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公开(公告)号：US20110108875A1
公开(公告)日：2011-05-12
申请号：US13001355
申请日：2009-06-05
申请人： Yasuji Takenaka , Masashi Takemoto , Nobuaki Aoki
发明人： Yasuji Takenaka , Masashi Takemoto , Nobuaki Aoki
CPC分类号： H01L33/52 , H01L24/45 , H01L27/156 , H01L33/44 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48247 , H01L2224/8592 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： There is provided a light emitting device highly resistant to the environment, and having good heat resistance, light resistance and gas barrier property, and a method for producing same. With the light emitting device, a substrate 2 and interconnect patterns 5A, 5B formed on the surface thereof are covered with an acrylic resin primer 10 having better gas barrier property than a silicone resin sealing resin part 3. Light resistance is ensured by the silicone resin sealing resin portion 3 and the gas barrier property can be ensured by the acrylic resin primer 10.
摘要翻译： 提供了对环境高度耐受并具有良好的耐热性，耐光性和阻气性的发光器件及其制造方法。 利用发光装置，在其表面上形成的基板2和布线图案5A，5B被具有比硅树脂密封树脂部件3更好的阻气性的丙烯酸树脂底漆10覆盖。通过硅树脂确保耐光性 通过丙烯酸树脂底漆10可以确保密封树脂部分3和阻气性。
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公开(公告)号：US20100053498A1
公开(公告)日：2010-03-04
申请号：US12596789
申请日：2008-06-18
IPC分类号： G02F1/1335 , F21V7/04 , F21V7/00
CPC分类号： G02B6/0031 , G02B6/005
摘要： A backlight device (10) includes: an LED package (12) including an LED chip (12A) and an Ag reflective layer (12B); and an optical member (for example, a prism sheet (16)) for adjusting light emitted from the LED package (12). The optical member (16) adjusts an amount of a halogen thus contained and the like so that emission of halogen is decreased to a degree in which no silver halide is generated on the Ag reflective layer (12B).
摘要翻译： 背光装置（10）包括：LED封装（12），包括LED芯片（12A）和Ag反射层（12B）; 以及用于调整从LED封装（12）发射的光的光学构件（例如，棱镜片（16））。 光学构件（16）调节如此含有的卤素的量等，使得卤素的发射降低到在Ag反射层（12B）上不产生卤化银的程度。
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3.发明申请Light emitting element, production method thereof, backlight unit having the light emitting element, and production method thereof 审中-公开发光元件及其制造方法，具有发光元件的背光单元及其制造方法公开(公告)号：US20070114555A1
公开(公告)日：2007-05-24
申请号：US11603885
申请日：2006-11-22
IPC分类号： H01L33/00
CPC分类号： H01L33/483 , G02B6/0031 , G02B6/0073 , G02B6/0083 , H01L25/0753 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/647 , H01L2224/48227 , H01L2924/181 , H01L2924/18301 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting element includes: A light emitting element, includes: at least one LED chip provided on an installation surface of a substrate; a metallic reflecting plate, provided upright in a light projecting direction of the LED chip on the installation surface so as to surround an entire periphery of the LED chip, the metallic reflecting plate reflecting light projected from the LED chip to guide the light to a light projecting surface provided in the light projecting direction; and a first metallic portion and a second metallic portion, respectively connected to the LED chip as electrode terminals for supplying a driving current to the LED chip, each being formed in an area surrounded by the metallic reflecting plate on the installation surface, wherein an insulating section is formed surrounding the second metallic portion, to electrically insulate the second metallic portion from other portion in the area, and the first metallic portion is formed outside the insulating section in the area as an installation surface metallic reflecting film so as to be in contact with the metallic reflecting plate.
摘要翻译： 发光元件包括：发光元件，包括：设置在基板的安装表面上的至少一个LED芯片; 金属反射板，其在LED芯片的光投射方向上在安装面上竖立设置以围绕LED芯片的整个周边，金属反射板反射从LED芯片投射的光，以将光引导到光 突出表面设置在光投射方向上; 以及分别连接到LED芯片的第一金属部分和第二金属部分，作为用于向LED芯片提供驱动电流的电极端子，每个形成在由安装表面上的金属反射板包围的区域中，其中绝缘 形成围绕第二金属部分的部分，以将第二金属部分与该区域中的其它部分电绝缘，并且第一金属部分形成在作为安装表面金属反射膜的区域中的绝缘部分的外部以便接触 与金属反射板。
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公开(公告)号：US20080101072A1
公开(公告)日：2008-05-01
申请号：US11926703
申请日：2007-10-29
申请人： Kiyohisa Ohta , Masashi Takemoto , Nobuo Ogata
发明人： Kiyohisa Ohta , Masashi Takemoto , Nobuo Ogata
摘要： A light emitter includes reflectors that are spaced apart by a short distance to reduce a thickness of the light emitter. A fabrication method of such light emitters, and an image display using such light emitters are also provided. A light emitter includes: an LED chip 7, reflectors 2 provided on both sides of the LED chip 7, and a second resin layer 4 on which the LED chip 7 and the reflectors 2 are provided. Reflecting faces 9 of the reflectors 2 reflect light emitted by the LED chip 7. In the light emitter, the reflecting faces 9 of the reflectors 2 are formed perpendicular to the second resin layer 4 on which the LED chip 7 is provided.
