公开(公告)号：US4902635A

公开(公告)日：1990-02-20

申请号：US175704

申请日：1988-03-31

申请人： Yoshinori Imamura ,  Masaru Miyazaki ,  Akihisa Terano ,  Nobutoshi Matsunaga ,  Hiroshi Yanazawa

发明人： Yoshinori Imamura ,  Masaru Miyazaki ,  Akihisa Terano ,  Nobutoshi Matsunaga ,  Hiroshi Yanazawa

IPC分类号： H01L21/338 ,  H01L21/768 ,  H01L21/8252 ,  H01L23/532 ,  H01L29/417 ,  H01L29/423 ,  H01L29/812

CPC分类号： H01L23/5329 ,  H01L21/7688 ,  H01L21/8252 ,  H01L29/41775 ,  H01L29/42316 ,  H01L2924/0002

摘要： This invention is related to the method for production of semiconductor devices suitable for increasing the integration density of semiconductor integrated circuits, especially GaAs semiconductor IC devices.This invention uses no third wiring metal, contact hole or through hole for connection between the Schottky junction and ohmic electrodes formed on the GaAs semiconductor substrate required in the conventional technology, but provides the method for direct connection between the two electrodes stated above by means of vapor deposition, ion implantation, sputtering, CVD, plasma CVD, dry etching and wet etching.Since the application of this invention enables the two electrodes stated above to be directly connected with high yield, the element area at the connecting portion can be reduced to less than half as compared with the same required in the conventional method, the total element area can be reduced greatly.

摘要翻译： 本发明涉及适用于提高半导体集成电路，尤其是GaAs半导体IC器件的集成密度的半导体器件的制造方法。 本发明不使用在传统技术中所需的GaAs半导体衬底上形成的肖特基结和欧姆电极之间的第三布线金属，接触孔或通孔，而是提供了通过以下方式直接连接在上述两个电极之间的方法： 气相沉积，离子注入，溅射，CVD，等离子体CVD，干蚀刻和湿蚀刻。 由于本发明的应用使得上述两个电极能够以高产率直接连接，所以连接部分的元件面积可以比常规方法所需的量减少到小于一半，总元件面积可以 大大减少

公开(公告)号：US08514590B2

公开(公告)日：2013-08-20

申请号：US13021931

申请日：2011-02-07

申请人： Akira Nakasaka ,  Masaru Miyazaki ,  Kenichi Oohama

发明人： Akira Nakasaka ,  Masaru Miyazaki ,  Kenichi Oohama

IPC分类号： H02B1/01

CPC分类号： H05K7/20854 ,  H01L23/473 ,  H01L25/112 ,  H01L25/162 ,  H01L2924/0002 ,  H01L2924/00

摘要： The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit . The internal unit including therein the semiconductor modules also includes a control circuit board fitted to board fixing sections formed in the frame so as to project from the frame in the height direction perpendicular to the plane of the frame. Each of the board fixing sections has a board abutment surface at a position closer to the frame than the tips of control terminals of the semiconductor modules formed so as to project in the height direction.

摘要翻译： 电力转换装置包括构成电力转换电路的电子部件，用于冷却至少一部分电子部件的冷却器，以及容纳电子部件和冷却器的壳体。 电子部件和冷却器中的至少一些固定在框架内并作为内部单元集成。 其中包括半导体模块的内部单元还包括控制电路板，该控制电路板安装成在框架中形成的固定部分，以便在与框架的平面垂直的高度方向上从框架突出。 每个板固定部分在比半导体模块的控制端子的尖端更靠近框架的位置处具有板抵接表面，所述端部形成为在高度方向上突出。

公开(公告)号：US20060273692A1

公开(公告)日：2006-12-07

申请号：US11504381

申请日：2006-08-15

申请人： Hirokazu Sanpei ,  Jun Mizuno ,  Masazumi Yasuoka ,  Humikazu Takayanagi ,  Takehisa Tokoshima ,  Masaru Miyazaki ,  Masayoshi Esashi

发明人： Hirokazu Sanpei ,  Jun Mizuno ,  Masazumi Yasuoka ,  Humikazu Takayanagi ,  Takehisa Tokoshima ,  Masaru Miyazaki ,  Masayoshi Esashi

IPC分类号： H01L41/08

CPC分类号： H01H61/00 ,  H01H1/0036 ,  H01H2061/006

摘要： A bimorph switch electrically connecting a traveling contact and a fixed contact. The switch comprises a substrate having a front face, a rear face, and a through hole penetrating from the front face to the rear face; a fixed contact extending from an edge portion of the aperture of the through hole towards the inside of the aperture; and a bimorph section holding the traveling contact at a position facing the aperture and driving the traveling contact. One end of the bimorph section may be formed on a silicon oxide layer formed on a front face of the substrate.

