公开(公告)号：US20130330546A1

公开(公告)日：2013-12-12

申请号：US13810342

申请日：2012-03-01

申请人： Yoshihito Takami ,  Daisuke Shimokawa ,  Akihisa Murata

发明人： Yoshihito Takami ,  Daisuke Shimokawa ,  Akihisa Murata

IPC分类号： C09J7/02

CPC分类号： C09J7/38 ,  B32B7/12 ,  B32B27/20 ,  B32B27/308 ,  B32B2457/00 ,  C08K3/013 ,  C08K5/0041 ,  C08K9/10 ,  C09J5/06 ,  C09J7/22 ,  C09J7/29 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/106 ,  C09J2205/11 ,  C09J2205/302 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2924/00013 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： A heat-peelable adhesive sheet is provided which includes a thermally expansive pressure-sensitive adhesive layer that contains thermally expansive microspheres and the coloring agent and that is provided on one side or both sides of the substrate, or a thermally expansive pressure-sensitive adhesive layer that contains thermally expansive microspheres and is provided on one side or both sides of the substrate through a colored intermediate layer, and which has a total light transmittance of 50% or more.

摘要翻译： 提供了一种可热剥离的粘合片，其包括热膨胀性压敏粘合剂层，其包含热膨胀性微球和着色剂，并且设置在基底的一侧或两侧，或热膨胀型压敏粘合剂层 其含有热膨胀性微球，并通过有色中间层设置在基板的一侧或两侧，并且其总透光率为50％以上。

公开(公告)号：US08524007B2

公开(公告)日：2013-09-03

申请号：US12977762

申请日：2010-12-23

申请人： Daisuke Uenda ,  Yukio Arimitsu ,  Yoshio Terada ,  Yasuhiro Amano ,  Akihisa Murata

发明人： Daisuke Uenda ,  Yukio Arimitsu ,  Yoshio Terada ,  Yasuhiro Amano ,  Akihisa Murata

IPC分类号： B08B7/00 ,  B32B3/30 ,  B32B17/10

CPC分类号： B08B1/00 ,  B08B7/0028 ,  H01L21/02096 ,  Y10T428/24355 ,  Y10T428/2457 ,  Y10T428/24612 ,  Y10T428/31

摘要： A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 μm or less and a maximum height Rz of 1.0 μm or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.

摘要翻译： 一种清洁片，包括具有0.05微米以下的算术平均粗糙度Ra和1.0mum以下的最大高度Rz的微细度形状的清洁层。 优选地，每1mm平坦表面的清洁层的基本表面积为1mm 2的平坦区域的硅晶片镜表面的基本表面积的150％或更多。 清洁片可以设置在转印构件的至少一个表面上，使得转印构件具有清洁功能。 当清洁片或具有清洁功能的转印元件在衬底处理设备中转移以代替待处理衬底时，清洁片接触并清洁衬底处理设备的位置。

公开(公告)号：US20080019078A1

公开(公告)日：2008-01-24

申请号：US10592132

申请日：2005-02-18

申请人： Yukio Arimitsu ,  Akihisa Murata ,  Tomoko Kishimoto

发明人： Yukio Arimitsu ,  Akihisa Murata ,  Tomoko Kishimoto

IPC分类号： H01G4/06 ,  B05D5/10 ,  B05D5/12 ,  B32B9/00

CPC分类号： H01L21/6835 ,  C09J5/08 ,  C09J7/22 ,  C09J7/38 ,  C09J2203/326 ,  C09J2205/11 ,  C09J2205/302 ,  H01L2221/68331 ,  H01L2924/19041 ,  H01L2924/30105 ,  Y10T428/14 ,  Y10T428/1405 ,  Y10T428/1476 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2813

摘要： Disclosed is a heat-peelable pressure-sensitive adhesive sheet that can prevent the deformation of a pressure-sensitive adhesive layer due to pressurization in a pressing process and can be easily peeled off from the processed article. The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and a heat-expandable pressure-sensitive adhesive layer arranged on or above at least one side of the substrate and containing a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a shear modulus (23° C.) in an unfoamed state of 7×106 Pa or more. The heat-expandable pressure-sensitive adhesive layer preferably has a shear modulus (95° C.) in an unfoamed state of less than 7×106 Pa. The foaming agent in the heat-expandable pressure-sensitive adhesive layer preferably has a foam initiating temperature higher than 80° C.

