Systems And Methods For Auto-Aligning Members Bearing Correlated Patterns
    1.
    发明申请
    Systems And Methods For Auto-Aligning Members Bearing Correlated Patterns 审中-公开
    自动对齐轴承相关模式的成员的系统和方法

    公开(公告)号:US20090246425A1

    公开(公告)日:2009-10-01

    申请号:US12262068

    申请日:2008-10-30

    IPC分类号: B32B7/04 B29C65/00 B29C43/20

    CPC分类号: G01B7/31 Y10T156/1744

    摘要: A method of aligning first and second mating surfaces includes: generating a random or pseudo-random function; convolving the random or pseudo-random function with a spread function to produce a correlated function; forming a pattern of bi-polar material on the first mating surface based on a quantization of the correlated function; and forming a complementary pattern of the bi-polar material on the second mating surface. The complementary patterns exert a force on each other toward a desired alignment of the first and second mating surfaces. A system includes a first member having a first correlated pattern of material disposed on a first mating surface; and a second member having a second correlated pattern of material disposed on a second mating surface, wherein the second correlated pattern is complementary to the first correlated pattern. The first and second correlated patterns interact to facilitate a desired alignment of the first and second members.

    摘要翻译: 对准第一和第二匹配表面的方法包括:产生随机或伪随机函数; 将随机或伪随机函数与扩展函数进行卷积以产生相关函数; 基于所述相关函数的量化,在所述第一配合表面上形成双极材料的图案; 以及在所述第二配合表面上形成所述双极材料的互补图案。 互补图案相互朝向第一和第二配合表面的期望对准施加力。 一种系统包括:第一构件,具有设置在第一配合表面上的材料的第一相关图案; 以及具有设置在第二配合表面上的材料的第二相关图案的第二构件,其中所述第二相关图案与所述第一相关图案互补。 第一和第二相关图案相互作用以促进第一和第二构件的期望对准。

    Active control of time-varying spatial temperature distribution
    4.
    发明申请
    Active control of time-varying spatial temperature distribution 审中-公开
    主动控制时变空间温度分布

    公开(公告)号:US20080268396A1

    公开(公告)日:2008-10-30

    申请号:US11796515

    申请日:2007-04-26

    IPC分类号: F27D19/00

    摘要: In an embodiment, a microchip includes a plurality of heat-producing electronic devices and a plurality of heat-sensitive devices. A plurality of temperature control elements are spatially distributed relative to the heat-producing electronic devices and the heat-sensitive devices to enable active control of temperature to compensate for spatially non-uniform and temporally-varying heat emitted from the heat-producing electronic devices.

    摘要翻译: 在一个实施例中,微芯片包括多个发热电子器件和多个热敏器件。 多个温度控制元件相对于发热电子器件和热敏器件在空间上分布,以使得能够主动控制温度来补偿从发热电子器件发射的空间不均匀和时间变化的热。

    Active interconnects and control points in integrated circuits
    10.
    发明授权
    Active interconnects and control points in integrated circuits 有权
    集成电路中的有源互连和控制点

    公开(公告)号:US07242199B2

    公开(公告)日:2007-07-10

    申请号:US11112795

    申请日:2005-04-21

    IPC分类号: G01R27/08

    摘要: In various embodiments of the present invention, tunable resistors are introduced at the interconnect layer of integrated circuits in order to provide a for adjusting internal voltage and/or current levels within the integrated circuit to repair defective components or to configure the integrated circuit following manufacture. For example, when certain internal components, such as transistors, do not have specified electronic characteristics due to manufacturing defects, adjustment of the variable resistances of the tunable resistors included in the interconnect layer of integrated circuits according to embodiments of the present invention can be used to adjust internal voltage and/or levels in order to ameliorate the defective components. In other cases, the tunable resistors may be used as switches to configure integrated circuit components, including individual transistors and logic gates as well as larger, hierarchically structured functional modules and domains.

    摘要翻译: 在本发明的各种实施例中,在集成电路的互连层处引入可调电阻器,以便提供用于调整集成电路内的内部电压和/或电流水平以修复有缺陷的部件或者在制造之后配置集成电路。 例如,当诸如晶体管的某些内部组件由于制造缺陷而没有指定的电子特性时,可以使用根据本发明的实施例的集成电路的互连层中包括的可调谐电阻的可变电阻的调整 以调整内部电压和/或电平以便改善有缺陷的部件。 在其他情况下,可调谐电阻器可以用作开关以配置集成电路部件,包括单独的晶体管和逻辑门以及更大的分层结构的功能模块和域。