公开(公告)号：US20050029673A1

公开(公告)日：2005-02-10

申请号：US10941570

申请日：2004-09-14

申请人： Yasuhiro Naka ,  Naotaka Tanaka ,  Ikuo Yoshida ,  Satoshi Imasu ,  Takahiro Naito

发明人： Yasuhiro Naka ,  Naotaka Tanaka ,  Ikuo Yoshida ,  Satoshi Imasu ,  Takahiro Naito

IPC分类号： H01L25/10 ,  H01L21/304 ,  H01L21/56 ,  H01L23/12 ,  H01L23/36 ,  H01L23/538 ,  H01L23/552 ,  H01L25/18 ,  H01L23/52

CPC分类号： H01L23/538 ,  H01L21/563 ,  H01L23/36 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/0401

摘要： In a multi-chip-module type semiconductor device, first and second semiconductor elements, a main component of each of the semiconductor elements being semiconductor material to form a semiconductor electric circuit in each of the semiconductor elements, are mounted on and electrically connected to a substrate adapted to be mounted onto a mother board and to be electrically connected to the mother board so that the each of the semiconductor elements is electrically connected to the mother board through the substrate.

摘要翻译： 在多芯片模块型半导体器件中，第一和第二半导体元件，每个半导体元件的主要部件是半导体材料，用于在每个半导体元件中形成半导体电路，安装在电连接到 衬底，其适于安装在母板上并与母板电连接，使得每个半导体元件通过衬底电连接到母板。

公开(公告)号：US20060197204A1

公开(公告)日：2006-09-07

申请号：US11404135

申请日：2006-04-14

申请人： Yasuhiro Naka ,  Naotaka Tanaka ,  Ikuo Yoshida ,  Satoshi Imasu ,  Takahiro Naito

发明人： Yasuhiro Naka ,  Naotaka Tanaka ,  Ikuo Yoshida ,  Satoshi Imasu ,  Takahiro Naito

IPC分类号： H01L23/02

CPC分类号： H01L21/563 ,  H01L25/0655 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/0401

摘要： In a semiconductor device adapted to be mounted on a board and to be electrically connected to the board, comprising, at least two semiconductor electric chips, and a substrate on which the semiconductor electric chips are mounted and to which the semiconductor electric chips are electrically connected, in such a manner that the semiconductor electric chips are mounted on and electrically connected to the board through the substrate, according to the present invention, a thickness of each of the semiconductor electric chips in a direction in which the each of the semiconductor electric chips and the substrate are stacked is smaller than a thickness of the substrate in the direction.

公开(公告)号：US07057278B2

公开(公告)日：2006-06-06

申请号：US10741637

申请日：2003-12-18

申请人： Yasuhiro Naka ,  Naotaka Tanaka ,  Ikuo Yoshida ,  Satoshi Imasu ,  Takahiro Naito

发明人： Yasuhiro Naka ,  Naotaka Tanaka ,  Ikuo Yoshida ,  Satoshi Imasu ,  Takahiro Naito

IPC分类号： H01L23/34

CPC分类号： H01L21/563 ,  H01L25/0655 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/0401

摘要： In a semiconductor device adapted to be mounted on a board and to be electrically connected to the board, comprising, at least two semiconductor electric chips, and a substrate on which the semiconductor electric chips are mounted and to which the semiconductor electric chips are electrically connected, in such a manner that the semiconductor electric chips are mounted on and electrically connected to the board through the substrate, according to the present invention, a thickness of each of the semiconductor electric chips in a direction in which the each of the semiconductor electric chips and the substrate are stacked is smaller than a thickness of the substrate in the direction.

公开(公告)号：US06800945B2

公开(公告)日：2004-10-05

申请号：US10117845

申请日：2002-04-05

申请人： Yasuhiro Naka ,  Naotaka Tanaka ,  Ikuo Yoshida ,  Satoshi Imasu ,  Takahiro Naito

发明人： Yasuhiro Naka ,  Naotaka Tanaka ,  Ikuo Yoshida ,  Satoshi Imasu ,  Takahiro Naito

IPC分类号： H01L230602

CPC分类号： H01L23/538 ,  H01L21/563 ,  H01L23/36 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/0401

摘要： In a multi-chip-module type semiconductor device, first and second semiconductor elements, a main component of each of the semiconductor elements being semiconductor material to form a semiconductor electric circuit in each of the semiconductor elements, are mounted on and electrically connected to a substrate adapted to be mounted onto a mother board and to be electrically connected to the mother board so that the each of the semiconductor elements is electrically connected to the mother board through the substrate.