摘要翻译： 公开了一种可以防止由于加压过程中的加压引起的压敏粘合剂层变形并且可以容易地从处理物品剥离的热剥离性粘合片。 热剥离性粘合片包括基材和布置在基材的至少一面上或上方的热可膨胀压敏粘合剂层，并且含有发泡剂，其中热膨胀性压敏粘合剂 在7×10 -6 Pa以上的未发泡状态下具有剪切模量（23℃）。 热可膨胀压敏粘合剂层优选具有小于7×10 -6 Pa的未发泡状态的剪切模量（95℃）。 热膨胀性压敏粘合剂层中的发泡剂优选具有高于80℃的泡沫起始温度。

公开(公告)号：US6074802A

公开(公告)日：2000-06-13

申请号：US179899

申请日：1998-10-28

申请人： Akihisa Murata ,  Hideki Nagasaka

发明人： Akihisa Murata ,  Hideki Nagasaka

IPC分类号： B41C1/10 ,  B41M5/36 ,  B41M7/00 ,  G03F7/004

CPC分类号： B41M5/368 ,  B41C1/1008 ,  B41C2210/02 ,  B41C2210/06 ,  B41C2210/22 ,  B41C2210/24 ,  B41C2210/262

摘要： A positive photosensitive composition comprising at least (a) an alkali-soluble resin and (b) a photo-thermal conversion material, which further contains (c) a compound capable of crosslinking the alkali-soluble resin by a thermal action, and which contains substantially no compound which has a function to generate an acid when exposed in the coexistence of the photo-thermal conversion material.

摘要翻译： 一种正极光敏组合物，其至少包含（a）碱溶性树脂和（b）光热转换材料，其进一步包含（c）能够通过热作用使所述碱溶性树脂交联的化合物，并且其包含 基本上没有在光热转换材料共存时暴露时产生酸的功能的化合物。

公开(公告)号：US5427887A

公开(公告)日：1995-06-27

申请号：US106699

申请日：1993-08-16

申请人： Satoshi Konuma ,  Toshiyuki Matsumura ,  Akihisa Murata ,  Shigeo Tsuji

发明人： Satoshi Konuma ,  Toshiyuki Matsumura ,  Akihisa Murata ,  Shigeo Tsuji

IPC分类号： G03F7/021 ,  G03C1/60

CPC分类号： G03F7/021 ,  Y10S430/111

摘要： Disclosed is a light-sensitive composition which comprises(A) a diazo resin and(B) an alkali-soluble and swellable polymer compound, said polymer compound being a vinyl copolymer containing, as a constitutional unit, 0.1 to 10 mole % of a structure derived from an ester of acrylic acid or methacrylic acid having an alkyl group with 8 or more carbon atoms.

摘要翻译： 公开了一种感光性组合物，其包含（A）重氮树脂和（B）碱溶性和可溶胀的聚合物化合物，所述高分子化合物是含有作为结构单元的结构的0.1〜10摩尔％ 衍生自具有8个或更多个碳原子的烷基的丙烯酸或甲基丙烯酸的酯。

公开(公告)号：US5290883A

公开(公告)日：1994-03-01

申请号：US957392

申请日：1992-10-07

申请人： Toshitsugu Hosokawa ,  Takeshi Yamanaka ,  Hiraku Yamamoto ,  Koichi Hashimoto ,  Akihisa Murata ,  Katsuhito Kamiya

发明人： Toshitsugu Hosokawa ,  Takeshi Yamanaka ,  Hiraku Yamamoto ,  Koichi Hashimoto ,  Akihisa Murata ,  Katsuhito Kamiya

IPC分类号： C08G59/18 ,  C08G59/00 ,  C08L63/00 ,  C08L101/00 ,  C08F283/00

CPC分类号： C08L63/00

摘要： An expoxy resin composition, an epoxy resin cured product obtained therefrom, and a bonding method using the composition are disclosed. The epoxy resin composition comprises an epoxy resin composition comprising (A) 100 parts by weight of an epoxy resin, (B) from 1 to 80 parts by weight of a heat activatable hardener, and (C) from 10 to 100 parts by weight of an aromatic thermoplastic resin powder having a glass transition temperature of 120.degree. C. or more and an average particle diameter of 200 .mu.m or less, said components (A), (B) and (C) being present in a phase separation state.

