摘要:
A reflecting material contains a silicone resin composition prepared from a polysiloxane containing silanol groups at both ends, an ethylenic silicon compound, a silicon compound containing an epoxy group, an organohydrogenpolysiloxane, a condensation catalyst, and an addition catalyst; and a light reflecting component.
摘要:
A sealing member includes an elongated releasing film, and a plurality of sealing resin layers composed of a sealing resin, the plurality of sealing resin layers being laminated on the releasing film so that the plurality of sealing resin layers are arranged in a row along the longitudinal direction of the releasing film with a space provided therebetween.
摘要:
A light emitting diode sealing member includes a light emitting diode sealing layer, and a lens mold layer laminated on the light emitting diode sealing layer.
摘要:
A method for producing a light emitting diode device includes the steps of preparing a base board; allowing a light semiconductor layer where an electrode portion is provided at one side in a thickness direction to be disposed in opposed relation to the base board, and the electrode portion to be electrically connected to a terminal, so that the light semiconductor layer is flip-chip mounted on the base board; forming an encapsulating resin layer containing a light reflecting component at the other side of the base board so as to cover the light semiconductor layer and the electrode portion; removing the other side portion of the encapsulating resin layer so as to expose the light semiconductor layer; and forming a phosphor layer formed in a sheet state so as to be in contact with the other surface of the light semiconductor layer.
摘要:
A transfer sheet for a phosphor layer includes a release substrate, a phosphor layer formed on the release substrate, and an adhesive layer formed on the phosphor layer.
摘要:
The present invention relates to a method for inspecting a light-emitting device, the method including performing a light emission test of (A) a light-emitting device including a lead frame having mounted and packaged thereon a plurality of light-emitting elements or (B) a light-emitting device obtained by resin encapsulating and packaging the light-emitting device (A), by applying a current to the plurality of light-emitting elements and judging each light-emitting element as passed or failed, in which arrangement of the plurality of light-emitting elements in the light-emitting device is set as in the following (α): (α) In a lead frame having a lattice form including a plurality of rows and a plurality of columns with a plurality of intersection points formed thereby, a plurality of light-emitting elements are disposed between the adjacent intersection points in each row, the adjacent light-emitting elements in each row are connected to each other so that positive electrode terminals or negative electrode terminals thereof face each other, and a positive-side power supply channel or a negative-side power-supply channel in the lead frame works as a common channel between a certain column and a column adjacent thereto.
摘要:
A component for a light-emitting device includes a sealing resin layer that is capable of sealing in a light emitting diode, a fluorescent layer that is formed on one face of the sealing resin layer and is capable of emitting fluorescent light, and a reflection layer that is provided on the other face of the sealing resin layer so as to avoid a region where the sealing resin layer seals in the light emitting diode and is capable of reflecting the light.
摘要:
A phosphor ceramic includes at least one fluorescent layer that is capable of emitting fluorescent light; and at least one non-fluorescent layer that does not emit fluorescent light and is laminated onto the fluorescent layer.
摘要:
A reflecting resin sheet provides a reflecting resin layer at the side of a light emitting diode element and includes a first release substrate and the reflecting resin layer provided on one surface in a thickness direction of the first release substrate. In the first release substrate and the reflecting resin layer, a through hole extending therethrough in the thickness direction is formed corresponding to the light emitting diode element so as to allow an inner circumference surface of the through hole in the reflecting resin layer to be disposed in opposed relation to a side surface of the light emitting diode element.