Glass product
    6.
    发明授权
    Glass product 有权
    玻璃制品

    公开(公告)号:US08557390B2

    公开(公告)日:2013-10-15

    申请号:US12997231

    申请日:2009-06-09

    IPC分类号: B32B17/06

    摘要: The present invention relates to a glass product, comprising a glass substrate with a transparent and conductive indium tin oxide layer having a covering layer, which forms a redox barrier for the indium tin oxide layer, wherein the indium tin oxide layer is obtained by pulsed, highly ionizing high-power magnetron sputtering (HPPMS) in which—the pulses of the magnetron have a peak power density greater than 1.5 kW/cm2,—the pulses of the magnetron have a time duration that is ≦200 μs, and—the mean current flow density rise upon ignition of the plasma within a time interval that is ≦0.025 ms is at least 106 Λ(ms cm2), and the indium tin oxide layer has a crystalline structure, in such a way that the (222)-reflection of an X-ray diffraction spectrum after the production of the indium tin oxide layer is shifted relative to the powder spectrum of indium tin oxide by a maximum of 1 degree, preferably by 0.3 degrees to 0.5 degrees, in the direction of compressive stress and is shifted after heat treatment by a maximum of 1 degree, preferably by 0.2 degrees to 0.4 degrees, in the direction of the powder spectrum.

    摘要翻译: 玻璃制品技术领域本发明涉及一种玻璃制品,其包括具有透明导电性铟锡氧化物层的玻璃基板,其具有覆盖层,其形成用于氧化铟锡层的氧化还原屏障,其中所述氧化铟锡层通过脉冲, 高电离大功率磁控溅射(HPPMS),其中磁控管的脉冲具有大于1.5kW / cm 2的峰值功率密度,磁控管的脉冲持续时间为200微米,平均值为 在0.025ms的时间间隔内等离子体点燃时的电流流动密度上升至少为106λ(mscm 2),并且氧化铟锡层具有晶体结构,使得(222) - 反射 在氧化铟锡层的制造之后的X射线衍射光谱相对于氧化铟锡的粉末光谱在压缩应力方向上偏移最多为1度,优选为0.3度至0.5度,并且为 转移了 在粉末光谱的方向上进行最多1度,优选0.2度至0.4度的热处理。

    MAGNETRON COATING MODULE AND MAGNETRON COATING METHOD
    7.
    发明申请
    MAGNETRON COATING MODULE AND MAGNETRON COATING METHOD 审中-公开
    MAGNETRON涂层模块和MAGNETRON涂层方法

    公开(公告)号:US20120097529A1

    公开(公告)日:2012-04-26

    申请号:US13138810

    申请日:2010-03-25

    IPC分类号: C23C14/35

    摘要: The invention relates to a new basic technology for magnetron sputtering of ceramic layers, in particular for optical applications. The new concept enables the construction of magnetron sputtering sources which, in comparison with the known methods, such as reactive DC-, MF- or RF magnetron sputtering or the magnetron sputtering of ceramic targets, enables significantly improved precision in the deposition of ceramic layers at an exactly defined rate and homogeneity and also with very good reproducibility.

    摘要翻译: 本发明涉及用于陶瓷层的磁控溅射的新的基本技术,特别是用于光学应用。 新概念使得能够构建磁控溅射源,与已知方法相比,诸如反应型DC-,MF-或RF磁控溅射或陶瓷靶的磁控溅射,可以显着提高陶瓷层沉积精度 精确定义的速率和均匀性,并具有非常好的重现性。

    GLASS PRODUCT
    8.
    发明申请
    GLASS PRODUCT 有权
    玻璃制品

    公开(公告)号:US20110223415A1

    公开(公告)日:2011-09-15

    申请号:US12997231

    申请日:2009-06-09

    IPC分类号: B32B5/00 B32B17/06 B32B9/04

    摘要: The present invention relates to a glass product, comprising a glass substrate with a transparent and conductive indium tin oxide layer having a covering layer, which forms a redox barrier for the indium tin oxide layer, wherein the indium tin oxide layer is obtained by pulsed, highly ionizing high-power magnetron sputtering (HPPMS) in which—the pulses of the magnetron have a peak power density greater than 1.5 kW/cm2, —the pulses of the magnetron have a time duration that is ≦200 μs, and—the mean current flow density rise upon ignition of the plasma within a time interval that is ≦0.025 ms is at least 106 Λ(ms cm2), and the indium tin oxide layer has a crystalline structure, in such a way that the (222)-reflection of an X-ray diffraction spectrum after the production of the indium tin oxide layer is shifted relative to the powder spectrum of indium tin oxide by a maximum of 1 degree, preferably by 0.3 degrees to 0.5 degrees, in the direction of compressive stress and is shifted after heat treatment by a maximum of 1 degree, preferably by 0.2 degrees to 0.4 degrees, in the direction of the powder spectrum.

    摘要翻译: 玻璃制品技术领域本发明涉及一种玻璃制品,其包括具有透明导电性铟锡氧化物层的玻璃基板,其具有覆盖层,其形成用于氧化铟锡层的氧化还原屏障,其中所述氧化铟锡层通过脉冲, 高电离大功率磁控溅射(HPPMS),其中磁控管的脉冲具有大于1.5kW / cm 2的峰值功率密度,磁控管的脉冲具有的时间长度为200微秒,而 - 在等离子体点火之后的平均电流流动密度上升为0.025ms至少为106Λ(mscm 2),并且氧化铟锡层具有晶体结构,使得(222) 在制造铟锡氧化物层之后的X射线衍射光谱的反射相对于氧化铟锡的粉末光谱在压缩应力方向上偏移最多1度,优选0.3度至0.5度 和我 在粉末光谱的方向上热处理后最多移动1度,优选0.2度至0.4度。