摘要翻译： 光发射器包括间隔开短距离的反射器，以减小光发射器的厚度。 还提供了这种发光体的制造方法和使用这种发光体的图像显示。 光发射器包括：LED芯片7，设置在LED芯片7的两侧的反射器2，以及设置有LED芯片7和反射器2的第二树脂层4。 反射镜2的反射面9反射由LED芯片7发出的光。 在光发射器中，反射器2的反射面9垂直于设置有LED芯片7的第二树脂层4形成。
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公开(公告)号：US08300177B2
公开(公告)日：2012-10-30
申请号：US12596789
申请日：2008-06-18
IPC分类号： G02F1/1335
CPC分类号： G02B6/0031 , G02B6/005
摘要： A backlight device (10) includes: an LED package (12) including an LED chip (12A) and an Ag reflective layer (12B); and an optical member (for example, a prism sheet (16)) for adjusting light emitted from the LED package (12). The optical member (16) adjusts an amount of a halogen thus contained and the like so that emission of halogen is decreased to a degree in which no silver halide is generated on the Ag reflective layer (12B).
摘要翻译： 背光装置（10）包括：LED封装（12），包括LED芯片（12A）和Ag反射层（12B）; 以及用于调整从LED封装（12）发射的光的光学构件（例如，棱镜片（16））。 光学构件（16）调节如此含有的卤素的量等，使得卤素的发射降低到在Ag反射层（12B）上不产生卤化银的程度。
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公开(公告)号：US08052880B2
公开(公告)日：2011-11-08
申请号：US12121030
申请日：2008-05-15
IPC分类号： C25F5/00
CPC分类号： H01L33/60 , H01L24/48 , H01L24/85 , H01L33/486 , H01L2224/48091 , H01L2224/48235 , H01L2224/48464 , H01L2224/85 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/15153 , Y10T29/49167 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A method for manufacturing a light reflecting metal wall including a step (a) forming a cavity structure on a metal plate on which back surface a substrate is laminated, the cavity structure including on its side wall a light reflecting wall, the step (a) including the steps of (b) forming a first mask on a surface of the metal plate, the first mask having a mask opening portion corresponding to an opening portion of the cavity structure, and (c) forming the light reflecting wall on a side wall of the metal plate by carrying out wet etching with respect to the metal plate with the first mask, in the step (c), in the middle of the wet etching, the first mask being bent by press working along the light reflecting wall formed by the wet etching. As a result, the light reflecting metal wall is stably formed by securing both (i) an area of an LED chip mounting surface and (ii) a thickness of the light reflecting metal wall even if a packaged light-emitting element has a narrow lateral width of its short side.
摘要翻译： 一种制造光反射金属壁的方法，该方法包括：在层压背衬表面的金属板上形成空腔结构的步骤（a），其侧壁上包括光反射壁，所述工序（a） 包括以下步骤：（b）在金属板的表面上形成第一掩模，第一掩模具有对应于空腔结构的开口部分的掩模开口部分，以及（c）在侧壁上形成光反射壁 在步骤（c）中，在湿式蚀刻的中间，通过对具有第一掩模的金属板进行湿式蚀刻，第一掩模通过沿着由 湿蚀刻。 结果，即使封装的发光元件具有狭窄的侧面，也可以通过确保（i）LED芯片安装表面的面积和（ii）光反射金属壁的厚度来稳定地形成光反射金属壁 宽边的短边。
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公开(公告)号：US20080283492A1
公开(公告)日：2008-11-20
申请号：US12121030
申请日：2008-05-15
IPC分类号： C25F5/00
CPC分类号： H01L33/60 , H01L24/48 , H01L24/85 , H01L33/486 , H01L2224/48091 , H01L2224/48235 , H01L2224/48464 , H01L2224/85 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/15153 , Y10T29/49167 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A method for manufacturing a light reflecting metal wall including a step (a) forming a cavity structure on a metal plate on which back surface a substrate is laminated, the cavity structure including on its side wall a light reflecting wall, the step (a) including the steps of (b) forming a first mask on a surface of the metal plate, the first mask having a mask opening portion corresponding to an opening portion of the cavity structure, and (c) forming the light reflecting wall on a side wall of the metal plate by carrying out wet etching with respect to the metal plate with the first mask, in the step (c), in the middle of the wet etching, the first mask being bent by press working along the light reflecting wall formed by the wet etching. As a result, the light reflecting metal wall is stably formed by securing both (i) an area of an LED chip mounting surface and (ii) a thickness of the light reflecting metal wall even if a packaged light-emitting element has a narrow lateral width of its short side.
摘要翻译： 一种制造光反射金属壁的方法，该方法包括：在层压背衬表面的金属板上形成空腔结构的步骤（a），其侧壁上包括光反射壁，所述工序（a） 包括以下步骤：（b）在金属板的表面上形成第一掩模，第一掩模具有对应于空腔结构的开口部分的掩模开口部分，以及（c）在侧壁上形成光反射壁 在步骤（c）中，在湿式蚀刻的中间，通过对具有第一掩模的金属板进行湿式蚀刻，第一掩模通过沿着由 湿蚀刻。 结果，即使封装的发光元件具有狭窄的侧面，也可以通过确保（i）LED芯片安装表面的面积和（ii）光反射金属壁的厚度来稳定地形成光反射金属壁 宽边的短边。
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