公开(公告)号：US08077199B2

公开(公告)日：2011-12-13

申请号：US13001061

申请日：2009-07-17

申请人： Yoshihiro Nakamura ,  Etsuo Yamada ,  Keiji Takagi ,  Masataka Chiba

发明人： Yoshihiro Nakamura ,  Etsuo Yamada ,  Keiji Takagi ,  Masataka Chiba

IPC分类号： H04N7/18

CPC分类号： H04N17/002 ,  G06T7/80 ,  G06T2207/10024

摘要： A target position identifying apparatus includes a color difference converting section for processing pixel values of an image of a target comprised of combination of a first color and a second color obtained from the target under influence of ambient light, thus generating a color component value of the first color, a color component value of the second color and a luminance value, a color region determining section for determining region of the first color and region of the second color, based on the first color component value and the second color component value, with using a determination condition based on either luminance of the captured image or the luminance value, a border detecting section for detecting border between the first color and the second color in the target based on result of the determination by the color region determining section and a target position calculating section for calculating the position of the target on the image based on result of the border detection by the border detecting section.

摘要翻译： 目标位置识别装置包括：色差转换部分，用于处理由环境光影响下从目标获得的第一颜色和第二颜色的组合的目标图像的像素值，从而生成颜色分量值 第一颜色，第二颜色的颜色分量值和亮度值，基于第一颜色分量值和第二颜色分量值，确定第一颜色和第二颜色的区域的区域的颜色区域确定部分， 使用基于拍摄图像的亮度或亮度值的确定条件，基于由颜色区域确定部分确定的结果和目标来检测目标中的第一颜色和第二颜色之间的边界的边界检测部分 位置计算部分，用于基于边界检测的结果计算图像上的目标的位置 由边界检测部分进行。

公开(公告)号：US20110102581A1

公开(公告)日：2011-05-05

申请号：US13001061

申请日：2009-07-17

申请人： Yoshihiro Nakamura ,  Etsuo Yamada ,  Keiji Takagi ,  Masataka Chiba

发明人： Yoshihiro Nakamura ,  Etsuo Yamada ,  Keiji Takagi ,  Masataka Chiba

IPC分类号： H04N7/18 ,  G06K9/00

CPC分类号： H04N17/002 ,  G06T7/80 ,  G06T2207/10024

摘要： A target position identifying apparatus includes a color difference converting section for processing pixel values of an image of a target comprised of combination of a first color and a second color obtained from the target under influence of ambient light, thus generating a color component value of the first color, a color component value of the second color and a luminance value, a color region determining section for determining region of the first color and region of the second color, based on the first color component value and the second color component value, with using a determination condition based on either luminance of the captured image or the luminance value, a border detecting section for detecting border between the first color and the second color in the target based on result of the determination by the color region determining section and a target position calculating section for calculating the position of the target on the image based on result of the border detection by the border detecting section.

摘要翻译： 目标位置识别装置包括：色差转换部分，用于处理由环境光影响下从目标获得的第一颜色和第二颜色的组合的目标图像的像素值，从而生成颜色分量值 第一颜色，第二颜色的颜色分量值和亮度值，基于第一颜色分量值和第二颜色分量值，确定第一颜色和第二颜色的区域的区域的颜色区域确定部分， 使用基于拍摄图像的亮度或亮度值的确定条件，基于由颜色区域确定部分确定的结果和目标来检测目标中的第一颜色和第二颜色之间的边界的边界检测部分 位置计算部分，用于基于边界检测的结果计算图像上的目标的位置 由边界检测部分进行。

公开(公告)号：US08280665B2

公开(公告)日：2012-10-02

申请号：US12552694

申请日：2009-09-02

申请人： Yoshihiro Nakamura ,  Etsuo Yamada

发明人： Yoshihiro Nakamura ,  Etsuo Yamada

IPC分类号： G01C17/38 ,  G06K9/32

CPC分类号： G06T7/80 ,  G06T2207/30208 ,  G06T2207/30252

摘要： A calibration device for an on-vehicle camera includes an image receiving portion receiving an image of an area around a vehicle taken by an on-vehicle camera, a viewpoint transformation portion performing a viewpoint transformation on the image to obtain a transformed image, a region setting portion setting a recognition target region on the transformed image according to coordinates of the calibration index set in accordance with vehicle models, where the recognition target region includes therein the calibration index, a calibration point detecting portion detecting a calibration point positioned within the calibration index included in the recognition target region, and a calibration calculating portion calibrating the on-vehicle camera in accordance with coordinates of the calibration point in a reference coordinate system and in accordance with coordinates of the calibration point in a camera coordinate system.

