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    Thin-film Sensing and Classification System
    2.
    发明申请
    Thin-film Sensing and Classification System 审中-公开
    薄膜感知与分类系统

    公开(公告)号：US20160247043A1

    公开(公告)日：2016-08-25

    申请号：US15048786

    申请日：2016-02-19

    申请人： Warren Rieutort-Louis ,  Tiffany Moy ,  Zhuo Wang ,  Naveen Verma ,  Sigurd Wagner ,  James C. Sturm

    发明人： Warren Rieutort-Louis ,  Tiffany Moy ,  Zhuo Wang ,  Naveen Verma ,  Sigurd Wagner ,  James C. Sturm

    IPC分类号： G06K9/62 ,  H04N5/225 ,  H04N5/232

    CPC分类号： G06K9/6256 ,  G06K9/00986 ,  G06K9/6217 ,  G06N20/00 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14638 ,  H04N5/23229 ,  H04N5/32

    摘要： Large-area electronics (LAE) enables the formation of a large number of sensors capable of spanning dimensions on the order of square meters. An example is X-ray imagers, which have been scaling both in dimension and number of sensors, today reaching millions of pixels. However, processing of the sensor data requires interfacing thousands of signals to CMOS ICs, because the implementation of complex functions in LAE has proven unviable due to the low electrical performance and inherent variability of the active devices available, namely amorphous silicon (a-Si) thin-film transistors (TFTs) on glass. Envisioning applications that perform sensing on even greater scales, disclosed is an approach whereby high-quality image detection is performed directly in the LAE domain using TFTs. The high variability and number of process defects affecting both the TFTs and sensors are overcome using a machine-learning algorithm, known as Error-Adaptive Classifier Boosting (EACB), to form an embedded classifier. Through EACB, the high-dimensional sensor data can be reduced to a small number of weak-classifier decisions, which can then be combined in the CMOS domain to generate a strong-classifier decision.

    摘要翻译： 大面积电子（LAE）可以形成大量的传感器，能够跨越平方米的尺寸。 一个例子是X射线成像仪，其尺寸和传感器数量已经缩小，今天达到数百万像素。 然而，传感器数据的处理需要将数千个信号连接到CMOS IC，因为LAE中的复杂功能的实现被证明是不可行的，因为可用的有源器件（即非晶硅（a-Si））具有低的电性能和固有的可变性， 玻璃上的薄膜晶体管（TFT）。 公开了一种使用TFT直接在LAE领域中进行高品质图像检测的方法。 使用称为误差自适应分类器升压（EACB）的机器学习算法来克服影响TFT和传感器两者的高变异性和数量的过程缺陷，以形成嵌入式分类器。 通过EACB，可以将高维度传感器数据减少到少量的弱分类器决策，然后将其组合在CMOS域中以产生强分类器决策。

    System and method for interfacing large-area electronics with integrated circuit devices
    3.
    发明授权
    System and method for interfacing large-area electronics with integrated circuit devices 有权
    将大面积电子与集成电路器件连接的系统和方法

    公开(公告)号：US09391220B2

    公开(公告)日：2016-07-12

    申请号：US13367856

    申请日：2012-02-07

    申请人： Naveen Verma ,  Branko Glisic ,  James Sturm ,  Sigurd Wagner

    发明人： Naveen Verma ,  Branko Glisic ,  James Sturm ,  Sigurd Wagner

    IPC分类号： H01F38/14 ,  H02J4/00 ,  H01L31/0392

    CPC分类号： H01L31/03926 ,  Y02E10/50 ,  Y10T29/49124

    摘要： A system and method for interfacing large-area electronics with integrated circuit devices is provided. The system may be implemented in an electronic device including a large area electronic (LAE) device disposed on a substrate. An integrated circuit IC is disposed on the substrate. A non-contact interface is disposed on the substrate and coupled between the LAE device and the IC. The non-contact interface is configured to provide at least one of a data acquisition path or control path between the LAE device and the IC.

    摘要翻译： 提供了一种用于将大面积电子器件与集成电路器件接口的系统和方法。 该系统可以在包括设置在基板上的大面积电子（LAE）装置的电子设备中实现。 集成电路IC设置在基板上。 非接触界面设置在衬底上并耦合在LAE器件和IC之间。 非接触接口被配置为提供LAE设备和IC之间的数据采集路径或控制路径中的至少一个。

    SYSTEM AND METHOD FOR INTERFACING LARGE-AREA ELECTRONICS WITH INTEGRATED CIRCUIT DEVICES
    4.
    发明申请
    SYSTEM AND METHOD FOR INTERFACING LARGE-AREA ELECTRONICS WITH INTEGRATED CIRCUIT DEVICES 有权
    用于将大面积电子与集成电路器件接口的系统和方法

    公开(公告)号：US20120200168A1

    公开(公告)日：2012-08-09

    申请号：US13367856

    申请日：2012-02-07

    申请人： Naveen Verma ,  Branko Glisic ,  James Sturm ,  Sigurd Wagner

    发明人： Naveen Verma ,  Branko Glisic ,  James Sturm ,  Sigurd Wagner

    IPC分类号： H01F38/14 ,  H05K3/00 ,  H02J4/00

    CPC分类号： H01L31/03926 ,  Y02E10/50 ,  Y10T29/49124

    摘要： A system and method for interfacing large-area electronics with integrated circuit devices is provided. The system may be implemented in an electronic device including a large area electronic (LAE) device disposed on a substrate. An integrated circuit IC is disposed on the substrate. A non-contact interface is disposed on the substrate and coupled between the LAE device and the IC. The non-contact interface is configured to provide at least one of a data acquisition path or control path between the LAE device and the IC.

    摘要翻译： 提供了一种用于将大面积电子器件与集成电路器件接口的系统和方法。 该系统可以在包括设置在基板上的大面积电子（LAE）装置的电子设备中实现。 集成电路IC设置在基板上。 非接触界面设置在衬底上并耦合在LAE器件和IC之间。 非接触接口被配置为提供LAE设备和IC之间的数据采集路径或控制路径中的至少一个。

    Barrier film for electronic devices and substrates
    6.
    发明授权
    Barrier film for electronic devices and substrates 有权

    公开(公告)号：US10862073B2

    公开(公告)日：2020-12-08

    申请号：US14018449

    申请日：2013-09-05

    申请人： Universal Display Corporation ,  The Trustees of Princeton University

    发明人： Prashant Mandlik ,  Ruiqing Ma ,  Sigurd Wagner ,  Bhadrinarayana Lalgudi Visweswaran

    IPC分类号： H01L51/56 ,  H01L51/52 ,  H01L51/00

    摘要： Methods for forming a coating over a surface are disclosed. A method includes directing a first source of barrier film material toward a substrate in a first direction at an angle θ relative to the substrate, wherein θ is greater than about 0° and less than about 85°. Additionally, a method of depositing a barrier film over a substrate includes directing a plurality of N sources of barrier film material toward a substrate, each source being directed at an angle θN relative to the substrate, wherein for each θN, θ is greater than about 0° and less than about 180°. For at least a first of the θN, θN is greater than about 0° and less than about 85°, and for at least a second of the θN, θN is greater than about 95° and less than about 180°.