摘要翻译： 在多芯片模块型半导体器件中，第一和第二半导体元件，每个半导体元件的主要部件是半导体材料，用于在每个半导体元件中形成半导体电路，安装在电连接到 衬底，其适于安装在母板上并与母板电连接，使得每个半导体元件通过衬底电连接到母板。

公开(公告)号：US07365426B2

公开(公告)日：2008-04-29

申请号：US11404135

申请日：2006-04-14

申请人： Yasuhiro Naka ,  Naotaka Tanaka ,  Ikuo Yoshida ,  Satoshi Imasu ,  Takahiro Naito

发明人： Yasuhiro Naka ,  Naotaka Tanaka ,  Ikuo Yoshida ,  Satoshi Imasu ,  Takahiro Naito

IPC分类号： H01L23/34

CPC分类号： H01L21/563 ,  H01L25/0655 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/0401

摘要： In a semiconductor device adapted to be mounted on a board and to be electrically connected to the board, comprising, at least two semiconductor electric chips, and a substrate on which the semiconductor electric chips are mounted and to which the semiconductor electric chips are electrically connected, in such a manner that the semiconductor electric chips are mounted on and electrically connected to the board through the substrate, according to the present invention, a thickness of each of the semiconductor electric chips in a direction in which the each of the semiconductor electric chips and the substrate are stacked is smaller than a thickness of the substrate in the direction.

摘要翻译： 在适于安装在板上并与板电连接的半导体器件中，包括至少两个半导体电芯片，以及其上安装有半导体电芯片的衬底，半导体电芯片电连接到该衬底上 以半导体电子芯片通过基板安装在基板上并与其电连接的方式，根据本发明，半导体电子芯片的每个半导体电芯片的厚度 并且基板被堆叠成小于基板在该方向上的厚度。

公开(公告)号：US06727583B2

公开(公告)日：2004-04-27

申请号：US10093639

申请日：2002-03-07

申请人： Yasuhiro Naka ,  Naotaka Tanaka ,  Ikuo Yoshida ,  Satoshi Imasu ,  Takahiro Naito

发明人： Yasuhiro Naka ,  Naotaka Tanaka ,  Ikuo Yoshida ,  Satoshi Imasu ,  Takahiro Naito

IPC分类号： H01L2334

CPC分类号： H01L21/563 ,  H01L25/0655 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/0401

摘要： In a semiconductor device adapted to be mounted on a board and to be electrically connected to the board, comprising, at least two semiconductor electric chips, and a substrate on which the semiconductor electric chips are mounted and to which the semiconductor electric chips are electrically connected, in such a manner that the semiconductor electric chips are mounted on and electrically connected to the board through the substrate, according to the present invention, a thickness of each of the semiconductor electric chips in a direction in which the each of the semiconductor electric chips and the substrate are stacked is smaller than a thickness of the substrate in the direction.

公开(公告)号：US08378459B2

公开(公告)日：2013-02-19

申请号：US12795950

申请日：2010-06-08

申请人： Yasuhiro Naka ,  Naotaka Tanaka ,  Toshihide Uematsu ,  Chuichi Miyazaki ,  Kazunari Suzuki ,  Yasuyuki Nakajima ,  Yoshiyuki Abe ,  Kenji Kohzu ,  Kosuke Kitaichi ,  Shinya Ogane

发明人： Yasuhiro Naka ,  Naotaka Tanaka ,  Toshihide Uematsu ,  Chuichi Miyazaki ,  Kazunari Suzuki ,  Yasuyuki Nakajima ,  Yoshiyuki Abe ,  Kenji Kohzu ,  Kosuke Kitaichi ,  Shinya Ogane

IPC分类号： H01L23/544

CPC分类号： H01L24/11 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/06102 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01052 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/01064 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/10158 ,  H01L2924/1306 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00014

摘要： In a state where an adhesive tape is attached onto a main surface of a semiconductor wafer, a trench is formed in a rear surface of the semiconductor wafer. For forming the trench in the rear surface of the semiconductor wafer, after coating a resist film on the rear surface of the semiconductor wafer, the resist film is patterned by using the photolithography technology. The patterning of the resist film is performed so as not to leave the resist film in the region where the trench is to be formed. Then, the trench is formed in a predetermined region of the semiconductor wafer by the dry etching technology using the patterned resist film as a mask. Specifically, the trench is formed in the region near the dicing line.

摘要翻译： 在粘合带附着到半导体晶片的主表面上的状态下，在半导体晶片的后表面上形成沟槽。 为了在半导体晶片的后表面中形成沟槽，在半导体晶片的后表面上涂覆抗蚀剂膜之后，通过使用光刻技术对抗蚀剂膜进行构图。 进行抗蚀剂膜的图案化，以便不在要形成沟槽的区域中留下抗蚀剂膜。 然后，通过使用图案化的抗蚀剂膜作为掩模的干蚀刻技术，在半导体晶片的预定区域中形成沟槽。 具体地说，在切割线附近的区域形成沟槽。

