公开(公告)号：US20130082920A1

公开(公告)日：2013-04-04

申请号：US13600215

申请日：2012-08-31

申请人： Tun-Hao You ,  Yu-Chih Liu ,  Yi-Jen Yeh

发明人： Tun-Hao You ,  Yu-Chih Liu ,  Yi-Jen Yeh

IPC分类号： G09G5/00

CPC分类号： G11B19/027

摘要： A content-driven apparatus for controlling electronic devices integrates all control command functions for at least one controlled electronic device. Content information transmitted from one of the controlled electronic devices is received by a communication module, and is passed to a processing element for parsing the content information, including types of the content information, desired command actions to be proceeded, controlled electronic devices required to cooperate, and how to operate for a user. The processing element decides a user interface and an operation method for the user after the parsing, and issues corresponding control messages to the controlled electronic devices required to cooperate after the user uses the operation method to select specific control commands.

摘要翻译： 用于控制电子设备的内容驱动设备将用于至少一个受控电子设备的所有控制命令功能集成。 从受控电子设备之一发送的内容信息由通信模块接收，并被传送到处理元件，用于解析内容信息的类型，内容信息的类型，要进行的期望命令动作，所需的控制电子设备 ，以及如何为用户操作。 处理单元在解析之后决定用户界面和用户的操作方法，并且在用户使用操作方法选择特定控制命令之后，向需要协作的受控电子设备发出相应的控制消息。

公开(公告)号：US09349663B2

公开(公告)日：2016-05-24

申请号：US13539136

申请日：2012-06-29

申请人： Meng-Tse Chen ,  Yu-Chih Liu ,  Hui-Min Huang ,  Wei-Hung Lin ,  Jing Ruei Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

发明人： Meng-Tse Chen ,  Yu-Chih Liu ,  Hui-Min Huang ,  Wei-Hung Lin ,  Jing Ruei Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L25/065

CPC分类号： H01L25/0652 ,  H01L21/561 ,  H01L21/563 ,  H01L23/00 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/562 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2924/15311

摘要： A package on package structure providing mechanical strength and warpage control includes a first package component, a second package component, and a first set of conductive elements coupling the first package component to the second package component. A first polymer-comprising material is molded on the first package component and surrounds the first set of conductive elements. The first polymer-comprising material has an opening therein exposing a top surface of the second package component. A third package component and a second set of conductive elements couples the second package component to the third package component.

摘要翻译： 提供机械强度和翘曲控制的封装结构的封装包括第一封装元件，第二封装元件和将第一封装元件连接到第二封装元件的第一组导电元件。 第一含聚合物的材料被模制在第一包装部件上并包围第一组导电元件。 第一含聚合物的材料在其中具有露出第二包装部件的顶表面的开口。 第三包装部件和第二组导电元件将第二包装部件耦合到第三包装部件。

公开(公告)号：US08916419B2

公开(公告)日：2014-12-23

申请号：US13494814

申请日：2012-06-12

申请人： Chin-Liang Chen ,  Wei-Ting Lin ,  Yu-Chih Liu ,  Kuan-Lin Ho ,  Jason Shen

发明人： Chin-Liang Chen ,  Wei-Ting Lin ,  Yu-Chih Liu ,  Kuan-Lin Ho ,  Jason Shen

IPC分类号： H01L21/00

CPC分类号： H01L21/56 ,  H01L21/565 ,  H01L24/27 ,  H01L24/743 ,  H01L24/75 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75611 ,  H01L2924/16152 ,  H01L2924/00

摘要： A semiconductor package assembly process that includes attaching one or more dies to a substrate; applying an adhesive material on a periphery of the substrate by an adhesive dispenser having a stamp-type dispensing head; applying a thermal interface material (TIM) on a top surface of the die by a TIM dispenser having a stamp-type dispensing head; and positioning a lid over the one or more dies and placing the lid on top of the adhesive material and the TIM by a lid carrier to encapsulate the one or more dies.

