摘要:
A nitride-based semiconductor device includes a substrate made of a nitride-based semiconductor, a device layer formed on the substrate, and an electrode formed on a surface of the substrate opposite to the device layer. The substrate includes a first surface having a nonpolar plane or a semipolar plane, a second surface opposite to the first surface, a defect concentration region extending in a direction inclined with respect to a normal direction of the first surface from the first surface toward the second surface and penetrating to the second surface and a current path region separated from other region of the substrate by the defect concentration region employed as a boundary, the defect concentration region is not exposed on the first surface, and the electrode is formed on the second surface in the current path region.
摘要:
A method of manufacturing a semiconductor laser device comprises steps of forming a first semiconductor laser device substrate having first grooves for cleavage on a surface thereof, bonding a second semiconductor laser device substrate onto the surface side having the first grooves and thereafter cleaving the first and second semiconductor laser device substrates along at least the first grooves.
摘要:
This semiconductor laser device includes a substrate, a green semiconductor laser element, formed on a surface of the substrate, including a first active layer having a first major surface of a semipolar plane and a blue semiconductor laser element, formed on a surface of the substrate, including a second active layer having a second major surface of a surface of the semipolar plane, while the first active layer includes a first well layer having a compressive strain and having a thickness of at least about 3 nm, and the second active layer includes a second well layer having a compressive strain.