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公开(公告)号:US08294256B2
公开(公告)日:2012-10-23
申请号:US12928986
申请日:2010-12-24
申请人: Wei Chen , XiaoChun Tan
发明人: Wei Chen , XiaoChun Tan
CPC分类号: H01L24/06 , H01L23/4952 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/05554 , H01L2224/48247 , H01L2224/48257 , H01L2224/49113 , H01L2224/4917 , H01L2224/49171 , H01L2224/49175 , H01L2224/85447 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , Y10T29/5313 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要: Methods and structures related to packaging a chip are disclosed. In one embodiment, a chip package structure includes: (i) a chip having a plurality of first and second contact pads thereon; (ii) a lead frame having a plurality of pins for external connection to the package structure, where the chip is disposed on the lead frame; (iii) a plurality of first bonding wires for connecting the first contact pads to the lead frame; and (iv) a plurality of second bonding wires for connecting the second contact pads to the plurality of pins on the lead frame.
摘要翻译: 公开了与封装芯片相关的方法和结构。 在一个实施例中,芯片封装结构包括:(i)芯片,其上具有多个第一和第二接触焊盘; (ii)引线框架,其具有用于外部连接到所述封装结构的多个引脚,其中所述芯片设置在所述引线框架上; (iii)用于将第一接触焊盘连接到引线框架的多个第一接合线; 和(iv)用于将第二接触焊盘连接到引线框架上的多个引脚的多个第二接合线。
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公开(公告)号:US08866283B2
公开(公告)日:2014-10-21
申请号:US13588254
申请日:2012-08-17
申请人: Wei Chen , XiaoChun Tan
发明人: Wei Chen , XiaoChun Tan
IPC分类号: H01L23/48 , H01L23/00 , H01L23/495
CPC分类号: H01L24/06 , H01L23/4952 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/05554 , H01L2224/48247 , H01L2224/48257 , H01L2224/49113 , H01L2224/4917 , H01L2224/49171 , H01L2224/49175 , H01L2224/85447 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , Y10T29/5313 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要: Methods and structures related to packaging a chip are disclosed. In one embodiment, a chip package structure includes: (i) a chip having a plurality of first and second contact pads thereon; (ii) a lead frame having a plurality of pins for external connection to the package structure, where the chip is disposed on the lead frame; (iii) a plurality of first bonding wires for connecting the first contact pads to the lead frame; and (iv) a plurality of second bonding wires for connecting the second contact pads to the plurality of pins on the lead frame.
摘要翻译: 公开了与封装芯片相关的方法和结构。 在一个实施例中,芯片封装结构包括:(i)芯片,其上具有多个第一和第二接触焊盘; (ii)引线框架,其具有用于外部连接到所述封装结构的多个引脚,其中所述芯片设置在所述引线框架上; (iii)用于将第一接触焊盘连接到引线框架的多个第一接合线; 和(iv)用于将第二接触焊盘连接到引线框架上的多个引脚的多个第二接合线。
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公开(公告)号:US20120313219A1
公开(公告)日:2012-12-13
申请号:US13588254
申请日:2012-08-17
申请人: Wei Chen , XiaoChun Tan
发明人: Wei Chen , XiaoChun Tan
IPC分类号: H01L23/495 , H05K13/04 , H01L21/56
CPC分类号: H01L24/06 , H01L23/4952 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/05554 , H01L2224/48247 , H01L2224/48257 , H01L2224/49113 , H01L2224/4917 , H01L2224/49171 , H01L2224/49175 , H01L2224/85447 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , Y10T29/5313 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要: Methods and structures related to packaging a chip are disclosed. In one embodiment, a chip package structure includes: (i) a chip having a plurality of first and second contact pads thereon; (ii) a lead frame having a plurality of pins for external connection to the package structure, where the chip is disposed on the lead frame; (iii) a plurality of first bonding wires for connecting the first contact pads to the lead frame; and (iv) a plurality of second bonding wires for connecting the second contact pads to the plurality of pins on the lead frame.
摘要翻译: 公开了与封装芯片相关的方法和结构。 在一个实施例中,芯片封装结构包括:(i)芯片,其上具有多个第一和第二接触焊盘; (ii)引线框架,其具有用于外部连接到所述封装结构的多个引脚,其中所述芯片设置在所述引线框架上; (iii)用于将第一接触焊盘连接到引线框架的多个第一接合线; 和(iv)用于将第二接触焊盘连接到引线框架上的多个引脚的多个第二接合线。
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公开(公告)号:US20110254143A1
公开(公告)日:2011-10-20
申请号:US12928986
申请日:2010-12-24
申请人: Wei Chen , XiaoChun Tan
发明人: Wei Chen , XiaoChun Tan
IPC分类号: H01L23/495 , H01L21/60
CPC分类号: H01L24/06 , H01L23/4952 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/05554 , H01L2224/48247 , H01L2224/48257 , H01L2224/49113 , H01L2224/4917 , H01L2224/49171 , H01L2224/49175 , H01L2224/85447 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , Y10T29/5313 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要: Methods and structures related to packaging a chip are disclosed. In one embodiment, a chip package structure includes: (i) a chip having a plurality of first and second contact pads thereon; (ii) a lead frame having a plurality of pins for external connection to the package structure, where the chip is disposed on the lead frame; (iii) a plurality of first bonding wires for connecting the first contact pads to the lead frame; and (iv) a plurality of second bonding wires for connecting the second contact pads to the plurality of pins on the lead frame.
