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    Heat dissipating semiconductor package and fabrication method therefor
    1.
    发明申请
    Heat dissipating semiconductor package and fabrication method therefor 审中-公开
    散热半导体封装及其制造方法

    公开(公告)号：US20080122071A1

    公开(公告)日：2008-05-29

    申请号：US11986362

    申请日：2007-11-21

    申请人： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Chih-Wei Chang ,  Cheng-Hsu Hsiao

    发明人： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Chih-Wei Chang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L23/373

    CPC分类号： H01L23/3128 ,  H01L21/568 ,  H01L23/4334 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311

    摘要： A heat dissipating semiconductor package and the fabrication method therefor are provided. The fabrication method for the heat dissipating semiconductor package mainly includes steps of: containing a substrate having a chip mounted thereon in an aperture of a carrier, wherein the carrier has an electroconductive layer; allowing a heat dissipating structure having supporting portions to be mounted on and electrically connected to the electroconductive layer of the carrier via the supporting portions thereof while heat dissipating structure being mounted on the chip; after an encapsulation process and removing a part of the encapsulant above the heat dissipating sheet by lapping to expose a surface of the heat dissipating structure from the encapsulant, depositing and forming a metal passivation layer on the surface of the heat dissipating structure by electroplating for preventing the heat dissipating structure from oxidizing.

    摘要翻译： 提供一种散热半导体封装及其制造方法。 用于散热半导体封装的制造方法主要包括以下步骤：在载体的孔中容纳其上安装有芯片的基板，其中载体具有导电层; 允许散热结构，其具有支撑部分，其安装在载体的导电层上并通过其支撑部分电连接，同时散热结构安装在芯片上; 在封装工艺之后并且通过研磨去除散热片上方的一部分密封剂，以从密封剂暴露出散热结构的表面，在散热结构的表面上沉积和形成金属钝化层，通过电镀防止 散热结构从氧化。

    Heat dissipating semiconductor package and fabrication method therefor
    2.
    发明申请
    Heat dissipating semiconductor package and fabrication method therefor 审中-公开
    散热半导体封装及其制造方法

    公开(公告)号：US20080122070A1

    公开(公告)日：2008-05-29

    申请号：US11986359

    申请日：2007-11-21

    申请人： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Chih-Wei Chang ,  Cheng-Hsu Hsiao

    发明人： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Chih-Wei Chang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L23/373 ,  H01L21/58

    CPC分类号： H01L23/3128 ,  H01L21/568 ,  H01L23/4334 ,  H01L24/16 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2224/0401

    摘要： A heat dissipating semiconductor package and a fabrication method therefor are provided. The fabrication method for the heat dissipating semiconductor package mainly includes steps of: containing a substrate having a chip mounted thereon in an aperture of a carrier; mounting a heat dissipating sheet having supporting portions on the carrier with the heat dissipating sheet being attached on the chip; forming an encapsulant to encapsulate the semiconductor chip and the heat dissipating structure; removing a part of the encapsulant above the heat dissipating sheet with a part of the heat dissipating sheet exposed from the encapsulant by lapping; and forming a cover layer on the part of heat dissipating sheet to prevent it from oxidation; and cutting along a predetermined size of the semiconductor package, thereby heat generated from an operation of the chip is dissipated via the heat dissipating structure.

    摘要翻译： 提供一种散热半导体封装及其制造方法。 用于散热半导体封装的制造方法主要包括以下步骤：将载置有孔的芯片安装在其上; 将散热板安装在载体上，并将散热板安装在芯片上; 形成密封剂以封装半导体芯片和散热结构; 通过研磨从所述密封剂暴露出的部分所述散热片去除所述散热片上方的所述密封剂的一部分; 在散热片的一部分上形成覆盖层以防止其氧化; 并且沿着预定尺寸的半导体封装进行切割，由此从芯片的操作产生的热量经由散热结构消散。

    METHOD FOR MANUFACTURING HEAT-DISSIPATING SEMICONDUCTOR PACKAGE STRUCTURE
    4.
    发明申请
    METHOD FOR MANUFACTURING HEAT-DISSIPATING SEMICONDUCTOR PACKAGE STRUCTURE 审中-公开
    制造散热半导体封装结构的方法

    公开(公告)号：US20110287588A1

    公开(公告)日：2011-11-24

    申请号：US13195639

    申请日：2011-08-01

    申请人： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

    发明人： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L21/56

    CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/48 ,  H01L25/03 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a semiconductor chip and a package unit; disposing on the top surface of the package unit a heat-dissipating element having a flat portion and a supporting portion via the flat portion; receiving the package unit and semiconductor chip in a receiving space formed by the flat portion and supporting portion of the heat-dissipating element; and forming on the chip carrier encapsulant for encapsulating the package unit, semiconductor chip, and heat-dissipating element. The heat-dissipating element dissipates heat generated by the package unit, provides EMI shielding, prevents delamination between the package unit and the encapsulant, decreases thermal resistance, and prevents cracking.