摘要翻译： 一种用于车载照相机的校准装置包括：图像接收部分，接收由车载摄像机拍摄的车辆周围的区域的图像，对图像执行视点变换以获得变换图像的视点变换部分，区域 设置部分根据根据车辆模型设置的校准索引的坐标来设置变换图像上的识别目标区域，其中识别目标区域包括校准索引，校准点检测部分，检测位于校准索引内的校准点 包括在识别目标区域中的校准计算部分和校准计算部分，其根据参考坐标系中的校准点的坐标并且根据相机坐标系中的校准点的坐标来校准车载摄像机。

公开(公告)号：US20100082281A1

公开(公告)日：2010-04-01

申请号：US12552694

申请日：2009-09-02

申请人： Yoshihiro Nakamura ,  Etsuo Yamada

发明人： Yoshihiro Nakamura ,  Etsuo Yamada

IPC分类号： G06F19/00

CPC分类号： G06T7/80 ,  G06T2207/30208 ,  G06T2207/30252

摘要： A calibration device for an on-vehicle camera includes an image receiving portion receiving an image of an area around a vehicle taken by an on-vehicle camera, a viewpoint transformation portion performing a viewpoint transformation on the image to obtain a transformed image, a region setting portion setting a recognition target region on the transformed image according to coordinates of the calibration index set in accordance with vehicle models, where the recognition target region includes therein the calibration index, a calibration point detecting portion detecting a calibration point positioned within the calibration index included in the recognition target region, and a calibration calculating portion calibrating the on-vehicle camera in accordance with coordinates of the calibration point in a reference coordinate system and in accordance with coordinates of the calibration point in a camera coordinate system.

摘要翻译： 一种用于车载照相机的校准装置包括：图像接收部分，接收由车载摄像机拍摄的车辆周围的区域的图像，对图像执行视点变换以获得变换图像的视点变换部分，区域 设置部分根据根据车辆模型设置的校准索引的坐标来设置变换图像上的识别目标区域，其中识别目标区域包括校准索引，校准点检测部分，检测位于校准索引内的校准点 包括在识别目标区域中的校准计算部分和校准计算部分，其根据参考坐标系中的校准点的坐标并且根据相机坐标系中的校准点的坐标来校准车载摄像机。

公开(公告)号：US6002181A

公开(公告)日：1999-12-14

申请号：US551917

申请日：1995-10-23

申请人： Etsuo Yamada ,  Yasushi Shiraishi ,  Hiroshi Kawano ,  Shinji Ohuchi ,  Hidekazu Nasu

发明人： Etsuo Yamada ,  Yasushi Shiraishi ,  Hiroshi Kawano ,  Shinji Ohuchi ,  Hidekazu Nasu

IPC分类号： H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/28

CPC分类号： H01L23/3107 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/4951 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/8592 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165

摘要： A resin molded type semiconductor device has an inner portion sandwiched between two outer surfaces. The device includes a chip support with a first, inwardly facing surface and a second, outwardly facing surface. The device also includes a semiconductor element with a first, inwardly facing surface and a second, outwardly facing surface. The respective first surfaces of the chip support and semiconductor element are fixed to each other. A mold resin is provided to seal the entire semiconductor device except for the respective second surfaces of the chip support and semiconductor element which remain exposed as part of the two outer surfaces of the device, in order to keep the semiconductor device thin.

摘要翻译： 树脂模制型半导体器件具有夹在两个外表面之间的内部部分。 该装置包括具有第一面向内的表面和第二向外表面的芯片支撑件。 该装置还包括具有第一面向内的表面和第二向外表面的半导体元件。 芯片支撑体和半导体元件的各个第一表面彼此固定。 为了保持半导体器件的薄型化，提供了一种模制树脂来密封整个半导体器件，除了作为器件的两个外表面的一部分而保持暴露的芯片支撑件和半导体元件的相应的第二表面之外。

公开(公告)号：US4967417A

公开(公告)日：1990-10-30

申请号：US377131

申请日：1989-07-10

申请人： Etsuo Yamada

发明人： Etsuo Yamada

IPC分类号： G11B7/125 ,  H01S5/062 ,  H01S5/0683

CPC分类号： H01S5/06832 ,  H01S5/06213

摘要： A laser driving device is disclosed. The laser driving device includes a semiconductor laser, a current source for supplying an electric current to the semiconductor laser, a photodetector for monitoring light emitted from the semiconductor laser, a plurality of setting circuits for outputting reference signals of different levels, a switching circuit for selecting one of the outputs of the setting circuits, a comparing circuit for comparing the output selected by the switching circuit with the output of the photodetector, and a control circuit for controlling the electric current supplied to the semiconductor laser on the basis of the output of the comparing circuit so that the two outputs become equal to each other. Also disclosed is an optical information recording apparatus using such a laser driving device.