摘要翻译: 公开了与封装芯片相关的方法和结构。 在一个实施例中,芯片封装结构包括:(i)芯片,其上具有多个第一和第二接触焊盘; (ii)引线框架,其具有用于外部连接到所述封装结构的多个引脚,其中所述芯片设置在所述引线框架上; (iii)用于将第一接触焊盘连接到引线框架的多个第一接合线; 和(iv)用于将第二接触焊盘连接到引线框架上的多个引脚的多个第二接合线。
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公开(公告)号:US11590576B2
公开(公告)日:2023-02-28
申请号:US17356622
申请日:2021-06-24
申请人: Navin Sakthivel , Aaron Avagliano , Farhat Shaikh , Wei Chen , Dan Lu
发明人: Navin Sakthivel , Aaron Avagliano , Farhat Shaikh , Wei Chen , Dan Lu
摘要: A method of forming a high temperature sensor includes preparing a substrate having a surface from an electrically insulative material having a first coefficient of thermal expansion (CTE), preparing an electrical conductor from a metal material having a second CTE that is different from the first CTE, and creating an interface between the electrical conductor and the substrate with a CTE blending medium that is provided between the substrate and the electrical conductor. The CTE blending medium accommodates differing thermal expansion rates of the substrate and the electrical conductor at temperatures of at least 700° C.
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公开(公告)号:US11426598B2
公开(公告)日:2022-08-30
申请号:US16433345
申请日:2019-06-06
申请人: Wen-Shen Ko , Chih-Han Ko , Wang-Hsiang Ko , Wei Chen
发明人: Wen-Shen Ko , Chih-Han Ko , Wang-Hsiang Ko , Wei Chen
摘要: A reusable adhesive pad with embedded magnets consists of a layer of fibrous cloth with elasticity, a layer of silicone gel padding, and permanent magnets. The fibrous cloth with elasticity is made from fiber materials with a stretchable characteristic. The silicone gel padding is spread out fully and glued on one surface of the fibrous cloth with elasticity. In addition, the silicone gel padding is provided with holes that the permanent magnets with cylindrical or conical outers can be filled in and glued to the adhesive surface of the fibrous cloth with elasticity. Since the other sides of the permanent magnets protrude outwards the surface of the silicone gel padding, applying the invention to the human skin can perform the acupuncture and moxibustion treatment and the magneto-therapy to lessen painful discomfort.
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公开(公告)号:US10947680B2
公开(公告)日:2021-03-16
申请号:US16138899
申请日:2018-09-21
摘要: A lifter assembly includes a base having a top and a bottom surface. Connectors are attached to the base extending outwardly from the bottom surface. Each of the connectors includes at least one rail wheel rotatably attached thereto. The base includes traveling wheels rotatably attached thereto. A post is attached to the base extending outwardly from the top surface to a distal end. An arm is disposed on the distal end, rotatably attached to the post, extending outwardly to a terminal end. A support is movably attached to the arm and extends outwardly to a support end. A trolley is slidably disposed on the arm and movable along the arm between the terminal end and the post. Each of the traveling wheels includes a leg pivotably attached to the base connecting the traveling wheel to the base and move the traveling wheel between a transport and a storage position.
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公开(公告)号:US10214395B2
公开(公告)日:2019-02-26
申请号:US16033693
申请日:2018-07-12
申请人: Da Pan , Yabin Liu , Wei Chen , PoJing Liu
发明人: Da Pan , Yabin Liu , Wei Chen , PoJing Liu
摘要: A gantry assembly includes a main beam extending between a first and a second end. A plurality of legs including a pair of first legs and a pair of second legs attached to the main beam. A pair of first trolleys is slidably attached to the main beam. A first girder is attached to each one of the first trolleys and extends outwardly from the first trolleys for movement with the first trolleys. The first girder includes a pair of posts having a first and a second post disposed spaced from one another. The first post is attached to the first girder and extends downwardly from the first girder. The second post is slidably attached to the first girder and is movable along the first girder toward and away from the main beam allowing the gantry assembly to have different widths to accommodate for a single or double railway bridge.
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公开(公告)号:US09909217B2
公开(公告)日:2018-03-06
申请号:US13404088
申请日:2012-02-24
申请人: Judeth Brannon Corry , James Michael Storey , Minghu Guo , Wei Chen , Cai Zeng , Richard L. Zhao , Steven Craig Russell
发明人: Judeth Brannon Corry , James Michael Storey , Minghu Guo , Wei Chen , Cai Zeng , Richard L. Zhao , Steven Craig Russell
IPC分类号: F04D7/04 , C23C30/00 , C23C8/02 , C23C8/20 , C23C8/22 , C23C8/24 , C23C8/26 , C23C8/30 , C23C8/32 , C23C8/36 , C23C8/38 , C23C14/16 , C23C14/48 , C23C14/58 , C10J3/30 , C10J3/50
CPC分类号: C23C30/00 , C10J3/30 , C10J3/50 , C10J2200/15 , C10J2300/0916 , C10J2300/093 , C10J2300/0943 , C10J2300/0946 , C23C8/02 , C23C8/20 , C23C8/22 , C23C8/24 , C23C8/26 , C23C8/30 , C23C8/32 , C23C8/36 , C23C8/38 , C23C14/16 , C23C14/48 , C23C14/5846 , C23C14/586
摘要: A pump used in a gasification system, the pump comprises a housing having an inlet and an outlet, a rotor supported within the housing for rotation relative to the housing, the rotor comprising a hub, a plurality of disks spaced apart by sections of the hub, and defining a plurality of transport channels for transporting solid carbonaceous feedstocks for the gasification system, and an interior feedstock facing surface adjacent to the solid carbonaceous feedstocks, wherein at least a portion of the interior feedstock facing surface is coated with a coating.
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