摘要翻译： 电动连接行走触点和固定触点的双压电晶片开关。 开关包括具有前表面，后表面和从前表面到后表面穿透的通孔的基板; 从所述通孔的孔的边缘部分朝向所述孔的内部延伸的固定接触; 以及将移动接触件保持在面对孔径的位置并驱动行驶接触件的双压电晶片部分。 双晶片部分的一端可以形成在形成在基板的正面上的氧化硅层上。

公开(公告)号：US5986341A

公开(公告)日：1999-11-16

申请号：US930083

申请日：1998-02-09

申请人： Mitsuo Usami ,  Kunihiro Tsubosaki ,  Masaru Miyazaki

发明人： Mitsuo Usami ,  Kunihiro Tsubosaki ,  Masaru Miyazaki

IPC分类号： B42D15/10 ,  G06K19/077 ,  H01L21/822 ,  H01L23/498 ,  H01L23/538 ,  H01L25/04 ,  H01L25/18 ,  H01L27/04 ,  H01L23/34

CPC分类号： G06K19/07728 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  H01L23/49855 ,  H01L23/5388 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3511

摘要： A condenser, a coil and a thin-thickness integrated circuit are placed between an upper cover sheet and a lower cover sheet, and adhesive is filled into the space between them, whereby a card is fabricated. Because the condenser, the coil and the thin-thickness integrated circuit are extremely thin, the resulting semiconductor device is highly resistant to bending and highly reliable at a low cost.

摘要翻译： PCT No.PCT / JP96 / 01264 Sec。 371日期：1998年2月9日 102（e）1998年2月9日PCT PCT 1996年5月14日PCT公布。 公开号WO96 / 36496 日期：1996年11月21日在上盖板和下盖板之间放置冷凝器，线圈和薄壁集成电路，并且将粘合剂填充到它们之间的空间中，由此制造卡片。 由于冷凝器，线圈和薄型集成电路非常薄，因此所得到的半导体器件以低成本高度耐弯曲和高可靠性。

公开(公告)号：US4672578A

公开(公告)日：1987-06-09

申请号：US582540

申请日：1984-02-22

申请人： Chusuke Munakata ,  Kunihiro Yagi ,  Masaru Miyazaki ,  Shiyouzou Yoneda

发明人： Chusuke Munakata ,  Kunihiro Yagi ,  Masaru Miyazaki ,  Shiyouzou Yoneda

IPC分类号： G11C17/00 ,  G03C1/705 ,  G11B7/241 ,  G11B9/08 ,  G11B11/00 ,  G11C11/23 ,  G11C11/30 ,  G11C11/42 ,  G11C13/04 ,  H01L31/08 ,  H04N1/21 ,  G11C11/34

CPC分类号： H01L31/08 ,  G03C1/705 ,  G11B11/00 ,  G11B7/241 ,  G11B9/08 ,  G11C11/23 ,  G11C13/04 ,  H04N1/2108 ,  G11B2007/2571 ,  G11B2007/25715

摘要： An information recording method is provided, in which a p- or n-type semiconductor wafer is irradiated with an energetic particle beam such as an electron beam thereby to control, e.g., decreased or increased generation of the surface photovoltage at the irradiated area so that information may be recorded on the wafer.

摘要翻译： 提供了一种信息记录方法，其中p型或n型半导体晶片被诸如电子束的能量粒子束照射，从而控制例如在照射区域处的表面光电压的产生减少或增加，使得 信息可以记录在晶片上。

公开(公告)号：US20110194248A1

公开(公告)日：2011-08-11

申请号：US13021931

申请日：2011-02-07

申请人： Akira Nakasaka ,  Masaru Miyazaki ,  Kenichi Oohama

发明人： Akira Nakasaka ,  Masaru Miyazaki ,  Kenichi Oohama

IPC分类号： H05K7/20

CPC分类号： H05K7/20854 ,  H01L23/473 ,  H01L25/112 ,  H01L25/162 ,  H01L2924/0002 ,  H01L2924/00

摘要： The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit . The internal unit including therein the semiconductor modules also includes a control circuit board fitted to board fixing sections formed in the frame so as to project from the frame in the height direction perpendicular to the plane of the frame. Each of the board fixing sections has a board abutment surface at a position closer to the frame than the tips of control terminals of the semiconductor modules formed so as to project in the height direction.