公开(公告)号：US20140062627A1

公开(公告)日：2014-03-06

申请号：US14116226

申请日：2012-04-03

申请人： Yasuhiro Naka ,  Kouetsu Takaya ,  Kenji Suzuki ,  Osamu Kashimura

发明人： Yasuhiro Naka ,  Kouetsu Takaya ,  Kenji Suzuki ,  Osamu Kashimura

IPC分类号： H01H50/54

CPC分类号： H01H50/54 ,  H01H1/54 ,  H01H9/34 ,  H01H9/443 ,  H01H50/42 ,  H01H50/546 ,  H01H2050/025

摘要： An electromagnetic contactor has a contact device including a pair of fixed contacts disposed maintaining a predetermined distance and a movable contact disposed to be capable of contacting to and separating from the pair of fixed contacts. The pair of fixed contacts each includes a support conductor portion supported by an upper plate of a contact housing case, and a contact conductor portion connected to an end portion of the support conductor portion. The contact conductor portion includes a contact plate portion formed with a contact portion, and a connecting plate portion formed on an outer end portion of the contact plate portion and extending to the upper plate side. The movable contact is mounted onto a connecting shaft connected to a drive portion through a contact spring on an end portion on the upper plate side, and disposed to face the contact portion of the pair of fixed contacts.

摘要翻译： 电磁接触器具有接触装置，该接触装置包括保持预定距离的一对固定触点和设置成能够接触和分离一对固定触点的可动触点。 一对固定触点各自包括由触点外壳的上板支撑的支撑导体部分和连接到支撑导体部分的端部的接触导体部分。 接触导体部分包括形成有接触部分的接触板部分和形成在接触板部分的外端部并延伸到上板侧的连接板部分。 可动触头通过上板侧的端部上的接触弹簧安装在与驱动部连接的连接轴上，并配置成与一对固定触头的接触部相对。

公开(公告)号：US20130328647A1

公开(公告)日：2013-12-12

申请号：US13981023

申请日：2012-04-03

申请人： Yasuhiro Naka ,  Kouetsu Takaya ,  Kenji Suzuki ,  Hiroyuki Tachikawa

发明人： Yasuhiro Naka ,  Kouetsu Takaya ,  Kenji Suzuki ,  Hiroyuki Tachikawa

IPC分类号： H01H50/58

CPC分类号： H01H50/58 ,  H01H1/20 ,  H01H1/54 ,  H01H50/36 ,  H01H50/42 ,  H01H50/546 ,  H01H51/2209 ,  H01H2050/025

摘要： An electromagnetic contactor has a pair of fixed contacts; a movable contact disposed to be capable of contacting with and separating from the pair of fixed contacts; and an electromagnetic unit driving the movable contact. The electromagnetic unit has a magnetic yoke having an open upper part; an upper magnetic yoke cross-linked in the open upper part of the magnetic yoke; a spool having a central opening in which an exciting coil is wound around the spool; a movable plunger movably disposed in the central opening of the spool in an axial direction and having a tip end protruding, the movable plunger urged by a return spring; and an auxiliary yoke forming a magnetic path between the movable plunger and the U-shaped magnetic yoke when the movable plunger is in an open position. The movable plunger is coupled to the movable contact through a coupling shaft.

摘要翻译： 电磁接触器具有一对固定触点; 设置成能够与所述一对固定触点接触和分离的可动触头; 以及驱动可动触点的电磁单元。 电磁单元具有开放上部的磁轭; 在磁轭的开放上部交叉的上磁轭; 具有中心开口的线轴，其中励磁线圈缠绕在所述线轴上; 可移动柱塞，其沿轴向可移动地设置在所述卷轴的中心开口中，并且具有顶端突出，所述可移动柱塞由复位弹簧推动; 以及辅助磁轭，当可动柱塞处于打开位置时，在可动柱塞与U形磁轭之间形成磁路。 可移动柱塞通过联接轴联接到可动触头。

公开(公告)号：US08570125B2

公开(公告)日：2013-10-29

申请号：US13519782

申请日：2011-06-14

申请人： Kenji Suzuki ,  Yasuhiro Naka ,  Kouetsu Takaya ,  Yuichi Yamamoto ,  Yuji Shiba

发明人： Kenji Suzuki ,  Yasuhiro Naka ,  Kouetsu Takaya ,  Yuichi Yamamoto ,  Yuji Shiba

IPC分类号： H01H3/00

CPC分类号： H01H50/546 ,  H01H50/34

摘要： An electromagnetic switch has a contact device having a pair of fixed contacts fixed thereof and maintaining a predetermined interval inside an arc-extinguishing chamber receptacle, and a movable contact disposed to be connectable with the pair of fixed contacts; and an electromagnetic device driving the movable contact. The electromagnetic device has a cylindrical exciting coil, a fixed core passing through center of the exciting coil, a magnetic yoke covering an outer side of the exciting coil, and a movable core facing the fixed core and the magnetic yoke, and armature surfaces of the fixed core and the magnetic yoke are formed on a side of the contact device than the exciting coil.

摘要翻译： 电磁开关具有接触装置，其具有固定的一对固定触点，并且在灭弧室插座内保持预定的间隔;以及可动触头，其设置成可与所述一对固定触头连接; 以及驱动可动触头的电磁装置。 电磁装置具有圆柱形励磁线圈，通过励磁线圈的中心的固定铁芯，覆盖励磁线圈外侧的磁轭和面向固定铁心和磁轭的可动铁芯，以及 固定铁芯和磁轭形成在接触装置的比励磁线圈的一侧。