    摘要翻译： 公开了一种散热半导体封装结构及其制造方法。 该方法包括：在至少半导体芯片和封装单元上布置并电连接到芯片载体; 在所述封装单元的顶表面上设置有经由所述平坦部分具有平坦部分和支撑部分的散热元件; 在由散热元件的平坦部分和支撑部分形成的接收空间中接收封装单元和半导体芯片; 以及在芯片载体密封剂上形成以封装封装单元，半导体芯片和散热元件。 散热元件消散封装单元产生的热量，提供EMI屏蔽，防止封装单元与密封剂之间的分层，降低热阻，防止开裂。

    Method for fabricating semiconductor device and carrier applied therein
    5.
    发明申请
    Method for fabricating semiconductor device and carrier applied therein 审中-公开
    制造应用于其中的半导体器件和载体的方法

    公开(公告)号：US20080213942A1

    公开(公告)日：2008-09-04

    申请号：US12074321

    申请日：2008-03-03

    申请人： Min-Shun Hung ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Wen-Tsung Tseng ,  Cheng-Hsu Hsiao

    发明人： Min-Shun Hung ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Wen-Tsung Tseng ,  Cheng-Hsu Hsiao

    IPC分类号： H01L23/12 ,  H05K7/00

    CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401

    摘要： This invention provides a method for fabricating a semiconductor device and a carrier applied therein. The method includes the steps of: disposing a chip-mounted substrate in an opening of a carrier; forming at least a storage aperture and at least an inspection aperture in the carrier; infusing an adhesive into the storage aperture to fill a gap between the substrate and carrier with the adhesive by capillarity; determining whether the inspection aperture is filled with the adhesive to ascertain whether the gap is completely filled with the adhesive; in response to a positive result, performing a molding process to form a molding compound for encapsulating the chip; and performing implantation of solder ball and a singulation process to form a semiconductor device with desirable dimensions. The inspection aperture is inspected with a naked eye to determine whether the gap is completely filled with the adhesive, thereby reducing inspection costs and increasing yields of products with no additional packaging costs.

    摘要翻译： 本发明提供一种用于制造应用于其中的半导体器件和载体的方法。 该方法包括以下步骤：将芯片安装的基板设置在载体的开口中; 在所述载体中至少形成存储孔径和至少一个检查孔; 将粘合剂注入到存储孔中，以通过毛细管力用粘合剂填充基底和载体之间的间隙; 确定检查孔是否填充有粘合剂以确定间隙是否完全被粘合剂填充; 响应于积极的结果，进行成型处理以形成用于封装芯片的模塑料; 并且执行焊球的注入和单一化处理以形成具有所需尺寸的半导体器件。 检查孔径用肉眼检查以确定间隙是否完全充满粘合剂，从而降低检查成本并提高产品的产量，而不需要额外的包装成本。

    Heat dissipating semiconductor package and heat dissipating structure thereof
    6.
    发明申请
    Heat dissipating semiconductor package and heat dissipating structure thereof 审中-公开
    散热半导体封装及其散热结构

    公开(公告)号：US20080017977A1

    公开(公告)日：2008-01-24

    申请号：US11801625

    申请日：2007-05-10

    申请人： Wen-Tsung Tseng ,  Chien-Ping Huang ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

    发明人： Wen-Tsung Tseng ,  Chien-Ping Huang ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

    IPC分类号： H01L23/34

    CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A heat dissipating semiconductor package and a heat dissipating structure thereof are provided. The heat dissipating structure includes an outer surface, consecutive recessed step portions, and a pressure-releasing groove. The outer surface is exposed from an encapsulant made of a molding compound. The step portions are formed at an edge of the outer surface and have decreasing depths wherein the closer a step portion to a central position of the outer surface, the smaller the depth of this step portion is. The pressure-releasing groove is disposed next to and deeper than the innermost one of the step portions. A molding compound flows to the step portions and absorbs heat from an encapsulation mold quickly, such that a flowing speed of the molding compound is reduced. Pressure suffered by air remaining at the step portions is released through the pressure-releasing groove, thereby preventing flashes of the molding compound and resin bleeding.