摘要翻译： 一种半导体封装组装工艺，包括将一个或多个管芯附接到衬底; 通过具有印模式分配头的粘合剂分配器将粘合剂材料施加在基材的周边上; 通过具有印模式分配头的TIM分配器将热界面材料（TIM）施加在模具的顶表面上; 以及将盖子定位在所述一个或多个模具上，并且通过盖子载体将所述盖子放置在所述粘合剂材料和所述TIM的顶部上以封装所述一个或多个模具。

公开(公告)号：US20130093094A1

公开(公告)日：2013-04-18

申请号：US13276184

申请日：2011-10-18

申请人： Ming-Chung Sung ,  Yu-Chih Liu ,  Wei-Ting Lin ,  Chien-Hsiun Lee

发明人： Ming-Chung Sung ,  Yu-Chih Liu ,  Wei-Ting Lin ,  Chien-Hsiun Lee

IPC分类号： H01L23/48 ,  H01L21/78

CPC分类号： H01L23/3114 ,  H01L21/561 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/73104

摘要： Methods and apparatus for die assembly. A method includes forming a trench extending from an active surface of a semiconductor substrate comprising a plurality of integrated circuit dies having connector terminals extending from the active surface, the trench extending into, but not through, the semiconductor substrate; forming a protective layer overlying the active surface of the semiconductor substrate and the trench, and covering the lower portion of the connector terminals; opening a pre-dicing opening in the protective layer and within the trench; applying a tape over the active surface of the semiconductor wafer, the protective layer and the connector terminals; and performing an operation on a backside of the semiconductor substrate to remove material until the pre-dicing opening is exposed on the backside of the semiconductor wafer. An apparatus includes a semiconductor substrate with integrated circuits and a protective layer surrounding connector terminals of integrated circuits.

摘要翻译： 模具组装的方法和装置 一种方法包括形成从半导体衬底的有源表面延伸的沟槽，其包括多个集成电路管芯，所述多个集成电路管芯具有从所述有源表面延伸的连接器端子， 形成覆盖在半导体衬底和沟槽的有源表面上的保护层，并覆盖连接器端子的下部; 在保护层和沟槽内打开预切割开口; 在半导体晶片的有源表面，保护层和连接器端子上施加带; 以及在半导体衬底的背面进行操作以去除材料，直到在半导体晶片的背面露出预切割开口。 一种装置包括具有集成电路的半导体衬底和围绕集成电路的连接器端子的保护层。

公开(公告)号：US08993378B2

公开(公告)日：2015-03-31

申请号：US13225614

申请日：2011-09-06

申请人： Yu-Chih Liu ,  Jing Ruei Lu ,  Wei-Ting Lin ,  Sao-Ling Chiu ,  Hsin-Yu Pan

发明人： Yu-Chih Liu ,  Jing Ruei Lu ,  Wei-Ting Lin ,  Sao-Ling Chiu ,  Hsin-Yu Pan

IPC分类号： H01L21/50 ,  H01L23/00 ,  H01L23/498 ,  H01L21/683

CPC分类号： H01L21/50 ,  H01L21/6836 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/1601 ,  H01L2224/7565 ,  H01L2224/75701 ,  H01L2224/7901 ,  H01L2224/81011 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2924/1461 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2924/206 ,  H01L2924/014 ,  H01L2924/00

摘要： A method for assembling a flip chip ball grid array package includes mounting solder spheres to a ball grid array substrate, applying flux to a plurality of flip chip solder bumps provided on a diced wafer, aligning the ball grid array substrate over a chip on the diced wafer, picking and separating the chip from the diced wafer by urging the chip upwards towards the ball grid array substrate until the flip chip solder bumps on the chip come in contact with the ball grid array substrate, whereby the chip attaches to the ball grid array substrate in an upside-down orientation, and subjecting the chip and the ball grid array substrate to a thermal process whereby the solder spheres reflow and form solder balls and the flip chip solder bumps reflow and form solder joints between the chip and the ball grid array.

