公开(公告)号：US20120043656A1

公开(公告)日：2012-02-23

申请号：US13289593

申请日：2011-11-04

申请人： Yoshinari HAYASHI

发明人： Yoshinari HAYASHI

IPC分类号： H01L23/498

CPC分类号： H01L23/49838 ,  H01L23/13 ,  H01L24/02 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/06135 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1517 ,  H01L2924/15183 ,  H01L2924/15184 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/094 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/13111 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An improvement is achieved in the mounting reliability of a semiconductor device. A semiconductor chip is mounted over an upper surface of a wiring substrate. A plurality of solder balls are disposed individually over a plurality of lands formed on a lower surface of the wiring substrate. The plural lands include a first land group arranged in a plurality of rows and arranged along a peripheral edge portion of the lower surface of the wiring substrate, and a second land group arranged inside the first land group in the lower surface of the wiring substrate. The lands in the first land group are arranged with a first pitch, and the lands in the second land group are arranged with a second pitch higher than the first pitch.

摘要翻译： 半导体器件的安装可靠性得到改善。 半导体芯片安装在布线基板的上表面上。 多个焊球分别设置在形成在布线基板的下表面上的多个焊盘上。 多个焊盘包括沿着布线基板的下表面的周边部分布置成多行并布置的第一焊盘组，以及布置在布线基板的下表面中的第一焊盘组内部的第二焊盘组。 第一接地组中的焊盘以第一间距布置，并且第二接地组中的焊盘以比第一间距高的第二间距布置。

公开(公告)号：US20100090333A1

公开(公告)日：2010-04-15

申请号：US12549718

申请日：2009-08-28

申请人： Yoshinari HAYASHI

发明人： Yoshinari HAYASHI

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L23/49838 ,  H01L23/13 ,  H01L24/02 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/06135 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1517 ,  H01L2924/15183 ,  H01L2924/15184 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/094 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/13111 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An improvement is achieved in the mounting reliability of a semiconductor device. A semiconductor chip is mounted over an upper surface of a wiring substrate. A plurality of solder balls are disposed individually over a plurality of lands formed on a lower surface of the wiring substrate. The plural lands include a first land group arranged in a plurality of rows and arranged along a peripheral edge portion of the lower surface of the wiring substrate, and a second land group arranged inside the first land group in the lower surface of the wiring substrate. The lands in the first land group are arranged with a first pitch, and the lands in the second land group are arranged with a second pitch higher than the first pitch.

摘要翻译： 半导体器件的安装可靠性得到改善。 半导体芯片安装在布线基板的上表面上。 多个焊球分别设置在形成在布线基板的下表面上的多个焊盘上。 多个焊盘包括沿着布线基板的下表面的周边部分布置成多行并布置的第一焊盘组，以及布置在布线基板的下表面中的第一焊盘组内部的第二焊盘组。 第一接地组中的焊盘以第一间距布置，并且第二接地组中的焊盘以比第一间距高的第二间距布置。