Memory device having a P+ gate and thin bottom oxide and method of erasing same
    1.
    发明授权
    Memory device having a P+ gate and thin bottom oxide and method of erasing same 有权
    具有P +栅极和薄底部氧化物的存储器件及其擦除方法

    公开(公告)号:US06995423B2

    公开(公告)日:2006-02-07

    申请号:US10878091

    申请日:2004-06-28

    IPC分类号: H01L29/788 H01L29/792

    CPC分类号: H01L29/7923 H01L29/7887

    摘要: A non-volatile memory device includes a semiconductor substrate and an N-type source and drain within the substrate. An oxide-nitride-oxide (ONO) stack is formed over the substrate. The ONO stack includes a thin bottom oxide layer. A P+ polysilicon gate electrode is formed over the ONO stack. The memory device is operative to perform a channel erase operation in which a pair of charge storing cells within the nitride layer are erased simultaneously.

    摘要翻译: 非易失性存储器件包括衬底内的半导体衬底和N型源极和漏极。 在衬底上形成氧化物 - 氧化物 - 氧化物(ONO)堆叠。 ONO堆叠包括薄的底部氧化物层。 在ONO堆叠上形成P + SUPER多晶硅栅电极。 存储器件可操作以执行其中同时擦除氮化物层内的一对电荷存储单元的通道擦除操作。

    Memory device having A P+ gate and thin bottom oxide and method of erasing same
    2.
    发明授权
    Memory device having A P+ gate and thin bottom oxide and method of erasing same 有权
    具有P +栅极和薄底部氧化物的存储器件及其擦除方法

    公开(公告)号:US06885590B1

    公开(公告)日:2005-04-26

    申请号:US10341881

    申请日:2003-01-14

    CPC分类号: H01L29/7923 H01L29/7887

    摘要: A non-volatile memory device includes a semiconductor substrate and an N-type source and drain within the substrate. An oxide-nitride-oxide (ONO) stack is formed over the substrate. The ONO stack includes a thin bottom oxide layer. A P+ polysilicon electrode is formed over the ONO stack. The memory device is operative to perform a channel erase operation in which a pair of charge storing cells with the nitride layer are erased simultaneously.

    摘要翻译: 非易失性存储器件包括衬底内的半导体衬底和N型源极和漏极。 在衬底上形成氧化物 - 氧化物 - 氧化物(ONO)堆叠。 ONO堆叠包括薄的底部氧化物层。 在ONO堆叠上形成P + SUPER多晶硅电极。 存储器件可操作以执行信道擦除操作,其中同时擦除具有氮化物层的一对电荷存储单元。

    Flash memory cells having trenched storage elements
    6.
    发明授权
    Flash memory cells having trenched storage elements 有权
    具有沟槽存储元件的闪存单元

    公开(公告)号:US08742486B2

    公开(公告)日:2014-06-03

    申请号:US11702846

    申请日:2007-02-05

    IPC分类号: H01L29/68

    摘要: An embodiment of the present invention is directed to a memory cell. The memory cell includes a first trench formed in a semiconductor substrate and a second trench formed in said semiconductor substrate adjacent to said first trench. The first trench and the second trench each define a first side wall and a second sidewall respectively. The memory cell further includes a first storage element formed on the first sidewall of the first trench and a second storage element formed on the second sidewall of the second trench.

    摘要翻译: 本发明的实施例涉及存储单元。 存储单元包括形成在半导体衬底中的第一沟槽和形成在与所述第一沟槽相邻的所述半导体衬底中的第二沟槽。 第一沟槽和第二沟槽分别限定第一侧壁和第二侧壁。 存储单元还包括形成在第一沟槽的第一侧壁上的第一存储元件和形成在第二沟槽的第二侧壁上的第二存储元件。

    Flash memory cells having trenched storage elements
    7.
    发明申请
    Flash memory cells having trenched storage elements 有权
    具有沟槽存储元件的闪存单元

    公开(公告)号:US20070205455A1

    公开(公告)日:2007-09-06

    申请号:US11702846

    申请日:2007-02-05

    IPC分类号: H01L29/76

    摘要: An embodiment of the present invention is directed to a memory cell. The memory cell includes a first trench formed in a semiconductor substrate and a second trench formed in said semiconductor substrate adjacent to said first trench. The first trench and the second trench each define a first side wall and a second sidewall respectively. The memory cell further includes a first storage element formed on the first sidewall of the first trench and a second storage element formed on the second sidewall of the second trench.

