制备包含导电性粉末和树脂的导电性糊料的纤维片外壳膏和从预浸料中取出的用于制造电路基板的纤维片。 在制造过滤的回收浆料的步骤中，通过使用过滤器原样过滤粘贴状态的纤维片收纳糊状物，由此制造过滤的回收膏。 在制造再利用糊剂的步骤中，将过滤的回收糊剂中添加与过滤后的回收糊剂不同的组成的溶剂，树脂和糊剂中的至少一种，由此制造再利用糊剂。
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公开(公告)号：US08561294B2
公开(公告)日：2013-10-22
申请号：US13807223
申请日：2012-04-19
IPC分类号： H01K3/10
CPC分类号： H01B1/02 , H01B1/12 , H05K1/092 , H05K3/4069 , H05K3/4084 , H05K3/4652 , H05K2203/178 , Y02P70/611 , Y02P70/613 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167
摘要： A method of manufacturing a circuit board includes the steps of preparing a fiber piece housing paste, fabricating a filtered recovery paste, fabricating a reuse paste, sticking a protective film, forming a hole, and filling the hole with the reuse paste. Furthermore, the method includes the steps of forming a protruded portion constituted of the reuse paste, disposing a metallic foil on both sides of a second prepreg to carry out pressurization, heating the second prepreg to cure the second prepreg and the reuse paste, and processing the metallic foil into a wiring pattern.
摘要翻译： 制造电路板的方法包括以下步骤：制备纤维片外壳糊，制备过滤的回收膏，制备再利用膏，粘贴保护膜，形成孔，并用再利用膏填充孔。 此外，该方法包括以下步骤：形成由再利用糊料构成的突出部分，在第二预浸料坯的两侧设置金属箔以进行加压，加热第二预浸料以固化第二预浸料和再利用浆料，以及加工 金属箔成为布线图案。
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6.发明申请METHOD OF MANUFACTURING REUSE PASTE, REUSE PASTE AND METHOD OF MANUFACTURING CIRCUIT BOARD USING REUSE PASTE 审中-公开制造再利用膏药，再利用膏药的方法及使用再利用膏药制造电路板的方法公开(公告)号：US20130153138A1
公开(公告)日：2013-06-20
申请号：US13817733
申请日：2012-07-24
CPC分类号： H05K3/0094 , H01B1/20 , H01B1/22 , H05K1/092 , H05K3/4069 , H05K3/4652 , H05K2203/178 , Y02P70/611 , Y02P70/613
摘要： A method of manufacturing a reuse paste includes preparing a fiber piece housing paste, producing a filtered recovery paste, and producing a reuse paste. In the preparing of the fiber piece housing paste, a conductive paste including a conductive particle, resin and a latent curing agent, and a fiber piece housing paste including a fiber piece dropping off from a prepreg used for manufacturing a circuit board are prepared. In the producing of the filtered recovery paste, the filtered recovery paste is produced by filtering the fiber piece housing paste, which remains in a paste state, by using a filter. In the production of the reuse paste, the reuse paste is produced by adding at least one of a solvent, resin, and a paste having a different composition from that of the filtered recovery paste into the filtered recovery paste.
摘要翻译： 制备再利用糊剂的方法包括制备纤维片外壳糊，产生经过过滤的回收膏，并制备再利用浆料。 在制备纤维片外壳膏时，制备包含导电颗粒，树脂和潜在性固化剂的导电糊，以及包含从用于制造电路板的预浸料脱落的纤维片的纤维片外壳膏。 在过滤的回收浆料的生产中，通过使用过滤器过滤保持糊状状态的纤维片外壳糊来制造过滤的回收膏。 在再生浆料的生产中，通过将具有不同组成的溶剂，树脂和糊料中的至少一种与经过滤的回收浆料的组合物中的至少一种加入到过滤的回收浆料中来制备再利用糊料。
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公开(公告)号：US08563872B2
公开(公告)日：2013-10-22
申请号：US13145271
申请日：2011-02-22
CPC分类号： H05K3/4069 , H05K3/4652 , H05K2201/0272 , H05K2201/0355 , H05K2203/0425
摘要： A wiring board includes a plurality of wirings laid via an insulating resin layer, and a via-hole conductor provided for electrically connecting the wirings. The via-hole conductor includes metal and resin portions. The metal portion includes a region made of copper particles, a first metal region mainly composed of tin, a tin-copper alloy, or a tin-copper intermetallic compound, and a second metal region mainly composed of bismuth, and has Cu/Sn of from 1.59 to 21.43. The copper particles are in contact with one another, thereby electrically connecting the wirings, and at least part of the first metal region covers around and extends over the portions where the copper particles are in plane contact with one another.
摘要翻译： 布线板包括通过绝缘树脂层铺设的多条布线，以及用于电连接布线的通孔导体。 通孔导体包括金属和树脂部分。 金属部分包括由铜颗粒制成的区域，主要由锡，锡 - 铜合金或锡 - 铜金属间化合物构成的第一金属区域和主要由铋组成的第二金属区域，并且具有Cu / Sn 从1.59到21.43。 铜颗粒彼此接触，从而电连接布线，并且第一金属区域的至少一部分围绕并延伸到铜颗粒彼此平面接触的部分上。
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公开(公告)号：US20130062107A1
公开(公告)日：2013-03-14
申请号：US13698539
申请日：2011-12-09
CPC分类号： H05K3/4069 , H01L23/49822 , H01L23/49827 , H01L23/49883 , H01L2924/0002 , H05K3/4652 , H05K2201/0272 , H05K2203/0425 , H05K2203/043 , H01L2924/00
摘要： Disclosed is a multilayer wiring board having via-hole conductors for connecting a first copper wiring and a second copper wiring, the via-hole conductor including a metal portion and a resin portion. The metal portion includes a first metal region including a link of copper particles as a path for electrically connecting the first and second copper wirings; a second metal region mainly composed of at least one selected from tin, a tin-copper alloy, and a tin-copper intermetallic compound; and a third region mainly composed of bismuth. The copper particles forming the link are in plane-to-plane contact with one another. At least one of the first copper wiring and the second copper wiring is in plane-to-plane contact with the copper particles, and the portion where there is such a plane-to-plane contact is covered with at least a part of the second metal region.
