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11 条记录 (耗时 0.036 秒)

    Methods of Bonding Caps for MEMS Devices
    1.
    发明申请
    Methods of Bonding Caps for MEMS Devices 有权
    MEMS器件封装方法

    公开(公告)号：US20130203199A1

    公开(公告)日：2013-08-08

    申请号：US13365043

    申请日：2012-02-02

    申请人： Xin-Hua Huang ,  Ping-Yin Liu ,  Li-Cheng Chu ,  Yuan-Chih Hsieh ,  Lan-Lin Chao ,  Chun-Wen Cheng ,  Chia-Shiung Tsai

    发明人： Xin-Hua Huang ,  Ping-Yin Liu ,  Li-Cheng Chu ,  Yuan-Chih Hsieh ,  Lan-Lin Chao ,  Chun-Wen Cheng ,  Chia-Shiung Tsai

    IPC分类号： H01L21/52 ,  B23K31/02

    CPC分类号： B23K20/002 ,  B23K20/023

    摘要： A method includes bonding a first bond layer to a second bond layer through eutectic bonding. The step of bonding includes heating the first bond layer and the second bond layer to a temperature higher than a eutectic temperature of the first bond layer and the second bond layer, and performing a pumping cycle. The pumping cycle includes applying a first force to press the first bond layer and the second bond layer against each other. After the step of applying the first force, a second force lower than the first force is applied to press the first bond layer and the second bond layer against each other. After the step of applying the second force, a third force higher than the second force is applied to press the first bond layer and the second bond layer against each other.

    摘要翻译： 一种方法包括通过共晶接合将第一接合层结合到第二接合层。 接合步骤包括将第一接合层和第二接合层加热至高于第一接合层和第二接合层的共晶温度的温度，并进行泵送循环。 泵送循环包括施加第一力以将第一接合层和第二接合层相互挤压。 在施加第一力的步骤之后，施加比第一力小的第二力以将第一接合层和第二接合层相互挤压。 在施加第二力的步骤之后，施加比第二力高的第三力以将第一接合层和第二接合层相互挤压。

    Methods of bonding caps for MEMS devices
    2.
    发明授权
    Methods of bonding caps for MEMS devices 有权
    MEMS器件封装方法

    公开(公告)号：US08790946B2

    公开(公告)日：2014-07-29

    申请号：US13365043

    申请日：2012-02-02

    申请人： Xin-Hua Huang ,  Ping-Yin Liu ,  Li-Cheng Chu ,  Yuan-Chih Hsieh ,  Lan-Lin Chao ,  Chun-Wen Cheng ,  Chia-Shiung Tsai

    发明人： Xin-Hua Huang ,  Ping-Yin Liu ,  Li-Cheng Chu ,  Yuan-Chih Hsieh ,  Lan-Lin Chao ,  Chun-Wen Cheng ,  Chia-Shiung Tsai

    IPC分类号： H01L21/52

    CPC分类号： B23K20/002 ,  B23K20/023

    摘要： A method includes bonding a first bond layer to a second bond layer through eutectic bonding. The step of bonding includes heating the first bond layer and the second bond layer to a temperature higher than a eutectic temperature of the first bond layer and the second bond layer, and performing a pumping cycle. The pumping cycle includes applying a first force to press the first bond layer and the second bond layer against each other. After the step of applying the first force, a second force lower than the first force is applied to press the first bond layer and the second bond layer against each other. After the step of applying the second force, a third force higher than the second force is applied to press the first bond layer and the second bond layer against each other.

    摘要翻译： 一种方法包括通过共晶接合将第一接合层结合到第二接合层。 接合步骤包括将第一接合层和第二接合层加热至高于第一接合层和第二接合层的共晶温度的温度，并进行泵送循环。 泵送循环包括施加第一力以将第一接合层和第二接合层相互挤压。 在施加第一力的步骤之后，施加比第一力小的第二力以将第一接合层和第二接合层相互挤压。 在施加第二力的步骤之后，施加比第二力高的第三力以将第一接合层和第二接合层相互挤压。

    Biological sensing structures and methods of forming the same
    5.
    发明授权
    Biological sensing structures and methods of forming the same 有权
    生物传感结构及其形成方法

    公开(公告)号：US08846129B2

    公开(公告)日：2014-09-30

    申请号：US13372141

    申请日：2012-02-13

    申请人： Hung-Hua Lin ,  Li-Cheng Chu ,  Ming-Tung Wu ,  Yuan-Chih Hsieh ,  Lan-Lin Chao ,  Chia-Shiung Tsai

    发明人： Hung-Hua Lin ,  Li-Cheng Chu ,  Ming-Tung Wu ,  Yuan-Chih Hsieh ,  Lan-Lin Chao ,  Chia-Shiung Tsai

    IPC分类号： B05D3/10 ,  C12Q1/68 ,  H01L21/311

    CPC分类号： G01N21/55 ,  G01N21/01 ,  G01N21/253 ,  G01N27/327 ,  G01N33/483 ,  G01N2021/0106 ,  G01N2201/0636

    摘要： A method of forming of biological sensing structures including a portion of a substrate is recessed to form a plurality of mesas in the substrate. Each of the plurality of mesas has a top surface and a sidewall surface. A first light reflecting layer is deposited over the top surface and the sidewall surface of each mesa. A filling material is formed over a first portion of the first light reflecting layer. A stop layer is deposited over the filling material and a second portion of the first light reflecting layer. A sacrificial layer is formed over the stop layer and is planarized exposing the stop layer. A first opening is formed in the stop layer and the first light reflecting layer. A second light reflecting layer is deposited over the first opening. A second opening is formed in the second light reflecting layer.