    摘要翻译： 提供散热半导体封装及其散热结构。 散热结构包括外表面，连续凹进的台阶部分和压力释放槽。 外表面从由模塑料制成的密封剂暴露。 台阶部分形成在外表面的边缘处并且具有减小的深度，其中台阶部分越接近外表面的中心位置，该阶梯部分的深度越小。 压力释放槽设置在步骤部分的最内侧之上并深度。 模塑料流到台阶部分并迅速从封装模具吸收热量，从而降低模塑料的流动速度。 通过压力释放槽释放在台阶部分残留的空气所产生的压力，从而防止模塑料的闪烁和树脂渗色。

    Fabricating method of semiconductor package and heat-dissipating structure applicable thereto
    9.
    发明申请
    Fabricating method of semiconductor package and heat-dissipating structure applicable thereto 审中-公开
    适用于其的半导体封装和散热结构的制造方法

    公开(公告)号：US20080251910A1

    公开(公告)日：2008-10-16

    申请号：US12082718

    申请日：2008-04-11

    申请人： Chih-Wei Chang ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Chun-Ming Liao ,  Cheng-Hsu Hsiao

    发明人： Chih-Wei Chang ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Chun-Ming Liao ,  Cheng-Hsu Hsiao

    IPC分类号： H01L23/36 ,  H01L21/56

    CPC分类号： H01L21/56 ,  H01L23/4334 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01079

    摘要： A method for fabricating semiconductor packages is disclosed, including mounting and electrically connecting a semiconductor chip onto a chip carrier; mounting a heat-dissipating structure on the semiconductor chip; placing the heat-dissipating structure into a mold cavity for filling therein a packaging material to form an encapsulant, wherein the heat-dissipating structure has a heat spreader having a size larger than that of the predetermined size of the semiconductor package, a covering layer formed on the, and a plurality of protrusions formed on edges of the covering layer that are free from being corresponding in position to the semiconductor chip, such that the protrusions can abut against a top surface of the mold cavity to prevent the heat spreader from being warped; and finally performing a singulation process according to the predetermined size and removing the encapsulant formed on the covering layer to form the desired semiconductor package. Also, this invention discloses a heat-dissipating structure applicable to the method described above.

    摘要翻译： 公开了一种用于制造半导体封装的方法，包括将半导体芯片安装并电连接到芯片载体上; 在半导体芯片上安装散热结构; 将散热结构放置在模腔中，用于在其中填充包装材料以形成密封剂，其中散热结构具有尺寸大于半导体封装的预定尺寸的散热器，形成覆盖层 以及在覆盖层的边缘上形成的多个突起，其不与半导体芯片的位置相对应，使得突起可抵靠模腔的顶表面以防止散热器翘曲 ; 最后按照规定的尺寸进行分割处理，除去覆盖层上形成的密封剂，形成所需的半导体封装。 此外，本发明公开了一种适用于上述方法的散热结构。

    Heat-dissipating package structure and fabrication method thereof
    10.
    发明申请
    Heat-dissipating package structure and fabrication method thereof 审中-公开
    散热封装结构及其制造方法

    公开(公告)号：US20080006933A1

    公开(公告)日：2008-01-10

    申请号：US11704599

    申请日：2007-02-08

    申请人： Chien-Ping Huang ,  Ho-Yi Tsai ,  Wen Tsung Tseng

    发明人： Chien-Ping Huang ,  Ho-Yi Tsai ,  Wen Tsung Tseng

    IPC分类号： H01L23/34 ,  H01L21/00

    CPC分类号： H01L23/4334 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

    摘要： The invention provides a heat-dissipating package structure and a fabrication method thereof. The fabrication method includes the steps of mounting and electrically connecting a semiconductor chip to a chip carrier; mounting on the semiconductor chip a heat-dissipating member having an interface layer; performing a molding process to form an encapsulant that encapsulates the semiconductor chip and the heat-dissipating member; cutting the chip carrier and the encapsulant according to a predetermined package size and forming an oblique angle on a top edge of the encapsulant to partially expose an edge of the heat-dissipating member; and removing the encapsulant located on the interface layer. During the molding process, the formed encapsulant can cover the interface layer due to a spacing height exists between the interface layer and the top wall of the mold cavity, thereby preventing damages to the semiconductor chip pressed by the mold and the problem of flash.

    摘要翻译： 本发明提供一种散热封装结构及其制造方法。 该制造方法包括将半导体芯片安装并电连接到芯片载体的步骤; 在所述半导体芯片上安装具有界面层的散热构件; 进行成型工序以形成密封半导体芯片和散热构件的密封剂; 根据预定的包装尺寸切割所述芯片载体和所述密封剂，并在所述密封剂的顶部边缘上形成斜角以部分地暴露所述散热构件的边缘; 并移除位于界面层上的密封剂。 在成型过程中，由于在界面层和模腔顶壁之间存在间隔高度，所形成的密封剂可以覆盖界面层，从而防止对由模具挤压的半导体芯片的损坏和闪光的问题。