摘要翻译： 公开了一种环氧树脂组合物，由其获得的环氧树脂固化产物和使用该组合物的粘合方法。 环氧树脂组合物包含环氧树脂组合物，其包含（A）100重量份的环氧树脂，（B）1至80重量份的可热活化的固化剂，和（C）10至100重量份的 玻璃化转变温度为120℃以上，平均粒径为200（my）μm以下的芳香族热塑性树脂粉末，所述成分（A），（B）和（C）以相分离 州。

公开(公告)号：US07811647B2

公开(公告)日：2010-10-12

申请号：US10592132

申请日：2005-02-18

申请人： Yukio Arimitsu ,  Akihisa Murata ,  Tomoko Kishimoto

发明人： Yukio Arimitsu ,  Akihisa Murata ,  Tomoko Kishimoto

IPC分类号： B32B9/00 ,  B32B33/00 ,  B32B7/12 ,  B32B15/04

CPC分类号： H01L21/6835 ,  C09J5/08 ,  C09J7/22 ,  C09J7/38 ,  C09J2203/326 ,  C09J2205/11 ,  C09J2205/302 ,  H01L2221/68331 ,  H01L2924/19041 ,  H01L2924/30105 ,  Y10T428/14 ,  Y10T428/1405 ,  Y10T428/1476 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2813

摘要： Disclosed is a heat-peelable pressure-sensitive adhesive sheet that can prevent the deformation of a pressure-sensitive adhesive layer due to pressurization in a pressing process and can be easily peeled off from the processed article.The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and a heat-expandable pressure-sensitive adhesive layer arranged on or above at least one side of the substrate and containing a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a shear modulus (23° C.) in an unfoamed state of 7×106 Pa or more. The heat-expandable pressure-sensitive adhesive layer preferably has a shear modulus (95° C.) in an unfoamed state of less than 7×106 Pa. The foaming agent in the heat-expandable pressure-sensitive adhesive layer preferably has a foam initiating temperature higher than 80° C.

摘要翻译： 公开了一种可以防止由于加压过程中的加压引起的压敏粘合剂层变形并且可以容易地从处理物品剥离的热剥离性粘合片。 热剥离性粘合片包括基材和布置在基材的至少一面上或上方的热可膨胀压敏粘合剂层，并且含有发泡剂，其中热膨胀性压敏粘合剂 层的剪切模量（23℃）为7×10 6 Pa以上的未发泡状态。 热膨胀性压敏粘合剂层的未发泡状态的剪切弹性模量（95℃）优选为小于7×10 6 Pa。发泡剂优选具有泡沫起始 温度高于80℃

公开(公告)号：US20090263153A1

公开(公告)日：2009-10-22

申请号：US12067235

申请日：2006-10-12

申请人： Daisuke Uenda ,  Yukio Arimitsu ,  Yoshio Terada ,  Yasuhiro Amano ,  Akihisa Murata

发明人： Daisuke Uenda ,  Yukio Arimitsu ,  Yoshio Terada ,  Yasuhiro Amano ,  Akihisa Murata

IPC分类号： G03G21/00 ,  B32B3/00

CPC分类号： B08B1/00 ,  B08B7/0028 ,  H01L21/02096 ,  Y10T428/24355 ,  Y10T428/2457 ,  Y10T428/24612 ,  Y10T428/31

摘要： There are provided a transfer member provided with a cleaning function, which have excellent foreign matter removing performance and transfer performance, and which can remove foreign matters having a predetermined particle diameter with especially high efficiency.The transfer member provided with a cleaning function includes a transfer member and the cleaning layer provided on at least one surface of the transfer member. The cleaning layer has a microasperity shape having an arithmetic average roughness Ra of 0.05 μm or less and a maximum height Rz of 1.0 μm or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2.

