公开(公告)号：US20050202621A1

公开(公告)日：2005-09-15

申请号：US10798053

申请日：2004-03-11

申请人： Yam Wong ,  Chee Siew ,  Wei Liu ,  Zuo Shen

发明人： Yam Wong ,  Chee Siew ,  Wei Liu ,  Zuo Shen

IPC分类号： H01L21/8238

CPC分类号： H01L24/48 ,  H01L24/45 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48455 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48997 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00015 ,  H01L2224/05599

摘要： The invention provides a wire bond bonding a wire to a connection pad of an electronic device, and a method of forming the wire bond. A first stitch bond is formed on the connection pad, and a second stitch bond is next formed on the connection pad that is contiguous with the first stitch bond.

摘要翻译： 本发明提供一种将电线连接到电子设备的连接焊盘上的引线键合以及形成引线接合的方法。 在连接焊盘上形成第一缝合接头，接下来形成与第一针迹接合的连接焊盘上的第二缝合。

公开(公告)号：US20050072833A1

公开(公告)日：2005-04-07

申请号：US10677604

申请日：2003-10-02

申请人： Yam Wong ,  Yi Wang ,  Wei Liu

发明人： Yam Wong ,  Yi Wang ,  Wei Liu

IPC分类号： B23K20/00 ,  H01L21/607 ,  B23K31/02

CPC分类号： H01L24/85 ,  B23K20/004 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The invention provides a method of bonding wire between first and second bonding points with a bonding tool, such as a capillary. It comprises the steps of forming a first bond at the first bonding point with the bonding tool, moving the bonding tool away from the first bond by a first distance, then moving the bonding tool towards the first bonding point and coupling the wire to the first bond. Thereafter, the bonding tool is moved away from the first bond by a second distance and a kink is formed in the wire. The bonding tool is subsequently moved to extend a sufficient length of wire to form a wire loop between the first and second bonding points before the bonding tool is moved to the second bonding point to form a second bond. Characteristics of wire bonds formable using the method of the invention are also disclosed.

摘要翻译： 本发明提供了一种使用诸如毛细管的接合工具在第一和第二接合点之间接合线的方法。 它包括以下步骤：在第一接合点处与接合工具形成第一接合，使接合工具远离第一接合移动第一距离，然后将接合工具朝着第一接合点移动并将接合线连接到第一接合点 键。 此后，接合工具从第一接合部移开第二距离，并且在线中形成扭结。 接合工具随后移动以延伸足够长的线，以在接合工具移动到第二接合点之前形成第一和第二接合点之间的线环，以形成第二接合。 还公开了使用本发明的方法可形成的引线键的特征。

公开(公告)号：US20050191839A1

公开(公告)日：2005-09-01

申请号：US10790969

申请日：2004-03-01

申请人： Yam Wong ,  Jin Siong Soh

发明人： Yam Wong ,  Jin Siong Soh

IPC分类号： H01L21/607 ,  H01L29/40

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48463 ,  H01L2224/48477 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The invention provides a wire bond comprising multiple ball bonds and a method of forming the wire bond to bond a wire to a connection pad of an electronic device. The wire bond comprises a first bump ball formed on the connection pad and a second bump ball formed on the connection pad that is contiguous with the first bump ball.

摘要翻译： 本发明提供了一种包括多个球接合的引线接合以及形成引线接合以将电线连接到电子设备的连接焊盘的方法。 引线接合包括形成在连接焊盘上的第一凸块球和形成在连接焊盘上的与第一凸块球相邻的第二凸块球。

公开(公告)号：US20050279805A1

公开(公告)日：2005-12-22

申请号：US10870400

申请日：2004-06-16

申请人： Yam Wong ,  Ka Shing Kwan ,  Chong Chen

发明人： Yam Wong ,  Ka Shing Kwan ,  Chong Chen

IPC分类号： B23K20/00 ,  B23K37/00

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K2101/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/78823 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： A bondhead is provided that comprises a bondhead body for holding a bonding tool, such as an ultrasonic transducer, and a bondhead actuator coupled to the bondhead body for moving the bonding tool with respect to a bonding surface. A wire clamping device, which may comprise a wire clamp holder and a wire clamp, is movable relative to the bondhead body for feeding a bonding wire to the bonding tool. A wire clamping device actuator is operative to move the wire clamping device relative to the bondhead body for improved control of the feeding of bonding wire to the bonding tool.