摘要翻译： 电力转换装置包括构成电力转换电路的电子部件，用于冷却至少一部分电子部件的冷却器，以及容纳电子部件和冷却器的壳体。 电子部件和冷却器中的至少一些固定在框架内并作为内部单元集成。 其中包括半导体模块的内部单元还包括控制电路板，该控制电路板安装成在框架中形成的固定部分，以便在与框架的平面垂直的高度方向上从框架突出。 每个板固定部分在比半导体模块的控制端子的尖端更靠近框架的位置处具有板抵接表面，所述端部形成为在高度方向上突出。

公开(公告)号：US5296733A

公开(公告)日：1994-03-22

申请号：US615381

申请日：1990-11-19

申请人： Chushiroh Kusano ,  Hiroshi Masuda ,  Katsuhiko Mitani ,  Kazuhiro Mochizuki ,  Masaru Miyazaki ,  Masahiko Kawata ,  Susumu Takahashi

发明人： Chushiroh Kusano ,  Hiroshi Masuda ,  Katsuhiko Mitani ,  Kazuhiro Mochizuki ,  Masaru Miyazaki ,  Masahiko Kawata ,  Susumu Takahashi

IPC分类号： H01L29/73 ,  H01L21/331 ,  H01L29/205 ,  H01L29/737 ,  H01L29/72 ,  H01L29/06

CPC分类号： H01L29/7371

摘要： A hetero junction bipolar transistor provides a contact area an area between an emitter (or collector) electrode and a wiring formed on the electrode that is larger than that of the emitter (or collector). A variation in voltage applied to an emitter (or collector)-base junctions is prevented and a stable operation of the transistor is attained. In addition, when an etching operation is carried out, an insulation film is formed on a side part of a mask. A patterning of the emitter (or collector) is then carried out and thus an emitter (or collector) having a size approximate to that of the mask is formed.

摘要翻译： 异质结双极晶体管提供接触区域，其在发射极（或集电极）电极和形成在电极上的布线之间的面积大于发射极（或集电极）的面积。 防止施加到发射极（或集电极） - 基极结的电压变化，并且获得晶体管的稳定操作。 另外，当进行蚀刻操作时，在掩模的侧面上形成绝缘膜。 然后执行发射极（或集电极）的图案化，因此形成具有接近于掩模的尺寸的发射极（或集电极）。

公开(公告)号：US4721263A

公开(公告)日：1988-01-26

申请号：US820882

申请日：1986-01-17

申请人： Masaru Miyazaki

发明人： Masaru Miyazaki

IPC分类号： A24C5/20 ,  B65H16/00 ,  B65H19/10 ,  B65H19/00

CPC分类号： B65H16/00 ,  A24C5/20 ,  B65H19/105 ,  B65H2301/415095 ,  B65H2301/543

摘要： A device for automatically stripping and delivering a fore end of a paper roll, in which the fore end of the paper roll, which is wound on a bobbin, is gripped by both a stripping lever and a pawl member when the paper roll fore end gets on the fore end portion of the stripping lever, the stripping lever being capable of coming into contact with and moving away from the paper roll, the pawl member being mounted on a fore end side of the stripping member so as to be capable of coming into contact with and moving away from the fore end of the stripping member. The fore end of the paper roll after being stripped and drawn out by both the stripping member and the pawl member is sucked and delivered to the next step.

摘要翻译： 用于自动剥离和输送纸卷的前端的装置，其中卷绕在线轴上的纸卷的前端在纸卷前端被抓取时由剥离杆和棘爪构件抓住 在剥离杆的前端部分，剥离杆能够与纸卷接触并远离纸卷，棘爪构件安装在剥离构件的前端侧，以便能够进入 与剥离构件的前端接触并远离剥离构件的前端。 被剥离并由剥离构件和棘爪构件拉出的纸卷的前端被吸引并输送到下一步骤。

公开(公告)号：US4705225A

公开(公告)日：1987-11-10

申请号：US833581

申请日：1986-02-26

申请人： Masaru Miyazaki ,  Toshihide Kohata

发明人： Masaru Miyazaki ,  Toshihide Kohata

IPC分类号： B65H19/10 ,  B65H19/18 ,  B65H19/20 ,  B65H19/26

CPC分类号： B65H19/1873 ,  B65H19/105 ,  B65H19/1836 ,  Y10T83/148 ,  Y10T83/4708 ,  Y10T83/902

摘要： An automatic wrapping material change-over apparatus having a plurality of bobbins each with a wrapping material wound thereon and functioning to change-over from one bobbin from which the wrapping material is being drawn out, to another bobbin and cut simultaneously the wrapping material from the one bobbin and that from the another bobbin upon detection of a mark register between both wrapping materials, in which the thus-cut end of the wrapping material from the another bobbin follows the thus-cut end of the wrapping material from the one bobbin.

摘要翻译： 一种自动包装材料转换装置，其具有多个线轴，每个线轴上缠绕有包裹材料，并且能够从包裹材料被抽出的一个筒管转换到另一个筒管，并同时切割来自包装材料的包装材料 一个线轴和从另一个线轴检测到两个包装材料之间的标记寄存器的线轴，其中来自另一个线轴的包裹材料的这样切割的端部从包裹材料的切割端跟随着一个线轴。

公开(公告)号：USD285731S

公开(公告)日：1986-09-16

申请号：US644589

申请日：1984-08-27

申请人： Teizoh Satoh ,  Masaru Miyazaki

设计人： Teizoh Satoh ,  Masaru Miyazaki