摘要翻译： 公开了一种激光驱动装置。 激光驱动装置包括半导体激光器，用于向半导体激光器提供电流的电流源，用于监视从半导体激光器发射的光的光电检测器，用于输出不同电平的参考信号的多个设置电路，用于 选择所述设置电路的输出之一，比较电路，用于将由所述开关电路选择的输出与所述光电检测器的输出进行比较;以及控制电路，用于根据所述输出来控制提供给所述半导体激光器的电流 比较电路使得两个输出彼此相等。 还公开了使用这种激光驱动装置的光信息记录装置。

公开(公告)号：US06403398B2

公开(公告)日：2002-06-11

申请号：US09733969

申请日：2000-12-12

申请人： Shinji Ohuchi ,  Yasushi Shiraishi ,  Hiroshi Kawano ,  Etsuo Yamada

发明人： Shinji Ohuchi ,  Yasushi Shiraishi ,  Hiroshi Kawano ,  Etsuo Yamada

IPC分类号： H01L2144

CPC分类号： H01L24/02 ,  H01L23/3114 ,  H01L23/3185 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00

摘要： A resin sealing type semiconductor device, a manufacturing method thereof and a packaging structure thereof are capable of downsizing the semiconductor device and attaining high-density packaging. For this, the resin sealing type semiconductor device with leads exposed in an outer surface, is provided with spot leads adhered to a circuit forming surface of a semiconductor element with an insulating adhesive tape interposed therebetween, each independently regularly arrayed, and exposed to outside with the semiconductor element disposed inside.

摘要翻译： 树脂密封型半导体器件，其制造方法和封装结构能够使半导体器件小型化并实现高密度封装。 为此，具有在外表面露出的引线的树脂密封型半导体器件具有粘附到半导体元件的电路形成表面的点引线，绝缘胶带插入其间，各自独立地排列并暴露于外部， 设置在内部的半导体元件。

公开(公告)号：US06262482B1

公开(公告)日：2001-07-17

申请号：US09167671

申请日：1998-10-07

申请人： Yasushi Shiraishi ,  Kazuhiko Sera ,  Etsuo Yamada ,  Kenji Nagasaki

发明人： Yasushi Shiraishi ,  Kazuhiko Sera ,  Etsuo Yamada ,  Kenji Nagasaki

IPC分类号： H01L2348

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399

摘要： In a semiconductor device 1 according to the present invention, a plurality of inner leads are bonded to a front surface of a semiconductor element 11 covered by a package 10, with bent portions 17 formed at some inner leads 13a among the plurality of inner leads 13 and the front ends of the bent portions 17 exposed at a front surface of the package 10. This structure ensures that the semiconductor element is not caused to move vertically inside the forming die by the pressure of the liquid resin or the like during the sealing process.

摘要翻译： 在根据本发明的半导体器件1中，多个内部引线被接合到由封装10覆盖的半导体元件11的前表面上，其中弯曲部分17形成在多个内部引线13中的一些内部引线13a 并且在封装10的前表面露出的弯曲部分17的前端。这种结构确保了在密封过程中半导体元件不会由于液体树脂等的压力而在成形模具内垂直移动 。

公开(公告)号：US06258621B1

公开(公告)日：2001-07-10

申请号：US09240612

申请日：1999-02-01

申请人： Shinji Ohuchi ,  Hiroshi Kawano ,  Etsuo Yamada ,  Yasushi Shiraishi

发明人： Shinji Ohuchi ,  Hiroshi Kawano ,  Etsuo Yamada ,  Yasushi Shiraishi

IPC分类号： H01L2144

CPC分类号： H01L23/49551 ,  H01L23/4951 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： In a plastic packaged semiconductor device, a chip support formed on the same lead frame as leads is disposed so as to extend over the surface of a semiconductor element, the chip support is bonded and fixed to the surface of a polyimide wafer coat on the semiconductor element by means of an insulating tape, the leads are brought into contact with the polyimide wafer coat on the semiconductor element without being fixed, the leads and the electrodes of the semiconductor element are connected by means of gold wires, and these are packaged by a packaging material. Generation of crack in the sealing material thereby prevented, and the thickness of the plastic packaged semiconductor device is reduced.

摘要翻译： 在塑料封装半导体器件中，形成在与引线相同的引线框架上的芯片支撑件设置成在半导体元件的表面上延伸，芯片支撑件被结合并固定在半导体上的聚酰亚胺晶片涂层的表面上 通过绝缘带使引线与半导体元件上的聚酰亚胺晶片涂层接触而不固定，半导体元件的引线和电极通过金线连接，并且它们被封装在 用于包装的材料。 因此防止了密封材料中的裂缝的产生，并且塑料封装的半导体器件的厚度减小。

公开(公告)号：US20050142814A1

公开(公告)日：2005-06-30

申请号：US10942799

申请日：2004-09-17

申请人： Etsuo Yamada

发明人： Etsuo Yamada

IPC分类号： H01L21/56 ,  H01L21/301 ,  H01L21/48 ,  H01L21/50 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L21/565 ,  H01L21/4842 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49513 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacturing a semiconductor device includes providing a matrix frame which includes a plurality of die pads, mounting a semiconductor chip on the respective die pads, and sealing the semiconductor chip in blocks. After the semiconductor chip is sealed by the sealing resin, inner leads which are extended from the sealing resin are punched by a punching blade. Then, the block is diced to individual semiconductor devices by a rotary blade.

摘要翻译： 一种制造半导体器件的方法包括提供一种矩阵框架，其包括多个管芯焊盘，将半导体芯片安装在各个管芯焊盘上，并以半块形式密封半导体芯片。 在半导体芯片被密封树脂​​密封之后，由密封树脂延伸的内部引线用冲压刀冲压。 然后，通过旋转刀片将该块切割到各个半导体器件。