公开(公告)号：US20110086468A1

公开(公告)日：2011-04-14

申请号：US12898028

申请日：2010-10-05

申请人： Yacine Felk ,  Hamed Chaabouni ,  Alexis Farcy

发明人： Yacine Felk ,  Hamed Chaabouni ,  Alexis Farcy

IPC分类号： H01L21/50

CPC分类号： H01L24/08 ,  H01L24/03 ,  H01L24/05 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/742 ,  H01L24/80 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/034 ,  H01L2224/035 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05187 ,  H01L2224/08145 ,  H01L2224/085 ,  H01L2224/13025 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/80143 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/80905 ,  H01L2224/80909 ,  H01L2224/83907 ,  H01L2224/9202 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01094 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/05442

摘要： A method for assembling a first semiconductor chip provided with pads on a second semiconductor chip or wafer provided with pads, comprising covering the chip(s) with a dielectric, superposing the two chips, the pads being arranged substantially opposite to each other, and applying a voltage difference between the pads of the first and second chips to cause a breakdown of the dielectric and a diffusion of the conductor forming the pads into the broken down areas, whereby a conductive path forms between the opposite pads.

摘要翻译： 一种在具有衬垫的第二半导体芯片或晶片上组装设置有焊盘的第一半导体芯片的方法，包括用电介质覆盖所述芯片，叠加所述两个芯片，所述焊盘彼此基本相对布置，并且施加 第一和第二芯片的焊盘之间的电压差导致电介质的破坏和形成焊盘的导体的扩散进入破碎区域，从而在相对的焊盘之间形成导电路径。

公开(公告)号：US08704363B2

公开(公告)日：2014-04-22

申请号：US12910229

申请日：2010-10-22

申请人： Yacine Felk ,  Alexis Farcy

发明人： Yacine Felk ,  Alexis Farcy

IPC分类号： H01L23/34

CPC分类号： H01L25/0657 ,  H01L23/38 ,  H01L35/32 ,  H01L35/34 ,  H01L2224/16225 ,  H01L2225/06517

摘要： An interface plate capable of being mounted between first and second surface-mounted electronic chips. The plate includes a plurality of first, second, and third through openings, the first openings being filled with a conductive material and being arranged to be in front of pads of the first and second chips during the assembly, the second openings being filled with a second material, the third openings being filled with a third material, the second and third materials forming two complementary components of a thermoelectric couple.

摘要翻译： 一种能够安装在第一和第二表面安装电子芯片之间的接口板。 板包括多个第一，第二和第三通孔，第一开口填充有导电材料，并且在组装过程中布置成位于第一和第二芯片的垫的前面，第二开口填充有 第二材料，第三开口填充有第三材料，第二和第三材料形成热电偶的两个互补组分。

公开(公告)号：US20110095437A1

公开(公告)日：2011-04-28

申请号：US12910229

申请日：2010-10-22

申请人： Yacine Felk ,  Alexis Farcy

发明人： Yacine Felk ,  Alexis Farcy

IPC分类号： H01L23/34

CPC分类号： H01L25/0657 ,  H01L23/38 ,  H01L35/32 ,  H01L35/34 ,  H01L2224/16225 ,  H01L2225/06517

摘要： An interface plate capable of being mounted between first and second surface-mounted electronic chips. The plate includes a plurality of first, second, and third through openings, the first openings being filled with a conductive material and being arranged to be in front of pads of the first and second chips during the assembly, the second openings being filled with a second material, the third openings being filled with a third material, the second and third materials forming two complementary components of a thermoelectric couple.

摘要翻译： 一种能够安装在第一和第二表面安装电子芯片之间的接口板。 板包括多个第一，第二和第三通孔，第一开口填充有导电材料，并且在组装过程中布置成位于第一和第二芯片的垫的前面，第二开口填充有 第二材料，第三开口填充有第三材料，第二和第三材料形成热电偶的两个互补组分。

公开(公告)号：US08766381B2

公开(公告)日：2014-07-01

申请号：US13230035

申请日：2011-09-12

申请人： Fabrice Casset ,  Lionel Cadix ,  Perceval Coudrain ,  Alexis Farcy ,  Laurent-Luc Chapelon ,  Yacine Felk ,  Pascal Ancey

发明人： Fabrice Casset ,  Lionel Cadix ,  Perceval Coudrain ,  Alexis Farcy ,  Laurent-Luc Chapelon ,  Yacine Felk ,  Pascal Ancey

IPC分类号： H01L29/06

CPC分类号： B81C1/00246 ,  B81B2201/014 ,  B81B2201/0235 ,  B81B2201/0271 ,  B81B2203/0353 ,  B81B2207/012 ,  B81C1/005 ,  G01P15/125 ,  G01P2015/082 ,  H01L2924/0002 ,  H03H3/0073 ,  H03H9/2426 ,  H01L2924/00

摘要： The integrated circuit comprises a support substrate having opposite first and second main surfaces. A cavity passes through the support substrate and connects the first and second main surfaces. The integrated circuit comprises a device with a mobile element, the mobile element and a pair of associated electrodes of which are included in a cavity. An anchoring node of the mobile element is located at the level of the first main surface. The integrated circuit comprises a first elementary chip arranged at the level of the first main surface and electrically connected to the device with a mobile element.

