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公开(公告)号：US4252249A
公开(公告)日：1981-02-24
申请号：US118924
申请日：1980-02-06
CPC分类号： B65D39/088
摘要： A threaded lid for closing the opening in a pump housing having a body portion and a gripping formation defined by a ridge on the body portion having a central portion and projections extending beyond the central portion. A juncture between the central portion and each of the projections varies gradually from a rounded angle at one terminus of the juncture to a gently sloping ramp at the other terminus of the juncture, so that a simple elongated tool such as a stick may be placed between the projections of the gripping formation and rotated to loosen the lid, but not to tighten it. Furthermore, the mildly curved S-shape provides surfaces which conform to the hand to enable substantial manual loosening force to be applied comfortably to the lid, whereas the surfaces of the gripping formation engaged by the hand to tighten the lid are not conducive to the application of a substantial amount of manual force.
摘要翻译： 用于封闭具有主体部分的泵壳体中的开口的螺纹盖和由主体部分上的脊限定的夹持结构，其具有中心部分和延伸超出中心部分的突起。 中心部分和每个突起之间的接合部从接合部的一个端部处的圆角到接合部的另一端部处的缓慢倾斜的坡道逐渐变化，使得诸如棒的简单的细长工具可以位于 夹持结构的突出部分旋转以使盖子松动，但不能拧紧。 此外，轻度弯曲的S形提供了与手相符合的表面，以使得能够舒适地施加到盖子上的基本的手动松动力，而用手紧固盖子的抓握结构的表面不利于施加 大量的手动力量。
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公开(公告)号：US4341594A
公开(公告)日：1982-07-27
申请号：US238726
申请日：1981-02-27
IPC分类号： H01L21/02 , H01L21/306 , H01L21/3213 , C23F1/00 , B44C1/22 , C03C15/00 , C03C25/06
CPC分类号： H01L21/02071 , H01L21/02046 , H01L21/32136 , H01L2224/05572 , Y10S438/958
摘要： Contaminant metal residue on an organic passivation layer of a semiconductor device is removed by plasma etching thereof whereby the performance of the device is restored.
摘要翻译： 通过等离子体蚀刻去除半导体器件的有机钝化层上的污染金属残余物，从而恢复器件的性能。
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公开(公告)号：US4901136A
公开(公告)日：1990-02-13
申请号：US285363
申请日：1988-12-15
申请人： Constantine A. Neugebauer , Lionel M. Levinson , Homer H. Glascock, II , Charles W. Eichelberger , Robert J. Wojnarowski , Richard O. Carlson
发明人： Constantine A. Neugebauer , Lionel M. Levinson , Homer H. Glascock, II , Charles W. Eichelberger , Robert J. Wojnarowski , Richard O. Carlson
IPC分类号： H01L23/04 , H01L23/495 , H01L23/538 , H01L25/065
CPC分类号： H01L23/5383 , H01L23/04 , H01L23/49541 , H01L23/5389 , H01L25/0655 , H01L2924/0002 , H01L2924/01079
摘要： A package for interconnecting a plurality of integrated circuit chips into a functional unit comprising a multilayer substrate having ground and power conducting layers and a frame for holding the chips with their terminal pads on the side of the frame opposite the substrate. Power and ground terminal pads on the chips are coupled to the appropriate potentials via registering conductive feedthroughs passing through the frame and into the substrate into contact with appropriate power or conductive layers in the substrate. Signal pads on the chips are interconnected by means of a conductive layer which is located over the chips on the side of the frame opposite the substrate.
摘要翻译： 一种用于将多个集成电路芯片互连到功能单元的封装，该功能单元包括具有接地和功率传导层的多层基板和用于将其端子焊盘保持在与基板相对的一侧的端子焊盘的框架。 芯片上的电源和接地端子焊盘通过记录穿过框架并进入衬底的导电馈通件与基板中适当的电源或导电层接触而耦合到适当的电位。 芯片上的信号焊盘通过位于与衬底相对的框架侧上的芯片上方的导电层相互连接。
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公开(公告)号：US4828597A
公开(公告)日：1989-05-09
申请号：US129817
申请日：1987-12-07
CPC分类号： H01L23/15 , B32B7/04 , C04B37/005 , H01L21/4807 , C04B2237/10 , C04B2237/30 , C04B2237/34 , C04B2237/343 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/567 , C04B2237/62 , C04B2237/704 , C04B2237/708 , H01L2924/0002 , H01L2924/3011
摘要： A method of providing a unitary body comprised of two initially separate layers having similar coefficients of thermal expansion involves forming a mat of glass fibers in a configuration suitable for bonding the two layers together, placing the glass mat between them and heating the resulting stack to a temperature at which the individual fibers of the glass mat deform to form a continuous layer of glass which adheres to both layers, after which the stack is cooled to result in the unitary body.
