LIGHT EMITTING DIODE DEVICE AND PRODUCING METHOD THEREOF
    5.
    发明申请
    LIGHT EMITTING DIODE DEVICE AND PRODUCING METHOD THEREOF 有权
    发光二极管器件及其制造方法

    公开(公告)号:US20120248484A1

    公开(公告)日:2012-10-04

    申请号:US13429681

    申请日:2012-03-26

    IPC分类号: H01L33/50

    摘要: A method for producing a light emitting diode device includes the steps of preparing a base board; allowing a light semiconductor layer where an electrode portion is provided at one side in a thickness direction to be disposed in opposed relation to the base board, and the electrode portion to be electrically connected to a terminal, so that the light semiconductor layer is flip-chip mounted on the base board; forming an encapsulating resin layer containing a light reflecting component at the other side of the base board so as to cover the light semiconductor layer and the electrode portion; removing the other side portion of the encapsulating resin layer so as to expose the light semiconductor layer; and forming a phosphor layer formed in a sheet state so as to be in contact with the other surface of the light semiconductor layer.

    摘要翻译: 一种发光二极管装置的制造方法,其特征在于,具备准备基板的工序, 允许在与厚度方向一侧设置电极部分的光半导体层相对于基板设置,并且电极部分与端子电连接,使得光半导体层被翻转, 芯片安装在基板上; 在所述基板的另一侧形成包含光反射部件的封装树脂层,以覆盖所述光半导体层和所述电极部分; 去除封装树脂层的另一侧部分以暴露光半导体层; 以及形成为片状状的荧光体层,以便与所述光半导体层的另一个表面接触。

    INSPECTION METHOD OF LIGHT-EMITTING DEVICE AND PROCESSING METHOD AFTER INSPECTION OF LIGHT-EMITTING DEVICE
    7.
    发明申请
    INSPECTION METHOD OF LIGHT-EMITTING DEVICE AND PROCESSING METHOD AFTER INSPECTION OF LIGHT-EMITTING DEVICE 审中-公开
    发光装置的检查方法和检测发光装置后的处理方法

    公开(公告)号:US20120028375A1

    公开(公告)日:2012-02-02

    申请号:US13190738

    申请日:2011-07-26

    IPC分类号: H01L21/66 G01R31/00

    摘要: The present invention relates to a method for inspecting a light-emitting device, the method including performing a light emission test of (A) a light-emitting device including a lead frame having mounted and packaged thereon a plurality of light-emitting elements or (B) a light-emitting device obtained by resin encapsulating and packaging the light-emitting device (A), by applying a current to the plurality of light-emitting elements and judging each light-emitting element as passed or failed, in which arrangement of the plurality of light-emitting elements in the light-emitting device is set as in the following (α): (α) In a lead frame having a lattice form including a plurality of rows and a plurality of columns with a plurality of intersection points formed thereby, a plurality of light-emitting elements are disposed between the adjacent intersection points in each row, the adjacent light-emitting elements in each row are connected to each other so that positive electrode terminals or negative electrode terminals thereof face each other, and a positive-side power supply channel or a negative-side power-supply channel in the lead frame works as a common channel between a certain column and a column adjacent thereto.

    摘要翻译: 本发明涉及一种用于检查发光器件的方法,该方法包括:(A)包括引线框的发光器件的发光测试,其中安装并封装有多个发光元件或( B)通过对所述发光元件(A)封装并封装所述发光元件而得到的发光元件,通过向所述多个发光元件施加电流,判定通过或失败的各发光元件, 发光装置中的多个发光元件如以下(α)所示设定:(α)在具有多列的格子状的引线框和具有多个交点的多个列 由此,在各列的相邻交点之间配置多个发光元件,将各行的各相邻的发光元件彼此连接,使正极端子 ls或其负极端子彼此面对,并且引线框架中的正侧电源通道或负侧电源通道作为与其相邻的特定列和列之间的公共通道。