摘要翻译： 集成电路包括具有相对的第一和第二主表面的支撑基板。 空腔通过支撑基板并连接第一和第二主表面。 集成电路包括具有移动元件的装置，移动元件和一对相关联的电极包括在空腔中。 移动元件的锚定节点位于第一主表面的水平面上。 集成电路包括布置在第一主表面的电平处的第一基本芯片，并与移动元件电连接到该装置。

公开(公告)号：US20120074527A1

公开(公告)日：2012-03-29

申请号：US13230035

申请日：2011-09-12

申请人： Fabrice Casset ,  Lionel Cadix ,  Perceval Coudrain ,  Alexis Farcy ,  Laúrent-Lüc Chapelon ,  Yacine Felk ,  Pascal Ancey

发明人： Fabrice Casset ,  Lionel Cadix ,  Perceval Coudrain ,  Alexis Farcy ,  Laúrent-Lüc Chapelon ,  Yacine Felk ,  Pascal Ancey

IPC分类号： H01L29/06 ,  H01L21/283

CPC分类号： B81C1/00246 ,  B81B2201/014 ,  B81B2201/0235 ,  B81B2201/0271 ,  B81B2203/0353 ,  B81B2207/012 ,  B81C1/005 ,  G01P15/125 ,  G01P2015/082 ,  H01L2924/0002 ,  H03H3/0073 ,  H03H9/2426 ,  H01L2924/00

摘要： The integrated circuit comprises a support substrate having opposite first and second main surfaces. A cavity passes through the support substrate and connects the first and second main surfaces. The integrated circuit comprises a device with a mobile element, the mobile element and a pair of associated electrodes of which are included in a cavity. An anchoring node of the mobile element is located at the level of the first main surface. The integrated circuit comprises a first elementary chip arranged at the level of the first main surface and electrically connected to the device with a mobile element.

摘要翻译： 集成电路包括具有相对的第一和第二主表面的支撑基板。 空腔通过支撑基板并连接第一和第二主表面。 集成电路包括具有移动元件的装置，移动元件和一对相关联的电极包括在空腔中。 移动元件的锚定节点位于第一主表面的水平面上。 集成电路包括布置在第一主表面的电平处的第一基本芯片，并与移动元件电连接到该装置。

公开(公告)号：US20120052629A1

公开(公告)日：2012-03-01

申请号：US13222317

申请日：2011-08-31

申请人： Perceval Coudrain ,  Yacine Felk ,  Patrick Lamontagne

发明人： Perceval Coudrain ,  Yacine Felk ,  Patrick Lamontagne

IPC分类号： H01L21/77

CPC分类号： H01L24/92 ,  H01L24/80 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05687 ,  H01L2224/32145 ,  H01L2224/80896 ,  H01L2224/80986 ,  H01L2224/83894 ,  H01L2224/9202 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2224/80895 ,  H01L2924/00

摘要： A three-dimensional integrated structure is fabricated by assembling at least two parts together, wherein each part contains at least one metallic line covered with a covering region and having a free side. A cavity is formed in the covering region of each part, that cavity opening onto the metallic line. The two parts are joined together with the free sides facing each other and the cavities in each covering region aligned with each other. The metallic lines are then electrically joined to each other through an electromigration of the metal within at least one of the metallic lines, the electromigrated material filling the aligned cavities.

摘要翻译： 通过将至少两个部件组装在一起来制造三维一体化结构，其中每个部分包含覆盖有覆盖区域并具有自由侧的至少一个金属线。 在每个部分的覆盖区域中形成空腔，该空腔在金属线上开口。 两个部分连接在一起，自由面彼此面对，并且每个覆盖区域中的空腔彼此对准。 然后金属线通过在至少一个金属线路中的金属的电迁移彼此电连接，电解材料填充对准的空腔。

公开(公告)号：US08828797B2

公开(公告)日：2014-09-09

申请号：US13222317

申请日：2011-08-31

申请人： Perceval Coudrain ,  Yacine Felk ,  Patrick Lamontagne

发明人： Perceval Coudrain ,  Yacine Felk ,  Patrick Lamontagne

IPC分类号： H01L21/77 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC分类号： H01L24/92 ,  H01L24/80 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05687 ,  H01L2224/32145 ,  H01L2224/80896 ,  H01L2224/80986 ,  H01L2224/83894 ,  H01L2224/9202 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2224/80895 ,  H01L2924/00

摘要： A three-dimensional integrated structure is fabricated by assembling at least two parts together, wherein each part contains at least one metallic line covered with a covering region and having a free side. A cavity is formed in the covering region of each part, that cavity opening onto the metallic line. The two parts are joined together with the free sides facing each other and the cavities in each covering region aligned with each other. The metallic lines are then electrically joined to each other through an electromigration of the metal within at least one of the metallic lines, the electromigrated material filling the aligned cavities.

摘要翻译： 通过将至少两个部件组装在一起来制造三维一体化结构，其中每个部分包含覆盖有覆盖区域并具有自由侧的至少一个金属线。 在每个部分的覆盖区域中形成空腔，该空腔在金属线上开口。 两个部分连接在一起，自由面彼此面对，并且每个覆盖区域中的空腔彼此对准。 然后金属线通过在至少一个金属线路中的金属的电迁移彼此电连接，电解材料填充对准的空腔。