摘要翻译： 提供具有清除功能的转印构件，其具有优异的异物去除性能和转印性能，并且可以以特别高的效率去除具有预定粒径的异物。 设置有清洁功能的传送构件包括传送构件和设置在传送构件的至少一个表面上的清洁层。 清洁层具有0.05微米以下的算术平均粗糙度Ra和1.0μm以下的最大高度Rz的微细度形状。 优选地，每1mm平坦表面的清洁层的基本表面积为1mm 2的平坦区域的硅晶片镜表面的基本表面积的150％或更多。

公开(公告)号：US20070104913A1

公开(公告)日：2007-05-10

申请号：US11562685

申请日：2006-11-22

申请人： Takahiro Nonaka ,  Yasuyuki Tokunaga ,  Naoyuki Nishiyama ,  Shinji Inokuchi ,  Masahiro Ohura ,  Akihisa Murata ,  Yasunori Sugihara

发明人： Takahiro Nonaka ,  Yasuyuki Tokunaga ,  Naoyuki Nishiyama ,  Shinji Inokuchi ,  Masahiro Ohura ,  Akihisa Murata ,  Yasunori Sugihara

IPC分类号： B32B33/00

CPC分类号： B32B15/09 ,  B32B5/20 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  B32B27/08 ,  B32B27/16 ,  B32B27/18 ,  B32B27/32 ,  B32B27/36 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2307/21 ,  B32B2307/56 ,  B32B2307/75 ,  B32B2367/00 ,  B32B2519/00 ,  C09J7/38 ,  C09J7/403 ,  C09J2203/334 ,  C09J2400/163 ,  C09J2423/006 ,  C09J2467/006 ,  G09F3/10 ,  G11B25/043 ,  G11B33/08 ,  Y10T428/14

摘要： A pressure-sensitive adhesive label has a base having an information indication portion on its one surface thereof, and a pressure-sensitive adhesive layer formed on another surface of the base. After peeling a release liner, the label is stuck on an outer surface of a housing of the hard disk drive to reduce noise generated when the hard disk drive is driven. The release liner for coating the pressure-sensitive adhesive layer has an antistatic function and a cut line. The adhesive force of the adhesive layer is reduced by heating. The label has a surface density of not lower than 0.18 (kg/m2)

摘要翻译： 压敏粘合剂标签具有在其一个表面上具有信息指示部分的基底和形成在基底的另一个表面上的压敏粘合剂层。 剥离剥离衬垫后，将标签卡在硬盘驱动器外壳的外表面上，以减少驱动硬盘驱动器时产生的噪音。 用于涂布压敏粘合剂层的剥离衬垫具有抗静电功能和切割线。 通过加热来降低粘合剂层的粘合力。 该标签的表面密度不低于0.18（kg / m 2）

公开(公告)号：US07067030B2

公开(公告)日：2006-06-27

申请号：US10400792

申请日：2003-03-28

申请人： Kazuyuki Kiuchi ,  Toshiyuki Oshima ,  Akihisa Murata ,  Yukio Arimitsu

发明人： Kazuyuki Kiuchi ,  Toshiyuki Oshima ,  Akihisa Murata ,  Yukio Arimitsu

IPC分类号： B32B37/14 ,  C09J7/00

CPC分类号： H01L21/6835 ,  C09J7/22 ,  C09J7/26 ,  C09J7/29 ,  C09J7/38 ,  C09J2201/36 ,  C09J2205/11 ,  C09J2400/243 ,  C09J2421/006 ,  C09J2423/006 ,  C09J2433/00 ,  C09J2467/006 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2924/19041 ,  Y10T156/1064 ,  Y10T156/1082 ,  Y10T156/1153 ,  Y10T428/249984 ,  Y10T428/28 ,  Y10T428/2839 ,  Y10T428/2848 ,  Y10T428/2861

摘要： A heat-peelable adhesive sheet which comprises a substrate and, formed on at least one side thereof, a heat-expandable layer containing heat-expandable microspheres and an adhesive layer comprising an adhesive substance and in which the substrate has heat resistance and stretchability can be used to cut an adherend so as to form and secure a sufficient space between the resultant cut pieces and can withstand a heat treatment for expanding the heat-expandable layer. Consequently, the adhesive sheet can heighten the operating efficiency and working efficiency in the step of separating and recovering the cut pieces.