    摘要翻译： 形成包括衬底的一部分的生物感测结构的方法被凹进以在衬底中形成多个台面。 多个台面中的每一个具有顶表面和侧壁表面。 第一光反射层沉积在每个台面的顶表面和侧壁表面上。 在第一光反射层的第一部分上形成填充材料。 沉积在填充材料上的停止层和第一光反射层的第二部分。 牺牲层形成在停止层上并且被平坦化地暴露停止层。 在停止层和第一光反射层中形成第一开口。 第二光反射层沉积在第一开口上。 在第二光反射层中形成第二开口。

    MULTIPLE BONDING IN WAFER LEVEL PACKAGING
    8.
    发明申请
    MULTIPLE BONDING IN WAFER LEVEL PACKAGING 有权
    多级捆绑在水平包装中

    公开(公告)号：US20120074590A1

    公开(公告)日：2012-03-29

    申请号：US12892003

    申请日：2010-09-28

    申请人： Chung-Hsien Lin ,  Chia-Hua Chu ,  Li-Cheng Chu ,  Yuan-Chih Hsieh ,  Chun-Wen Cheng

    发明人： Chung-Hsien Lin ,  Chia-Hua Chu ,  Li-Cheng Chu ,  Yuan-Chih Hsieh ,  Chun-Wen Cheng

    IPC分类号： H01L23/488 ,  H01L21/768

    CPC分类号： B81B7/0032 ,  B81B2207/092 ,  B81C1/00269 ,  B81C1/00357 ,  B81C2203/0109 ,  B81C2203/0792 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present disclosure provides a method for fabricating a MEMS device including multiple bonding of substrates. In an embodiment, a method includes providing a micro-electro-mechanical systems (MEMS) substrate including a first bonding layer, providing a semiconductor substrate including a second bonding layer, and providing a cap including a third bonding layer. The method further includes bonding the MEMS substrate to the semiconductor substrate at the first and second bonding layers, and bonding the cap to the semiconductor substrate at the second and third bonding layers to hermetically seal the MEMS substrate between the cap and the semiconductor substrate. A MEMS device fabricated by the above method is also provided.

    摘要翻译： 本公开提供了一种用于制造包括多个基板结合的MEMS装置的方法。 在一个实施例中，一种方法包括提供包括第一结合层的微电子机械系统（MEMS）衬底，提供包括第二接合层的半导体衬底，以及提供包括第三接合层的帽。 该方法还包括在第一和第二接合层处将MEMS衬底接合到半导体衬底，并且在第二和第三接合层处将盖接合到半导体衬底上，以密封MEMS衬底在盖和半导体衬底之间。 还提供了通过上述方法制造的MEMS器件。

    Multiple bonding in wafer level packaging
    9.
    发明授权
    Multiple bonding in wafer level packaging 有权
    晶圆级封装的多重接合

    公开(公告)号：US08486744B2

    公开(公告)日：2013-07-16

    申请号：US12892003

    申请日：2010-09-28

    申请人： Chung-Hsien Lin ,  Chia-Hua Chu ,  Li-Cheng Chu ,  Yuan-Chih Hsieh ,  Chun-Wen Cheng

    发明人： Chung-Hsien Lin ,  Chia-Hua Chu ,  Li-Cheng Chu ,  Yuan-Chih Hsieh ,  Chun-Wen Cheng

    IPC分类号： H01L21/00

    CPC分类号： B81B7/0032 ,  B81B2207/092 ,  B81C1/00269 ,  B81C1/00357 ,  B81C2203/0109 ,  B81C2203/0792 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present disclosure provides a method for fabricating a MEMS device including multiple bonding of substrates. In an embodiment, a method includes providing a micro-electro-mechanical systems (MEMS) substrate including a first bonding layer, providing a semiconductor substrate including a second bonding layer, and providing a cap including a third bonding layer. The method further includes bonding the MEMS substrate to the semiconductor substrate at the first and second bonding layers, and bonding the cap to the semiconductor substrate at the second and third bonding layers to hermetically seal the MEMS substrate between the cap and the semiconductor substrate. A MEMS device fabricated by the above method is also provided.

    摘要翻译： 本公开提供了一种用于制造包括多个基板结合的MEMS装置的方法。 在一个实施例中，一种方法包括提供包括第一结合层的微电子机械系统（MEMS）衬底，提供包括第二接合层的半导体衬底，以及提供包括第三接合层的帽。 该方法还包括在第一和第二接合层处将MEMS衬底接合到半导体衬底，并且在第二和第三接合层处将盖接合到半导体衬底上，以密封MEMS衬底在盖和半导体衬底之间。 还提供了通过上述方法制造的MEMS器件。