Abstract:
PROCESS FOR PRODUCING FILMS OF ALUMINUM NITRIDE IN A FLOW SYSTEM AND IN A CLOSED SYSTEM. IN THE FLOW SYSTEM THE AMMONOLYSIS OF AN ALUMINUM TRIHALIDE OR AN ALUMINUM TRIALKYL IS CAPABLE OF PRODUCING FILMS OF SINGLE CRYSTAL ALUMINUM NITRIDE SUITABLE FOR USE IN JUNCTION DEVICES OR FILMS OF AMORPHOUS ALUMINUM NITRIDE SUITABLE FOR USE AS A DIELECTRIC IN ELECTRONIC DEVICES. IN THE CLOSED SYSTEM, ALUMINUM NITRIDE FROM A SUITABLE LOCATED SOURCE IS TRANSPORTED BY EITHER A HYDROGEN HALIDE OR AN AMMONIUM HALIDE TO A SUITABLE SUBSTRATE MAINTAINED AT A LOWER TEMPERATURE WHERE A FILM OF ALUMINUM NITRIDE IS FORMED ON THE SUBSTRATE.
Abstract:
A plasma-forming fluid consisting of a monatomic gas and at least one other gas having a diatomic molecule is employed to pyrolytically produce chemical elements and chemical compounds, such, for example, as pyrolytic carbon and refractory carbides. Pyrolytic carbon having a density of from 2.1 to 2.25 grams per cubic centimeter and an impurity content of less than 20 parts per million is made from a reactant material comprising aliphatic halides of carbon introduced into the plasma-forming fluid.
Abstract:
A semiconductor material having a volatile component is thermally treated in an ambient formed by a gaseous mixture which constantly maintains the stoichiometry of the semiconductor material during the thermal treatment.
Abstract:
A SEMICONDUCTOR MATERIAL HAVING A VOLATILE COMPONENT IS THERMALLY TREATED IN AN AMBIENT FORMED BY A GASEOUS MIXTURE WHICH CONSTANTLY MAINTAINS THE STOICHIOMETRY OF THE SEMICONDUCTOR MATERIAL DURING THE THERMAL TREATMENT.