    摘要翻译: 本发明的实施例涉及存储单元。 存储单元包括形成在半导体衬底中的第一沟槽和形成在与所述第一沟槽相邻的所述半导体衬底中的第二沟槽。 第一沟槽和第二沟槽分别限定第一侧壁和第二侧壁。 存储单元还包括形成在第一沟槽的第一侧壁上的第一存储元件和形成在第二沟槽的第二侧壁上的第二存储元件。

    Method for fabricating memory cells having split charge storage nodes
    8.
    发明授权
    Method for fabricating memory cells having split charge storage nodes 有权
    用于制造具有分离电荷存储节点的存储单元的方法

    公开(公告)号:US09159568B2

    公开(公告)日:2015-10-13

    申请号:US11639666

    申请日:2006-12-15

    摘要: Memory cells having split charge storage nodes and methods for fabricating memory cells having split charge storage nodes are disclosed. A disclosed method includes forming a first trench and an adjacent second trench in a semiconductor substrate, the first trench and the second trench each defining a first sidewall and a second sidewall respectively and forming a first source/drain region in the substrate and a second source/drain region in the substrate, where the first source/drain region and the second source/drain region are formed substantially under the first trench and the second trench in the semiconductor substrate respectively. Moreover, a method includes forming a bit line punch through barrier in the substrate between the first source/drain region and the second source drain region and forming a first storage element on the first sidewall of the first trench and a second storage element on the second sidewall of the second element. A word line is formed in contact with the first storage element and the second storage element.

    摘要翻译: 公开了具有分割电荷存储节点的存储单元和用于制造具有分离电荷存储节点的存储单元的方法。 所公开的方法包括在半导体衬底中形成第一沟槽和相邻的第二沟槽,第一沟槽和第二沟槽分别限定第一侧壁和第二侧壁,并在衬底中形成第一源极/漏极区域,第二源极 /漏极区域,其中第一源极/漏极区域和第二源极/漏极区域分别基本上形成在半导体衬底中的第一沟槽和第二沟槽下方。 此外,一种方法包括在第一源极/漏极区域和第二源极漏极区域之间的衬底中形成位线穿通阻挡层,并在第一沟槽的第一侧壁上形成第一存储元件,在第二沟槽的第二沟槽上形成第二存储元件 第二元件的侧壁。 形成与第一存储元件和第二存储元件接触的字线。

    P-channel NAND in isolated N-well
    10.
    发明授权
    P-channel NAND in isolated N-well 有权
    隔离N阱中的P沟道NAND

    公开(公告)号:US07671403B2

    公开(公告)日:2010-03-02

    申请号:US11567257

    申请日:2006-12-06

    IPC分类号: H01L29/792

    CPC分类号: H01L27/115 H01L27/11568

    摘要: A device includes a substrate and multiple wells formed over the substrate and isolated from one another by dielectric trenches. The device further includes multiple memory elements formed over the wells, each of the memory elements extending approximately perpendicular to the wells and including a material doped with n-type impurities. The device also includes multiple source/drain regions, each source/drain region formed within one of multiple trenches and inside one of the plurality of wells between a pair of the memory elements, each of the source/drain regions implanted with p-type impurities. The device further includes a first substrate contact formed in a first one of the multiple trenches through a first one of the wells into the substrate and a second substrate contact formed in a second one of the multiple trenches through a second one of the wells into the substrate.

    摘要翻译: 一种器件包括衬底和形成在衬底上并由电介质沟槽彼此隔离的多个阱。 该器件还包括形成在阱上的多个存储元件,每个存储元件大致垂直于阱延伸并且包括掺杂有n型杂质的材料。 器件还包括多个源极/漏极区域,每个源极/漏极区域形成在多个沟槽中的一个内,并且在一对存储元件之间的多个阱中的一个内部,源极/漏极区域中的每一个注入p型杂质 。 所述器件还包括形成在所述多个沟槽中的第一个沟槽中的第一衬底接触件,穿过所述衬底中的第一孔,以及形成在所述多个沟槽中的第二个沟槽中的第二衬底接触件中的第二衬底接触入第 基质。