摘要翻译： 提供了一种接合头，其包括用于保持诸如超声波换能器的接合工具的接合头体和耦合到接合头体的接合头致动器，用于相对于接合表面移动接合工具。 可以包括线夹保持器和线夹的线夹装置可相对于接合头体移动，用于将接合线馈送到接合工具。 线夹紧装置致动器可操作以相对于接合头体移动线夹装置，以改善对接合工具的接合线的馈送的控制。

公开(公告)号：US20060175377A1

公开(公告)日：2006-08-10

申请号：US11052551

申请日：2005-02-07

申请人： Bao Zhai ,  Ka Kwan ,  Man Chan ,  Chi Chong ,  Yam Wong ,  Hing Li

发明人： Bao Zhai ,  Ka Kwan ,  Man Chan ,  Chi Chong ,  Yam Wong ,  Hing Li

IPC分类号： B23K37/00

CPC分类号： H01L24/85 ,  B23K20/005 ,  B23K20/10 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/78308 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00015

摘要： A capillary holder for mounting a capillary onto a horn is provided that comprises a mounting hole formed in the horn that has a first width along a first axis that is smaller than a width of the capillary and a second width along a second axis perpendicular to the first axis that is larger than the width of the capillary. In particular, the mounting hole is configured such that application of a flexion force to reduce the second width simultaneously expands the first width so as to fit the capillary when the first width is larger than the width of the capillary, and removal of said flexion force contracts the first width whereby to grip the capillary using an elastic force of the horn.

摘要翻译： 提供了一种用于将毛细管安装在喇叭上的毛细管支架，其包括形成在喇叭中的安装孔，沿着第一轴线具有小于毛细管宽度的第一宽度，以及沿垂直于毛细管的第二轴线的第二宽度 第一轴比毛细管的宽度大。 特别地，安装孔被构造成使得施加屈曲力以减小第二宽度同时地扩大第一宽度，以便当第一宽度大于毛细管的宽度时适合毛细管，并且去除所述弯曲力 收缩第一宽度，从而使用喇叭的弹力来夹紧毛细管。

公开(公告)号：US20060032894A1

公开(公告)日：2006-02-16

申请号：US10918673

申请日：2004-08-13

申请人： Yam Wong

发明人： Yam Wong

IPC分类号： B23K31/02

CPC分类号： H01L24/85 ,  B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48451 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78301 ,  H01L2224/8518 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85206 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A wire bonding method and a wire bond formed from the method are provided to improve shear strength of a wire that is connected to a bonding surface. The wire bond includes a bonded wire having a base in contact with the bonding surface, a recessed portion formed substantially at an edge of the bonded wire wherein at least a portion of an underside of the recessed portion is in contact with the bonding surface, and a length of wire extending from the recessed portion.

摘要翻译： 提供由该方法形成的引线接合方法和引线键合以提高连接到接合表面的导线的剪切强度。 导线接合包括具有与接合表面接触的基部的接合线，基本上形成在接合线的边缘处的凹部，其中凹部的下侧的至少一部分与接合表面接触，以及 从凹部延伸的线的长度。

公开(公告)号：US20050001018A1

公开(公告)日：2005-01-06

申请号：US10612383

申请日：2003-07-01

申请人： Ka Kwan ,  Guoshen Hu ,  Tingyu He ,  Yie Mi ,  Yam Wong

发明人： Ka Kwan ,  Guoshen Hu ,  Tingyu He ,  Yie Mi ,  Yam Wong

IPC分类号： H01L21/60 ,  H01L21/687 ,  H01L23/485 ,  B23K37/00 ,  B23K31/02 ,  B23K35/24 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/68764 ,  H01L24/10 ,  H01L2924/01078 ,  H01L2924/01079

摘要： The invention provides an apparatus and a method for forming conductive bumps on a plurality of semiconductor devices with an oxidizable material. The apparatus comprises a bump forming device, a chamber system adapted to house the semiconductor devices and a gas supply for supplying an inert gas into the chamber system. A support table is provided for supporting the semiconductor devices during bumping, and the said support table is operative to move the semiconductor devices from a bumping site into the chamber system after bumping.

摘要翻译： 本发明提供了一种在具有可氧化材料的多个半导体器件上形成导电凸块的装置和方法。 该装置包括凸块形成装置，适于容纳半导体装置的室系统和用于将惰性气体供应到室系统中的气体供应装置。 提供了用于在凸起期间支撑半导体器件的支撑台，并且所述支撑台可操作以在撞击之后将半导体器件从凸起部位移动到腔室系统中。