摘要翻译： 提供由具有相似的热膨胀系数的两个最初分离的层组成的整体的方法包括在适于将两层结合在一起的构型中形成玻璃纤维垫，将玻璃垫放置在它们之间并将所得堆叠加热到 玻璃板的各个纤维变形以形成粘附到两个层的连续的玻璃层的温度，之后将堆叠冷却以产生整体。
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5.发明授权
公开(公告)号：US4769744A
公开(公告)日：1988-09-06
申请号：US851275
申请日：1986-04-10
CPC分类号： H01L24/06 , H01L23/32 , H01L24/72 , H01L2224/05554 , H01L2224/48091 , H01L2224/49171 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15173 , H01L2924/16152 , H01L2924/351
摘要： Solder layers in a semiconductor chip package, which electrically interconnect conductors used to gain electrical access to the electrodes on the semiconductor chip, are subjected to a transverse compressive force in excess of about 2 pounds per square inch. The semiconductor chip package can thereby undergo a marked increase in the number of cycles of heating and cooling before it fails due to increased thermal resistance arising from structural degradation of the solder layers.
摘要翻译： 半导体芯片封装中的用于电连接到半导体芯片上的电极的导电的导体的焊料层受到超过约2磅/平方英寸的横向压缩力。 由于由于焊料层的结构劣化引起的耐热性增加，因此半导体芯片封装在其失效之前的加热和冷却循环次数显着增加。
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公开(公告)号：US4541035A
公开(公告)日：1985-09-10
申请号：US635697
申请日：1984-07-30
IPC分类号： H01L23/522 , H01L21/70 , H01L21/768 , H01L23/12 , H01L23/14 , H01L23/538 , H01L27/13 , H05K3/46 , H05K1/14
CPC分类号： H01L23/5383 , H01L23/147 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/3011
摘要： A silicon circuit board incorporates multiple levels of patterned conductors. First level upper and lower patterned conductors are situated on an insulation-coated, monocrystalline silicon substrate. Upper and lower, high resistivity, polycrystalline silicon layers, in turn, are situated on the first level upper and lower patterned conductors, respectively. Second level upper and lower patterned conductors are situated over the upper and lower polycrystalline silicon layers. Further levels of patterned conductors in the circuit board may be provided by iteratively forming on the board polycrystalline silicon layers and patterned conductors. Conducting feedthroughs in the circuit board provide electrical communication between various patterened conductors.
摘要翻译： 硅电路板结合了多层图案导体。 第一级上下图案导体位于绝缘涂覆的单晶硅衬底上。 上，下，高电阻率，多晶硅层又分别位于第一级上下图案导体上。 第二级上下图案导体位于上多晶硅层和下多晶硅层之上。 可以通过在板上多层硅层和图案化导体上迭代地形成电路板中的图案导体的进一步水平。 在电路板中进行馈通可以提供各种感应导体之间的电气通信。
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公开(公告)号：US4447799A
公开(公告)日：1984-05-08
申请号：US230163
申请日：1981-01-30
申请人： Richard O. Carlson
发明人： Richard O. Carlson
CPC分类号： G01K7/223 , H01C17/283 , Y10T29/49087 , Y10T29/49098
摘要： A thermistor suitable for use in a temperature range with a maximum temperature exceeding 400.degree. C. comprises bulk thermistor material with a pair of electrical leads attached to the thermistor material by respective quantities of conductive paste each having a curing temperature substantially in excess of the aforementioned maximum temperature.
摘要翻译： 适用于最高温度超过400℃的温度范围的热敏电阻包括体热敏电阻材料，其中一对电引线通过相应量的导电膏附着到热敏电阻材料上，每个导电膏的固化温度基本上超过上述 最高温度。
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公开(公告)号：US4321577A
公开(公告)日：1982-03-23
申请号：US124133
申请日：1980-02-25
申请人： Richard O. Carlson
发明人： Richard O. Carlson
CPC分类号： H01C7/04 , G01N27/121 , G01N33/0029
摘要： A humidity sensitive device is formed of a humidity sensitive material comprised of a magnesium aluminate spinel and titania material. The humidity sensitive device includes various means for applying heat to the humidity sensitive material to purge the humidity sensitive material of foreign substances and also thereby to restore or rejuvenate the characteristics of the humidity sensitive material.
摘要翻译： 湿度敏感装置由包含铝酸镁尖晶石和二氧化钛材料的湿度敏感材料形成。 湿度敏感装置包括用于向感湿材料施加热量以清除外来物质的湿敏材料的各种装置，并且由此恢复或恢复湿度敏感材料的特性。
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