摘要翻译： 用于组装倒装芯片球栅阵列封装的方法包括将焊球安装到球栅阵列衬底上，将焊剂施加到设置在切割晶片上的多个倒装芯片焊料凸块，将球栅阵列衬底对准切割的芯片 晶片，通过将芯片向上推动到球栅阵列衬底，将芯片从切割晶片中分离并分离，直到芯片上的倒装芯片焊料凸块与球栅阵列衬底接触，由此芯片附接到球栅阵列 衬底，并且对芯片和球栅阵列基板进行热处理，由此焊料球回流并形成焊球，并且倒装芯片焊料凸起回流并在芯片和球栅阵列之间形成焊接点 。

公开(公告)号：US09147584B2

公开(公告)日：2015-09-29

申请号：US13297390

申请日：2011-11-16

申请人： Jing Ruei Lu ,  Yu-Chih Liu ,  Ming-Chung Sung ,  Wei-Ting Lin ,  Chien-Kuo Chang

发明人： Jing Ruei Lu ,  Yu-Chih Liu ,  Ming-Chung Sung ,  Wei-Ting Lin ,  Chien-Kuo Chang

IPC分类号： H01L21/50 ,  H01L23/29 ,  H01L21/56 ,  H01L21/67 ,  H01L21/687

CPC分类号： H01L21/56 ,  H01L21/563 ,  H01L21/67109 ,  H01L21/68764 ,  H01L2924/0002 ,  H01L2924/00

摘要： A system for and a method of curing a material is provided. A material, such as an underfill material, is rotated during a curing process. The curing system may include a chamber, a holder to support one or more workpieces, and a rotating mechanism. The rotating mechanism rotates the workpieces during the curing process. The chamber may include one or more heat sources and fans, and may further include a controller. The curing process may include varying the rotation speed, continuously rotating, periodically rotating, or the like.

摘要翻译： 提供了一种用于固化材料的系统和方法。 诸如底部填充材料的材料在固化过程中旋转。 固化系统可以包括腔室，用于支撑一个或多个工件的保持器和旋转机构。 旋转机构在固化过程中使工件旋转。 腔室可以包括一个或多个热源和风扇，并且还可以包括控制器。 固化过程可以包括改变旋转速度，连续旋转，周期性旋转等。

公开(公告)号：US08652939B2

公开(公告)日：2014-02-18

申请号：US13276184

申请日：2011-10-18

申请人： Ming-Chung Sung ,  Yu-Chih Liu ,  Wei-Ting Lin ,  Chien-Hsiun Lee

发明人： Ming-Chung Sung ,  Yu-Chih Liu ,  Wei-Ting Lin ,  Chien-Hsiun Lee

IPC分类号： H01L21/00

CPC分类号： H01L23/3114 ,  H01L21/561 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/73104

摘要： Methods and apparatus for die assembly. A method includes forming a trench extending from an active surface of a semiconductor substrate comprising a plurality of integrated circuit dies having connector terminals extending from the active surface, the trench extending into, but not through, the semiconductor substrate; forming a protective layer overlying the active surface of the semiconductor substrate and the trench, and covering the lower portion of the connector terminals; opening a pre-dicing opening in the protective layer and within the trench; applying a tape over the active surface of the semiconductor wafer, the protective layer and the connector terminals; and performing an operation on a backside of the semiconductor substrate to remove material until the pre-dicing opening is exposed on the backside of the semiconductor wafer. An apparatus includes a semiconductor substrate with integrated circuits and a protective layer surrounding connector terminals of integrated circuits.

摘要翻译： 模具组装的方法和装置 一种方法包括形成从半导体衬底的有源表面延伸的沟槽，其包括多个集成电路管芯，所述多个集成电路管芯具有从所述有源表面延伸的连接器端子， 形成覆盖在半导体衬底和沟槽的有源表面上的保护层，并覆盖连接器端子的下部; 在保护层和沟槽内打开预切割开口; 在半导体晶片的有源表面，保护层和连接器端子上施加带; 以及在半导体衬底的背面进行操作以去除材料，直到在半导体晶片的背面露出预切割开口。 一种装置包括具有集成电路的半导体衬底和围绕集成电路的连接器端子的保护层。

公开(公告)号：US20130119565A1

公开(公告)日：2013-05-16

申请号：US13297390

申请日：2011-11-16

申请人： Jing Ruei Lu ,  Yu-Chih Liu ,  Ming-Chung Sung ,  Wei-Ting Lin ,  Chien-Kuo Chang

