Substrate module with high thermal conductivity and its fabrication method of same
    7.
    发明申请
    Substrate module with high thermal conductivity and its fabrication method of same 审中-公开
    具有高导热性的基板模块及其制造方法

    公开(公告)号:US20080017402A1

    公开(公告)日:2008-01-24

    申请号:US11822772

    申请日:2007-07-10

    IPC分类号: H05K1/00

    摘要: A high thermal conductivity substrate includes multiple substrate material layers each having a first plane and a second plane opposite to the first plane, thermal conducting columns arranged in the substrate material layers and respectively extending through the first planes and second planes of each substrate material layer along its thickness direction, and multiple thermal conducting layers arranged on the first plane of each substrate material layer and the second plane of one substrate material layer that is to be disposed at the bottom side of the substrate and connected to the thermal conducting columns in the respective substrate material layers to form a horizontally and vertically distributed thermal conducting network.

    摘要翻译: 高导热性衬底包括多个衬底材料层,每个衬底材料层具有第一平面和与第一平面相对的第二平面,导热柱布置在衬底材料层中并分别延伸穿过每个衬底材料层的第一平面和第二平面 其厚度方向和布置在每个基底材料层的第一平面上的多个导热层和一个基底材料层的第二平面,该第二平面将被布置在基底的底部并连接到相应的导热柱 衬底材料层以形成水平和垂直分布的导热网络。