摘要翻译： 公开了一种具有用于连接第一铜布线和第二铜布线的通孔导体的多层布线板，所述通孔导体包括金属部分和树脂部分。 金属部分包括第一金属区域，其包括作为用于电连接第一和第二铜布线的路径的铜颗粒的连接; 主要由选自锡，锡 - 铜合金和锡 - 铜金属间化合物中的至少一种组成的第二金属区域; 和主要由铋组成的第三区域。 形成连接件的铜粒子彼此面对面接触。 所述第一铜布线和所述第二铜布线中的至少一个与所述铜粒子平面接触，并且所述第二铜布线和所述第二铜布线中的至少一个与所述铜粒子平面接触，并且所述第二铜布线和所述第二铜布线的至少一部分被覆盖有所述第二铜布线 金属区域。
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9.发明申请MULTILAYER WIRING SUBSTRATE AND MANUFACTURING METHOD OF MULTILAYER WIRING SUBSTRATE 失效多层布线基板和多层布线基板的制造方法公开(公告)号：US20110278051A1
公开(公告)日：2011-11-17
申请号：US13143490
申请日：2011-02-22
IPC分类号： H05K1/09
CPC分类号： H05K3/4069 , H05K3/4623 , H05K3/4626 , H05K2201/0195 , H05K2201/0272 , H05K2203/0425
摘要： A multilayer wiring board includes an insulating resin layer, wirings laid on their respective opposite surfaces of the insulating resin layer, and a via-hole conductor for electrically connecting the wirings. The via-hole conductor includes metal and resin portions. The metal portion includes first metal regions including a joined unit made of copper particles for connecting the wirings, second metal regions mainly composed of, for example, tin, a tin-copper alloy, or a tin-copper intermetallic compound, and third metal regions mainly composed of bismuth and in contact with the second metal regions. The copper particles forming the joined unit are in plane contact with one another to form plane contact portions, and the second metal regions at least partially are in contact with the first metal regions.
摘要翻译： 多层布线板包括绝缘树脂层，布置在其绝缘树脂层的相应相对表面上的布线，以及用于电连接布线的通孔导体。 通孔导体包括金属和树脂部分。 金属部分包括第一金属区域，其包括由用于连接布线的铜颗粒形成的接合单元，主要由例如锡，锡 - 铜合金或锡 - 铜金属间化合物构成的第二金属区域和第三金属区域 主要由铋组成并与第二金属区域接触。 形成接合单元的铜粒子彼此平面接触以形成平面接触部分，并且第二金属区域至少部分地与第一金属区域接触。
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公开(公告)号：US06806428B1
公开(公告)日：2004-10-19
申请号：US09719631
申请日：2001-02-12
申请人： Suzushi Kimura , Tsuyoshi Himori , Koji Hashimoto
发明人： Suzushi Kimura , Tsuyoshi Himori , Koji Hashimoto
IPC分类号： H05K116
CPC分类号： H05K1/184 , H01L23/5383 , H01L23/5386 , H01L25/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/16265 , H01L2224/73204 , H01L2924/01078 , H01L2924/19103 , H01L2924/19105 , H05K1/023 , H05K1/0231 , H05K1/185 , H05K3/4046 , H05K3/4602 , H05K2201/09118 , H05K2201/09827 , H05K2201/10204 , H05K2201/1053 , H05K2201/10636 , H05K2203/1469 , H05K2203/161 , Y02P70/611 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49172
摘要： The invention relates to a module component having chip components buried in a circuit board, and a method of manufacturing the same, and more specifically it relates to a module component capable of obtaining desired circuit characteristics and functions stably if the size of the component is reduced, being produced very efficiently, and suited to machine mounting, and a method of manufacturing the same. According to the invention, since a desired circuit is composed by disposing a specific number of chip components according to a specified rule, it is not necessary to heat the buried chip components at high temperature when forming a module, chip components are obtained in specified values, and the circuit characteristics, functions, and dimensional precision are stably obtained exactly as designed, and moreover since the chip components are disposed according to a specified rule, it is easy to automate insertion of chip components and increase its operation speed, even if the size of the chip components is reduced, and the circuit composition may be flexibly and easily changed only by changing the inserting position and type of chip components.
摘要翻译： 本发明涉及一种具有埋入电路板中的芯片组件的模块组件及其制造方法，更具体地说，涉及一种能够获得希望的电路特性并能够稳定地工作的模块组件，如果该组件的尺寸减小 ，非常有效地生产并且适合于机器安装及其制造方法。 根据本发明，由于根据规定通过设置特定数量的芯片部件来构成所需的电路，因此在形成模块时不需要在高温下加热埋层芯片部件，以特定值获得芯片部件 ，并且电路特性，功能和尺寸精度都按照设计得到稳定的获得，而且由于芯片部件按照规定进行配置，因此即使是 芯片部件的尺寸减小，并且仅通过改变芯片部件的插入位置和类型可以灵活且容易地改变电路组成。
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