发明人： Jing Ruei Lu ,  Yu-Chih Liu ,  Ming-Chung Sung ,  Wei-Ting Lin ,  Chien-Kuo Chang

IPC分类号： H01L23/29 ,  H05B1/02 ,  F24C7/08

CPC分类号： H01L21/56 ,  H01L21/563 ,  H01L21/67109 ,  H01L21/68764 ,  H01L2924/0002 ,  H01L2924/00

摘要： A system for and a method of curing a material is provided. A material, such as an underfill material, is rotated during a curing process. The curing system may include a chamber, a holder to support one or more workpieces, and a rotating mechanism. The rotating mechanism rotates the workpieces during the curing process. The chamber may include one or more heat sources and fans, and may further include a controller. The curing process may include varying the rotation speed, continuously rotating, periodically rotating, or the like.

摘要翻译： 提供了一种用于固化材料的系统和方法。 诸如底部填充材料的材料在固化过程中旋转。 固化系统可以包括腔室，用于支撑一个或多个工件的保持器和旋转机构。 旋转机构在固化过程中使工件旋转。 腔室可以包括一个或多个热源和风扇，并且还可以包括控制器。 固化过程可以包括改变旋转速度，连续旋转，周期性旋转等。

公开(公告)号：US20090175492A1

公开(公告)日：2009-07-09

申请号：US12101325

申请日：2008-04-11

申请人： Yong-Sheng CHEN ,  Yu-Chih Liu ,  Kai-Ying Lin

发明人： Yong-Sheng CHEN ,  Yu-Chih Liu ,  Kai-Ying Lin

IPC分类号： G06K9/00

CPC分类号： G06K9/32 ,  B60R2300/102 ,  B60R2300/303 ,  B60R2300/607 ,  G06K9/00791 ,  G06K2009/2045 ,  G06T3/4038

摘要： The present invention discloses an image synthesis system for a vehicle to provide the driver with a downward-facing image of the car's 360° surrounding view. The system includes: a first camera, which is used to shoot a first image of the periphery of the vehicle; a second camera, which is used to shoot a second image of the periphery of said vehicle, wherein the second image and the first image have an overlap region; an image processing device comprising a defining component and a synthesis component, which is used to synthesize the first image and the second image and output a third image; a display device, which is used to display the third image.

摘要翻译： 本发明公开了一种用于车辆的图像合成系统，以向司机提供汽车360°周围视图的向下的图像。 该系统包括：第一相机，用于拍摄车辆周边的第一图像; 第二相机，其用于拍摄所述车辆的周边的第二图像，其中所述第二图像和所述第一图像具有重叠区域; 图像处理装置，包括限定部件和合成部件，其用于合成第一图像和第二图像，并输出第三图像; 显示装置，用于显示第三图像。

公开(公告)号：US20050117872A1

公开(公告)日：2005-06-02

申请号：US10915262

申请日：2004-08-10

申请人： Yu-Chih Liu ,  Hui-Jen Peng ,  Mei-Hua Wang

发明人： Yu-Chih Liu ,  Hui-Jen Peng ,  Mei-Hua Wang

IPC分类号： H04N5/76 ,  H04N5/765 ,  H04N5/781 ,  H04N5/782

CPC分类号： H04N5/781 ,  H04N5/765 ,  H04N5/782

摘要： A computer system. The computer system comprises a display device for image display, a storage device to store a video signal, and a video-playing subsystem, wherein power is supplied to the display device, the storage device, and the video-playing subsystem. The video-playing subsystem comprises a digital video recording (DVR) module to process the video signal transmitted from the storage device in a video-playing mode, and to output the audio signal and the image signal of the video signal respectively, and an image-processing module to process the image signal transmitted from the DVR module into an image for image display.

摘要翻译： 电脑系统 计算机系统包括用于图像显示的显示装置，存储视频信号的存储装置和视频播放子系统，其中向显示装置，存储装置和视频播放子系统供电。 视频播放子系统包括数字视频记录（DVR）模块，用于以视频播放模式处理从存储设备发送的视频信号，并分别输出视频信号的音频信号和图像信号，以及图像 处理模块来处理从DVR模块发送的图像信号到用于图像显示的图像。