公开(公告)号：US06893171B2

公开(公告)日：2005-05-17

申请号：US10417460

申请日：2003-04-16

申请人： Yoshiteru Fukutomi ,  Kenji Sugimoto ,  Takashi Ito ,  Takeo Okamoto ,  Yukihiko Inagaki ,  Katsushi Yoshioka ,  Tsuyoshi Mitsuhashi

发明人： Yoshiteru Fukutomi ,  Kenji Sugimoto ,  Takashi Ito ,  Takeo Okamoto ,  Yukihiko Inagaki ,  Katsushi Yoshioka ,  Tsuyoshi Mitsuhashi

IPC分类号： G03F7/30 ,  B05C9/14 ,  B05C13/00 ,  B65G1/00 ,  H01L21/00 ,  H01L21/027 ,  H01L21/67 ,  H01L21/677 ,  G03D5/00 ,  B65G49/07 ,  B65H1/00 ,  G03B27/32

CPC分类号： H01L21/67173 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/67276 ,  H01L21/67778 ,  Y10S414/135

摘要： A substrate treating apparatus disclosed herein realizes improved throughput. The substrate treating apparatus according to this invention includes an antireflection film forming block, a resist film forming block and a developing block arranged in juxtaposition. Each block includes chemical treating modules, heat-treating modules and a single main transport mechanism. The main transport mechanism transports substrates within each block. Transfer of the substrates between adjacent blocks is carried out through substrate rests. The main transport mechanism of each block is not affected by movement of the main transport mechanisms of the adjoining blocks. Consequently, the substrates may be transported efficiently to improve the throughput of the substrate treating apparatus.

摘要翻译： 本文公开的基板处理装置实现了改善的生产量。 根据本发明的基板处理装置包括并列布置的防反射膜形成块，抗蚀剂膜形成块和显影块。 每个块包括化学处理模块，热处理模块和单个主要输送机构。 主要运输机构在每个区块内运输基材。 通过基板支架进行相邻块之间的基板的转移。 每个块的主要运输机构不受邻接块主运输机构的运动的影响。 因此，可以有效地输送基板，以提高基板处理装置的通过量。

公开(公告)号：US06752543B2

公开(公告)日：2004-06-22

申请号：US10427049

申请日：2003-04-30

申请人： Yoshiteru Fukutomi ,  Katsushi Yoshioka ,  Yukihiko Inagaki

发明人： Yoshiteru Fukutomi ,  Katsushi Yoshioka ,  Yukihiko Inagaki

IPC分类号： G03D500

CPC分类号： H01L21/67017

摘要： A manifold communicatively connects a plurality of coating processing units with an air conditioning unit. The manifold is formed by branching a common pipe into a plurality of distributing pipes. The air conditioning unit performs temperature control to set air passing through a branch point of the manifold to a temperature slightly lower than a target temperature in processing units. Secondary heaters secondarily heat air passing through joints between the distributing pipes and the processing units to the target temperature thereby supplying accurately temperature-controlled air to processing parts. Air from the air conditioning unit is diverted thereby suppressing the height of the overall apparatus. Thus, a substrate processing apparatus capable of inhibiting the height of the overall apparatus from remarkable increase also when vertically stacking processing parts in multiple stages and supplying temperature-controlled air to the processing parts with sufficient accuracy.

摘要翻译： 歧管将多个涂覆处理单元与空调单元连通地连接。 歧管通过将公共管分支成多个分配管而形成。 空气调节单元进行温度控制，将通过歧管的分支点的空气设定为比处理单位略低于目标温度的温度。 二次加热器二次将通过分配管和处理单元之间的接合处的空气加热到目标温度，从而将精确地温度控制的空气供给到处理部件。 来自空调单元的空气被转向，从而抑制整个装置的高度。 因此，当以多级垂直堆叠处理部分并且以足够的精度向处理部分供应温度控制的空气时，能够抑制整个装置的高度的基板处理装置也显着增加。

公开(公告)号：US5792259A

公开(公告)日：1998-08-11

申请号：US749348

申请日：1996-11-21

申请人： Katsushi Yoshioka ,  Yoshiteru Fukutomi ,  Kenji Sugimoto

发明人： Katsushi Yoshioka ,  Yoshiteru Fukutomi ,  Kenji Sugimoto

IPC分类号： G03F7/16 ,  B05C11/08 ,  B05C15/00 ,  H01L21/027 ,  B05C5/00

CPC分类号： B05C15/00 ,  B05C11/08

摘要： A velocity adjusting plate is provided above a substrate processing part in the interior of a substrate processing apparatus which is isolated from the external air. Thus, a downflow which is formed by conditioned air in the interior of the apparatus is separated into downflows having high and low velocities to be supplied to the substrate processing part and the periphery of the substrate processing part respectively. Consequently, the former downflow has a velocity which is suitable for controlling the temperature-humidity on the substrate surface and preventing the substrate from adhesion of particles and fine grains of a processing solution scattered from the substrate, while the latter downflow is suppressed to the minimum velocity which is necessary for preventing dusts and particles from creeping up by dispersion. Thus, it is possible to reduce consumption of air which is adjusted in temperature-humidity while isolating the interior of the apparatus from the external air.

摘要翻译： 速度调节板设置在与外部空气隔离的基板处理装置的内部的基板处理部的上方。 因此，在设备内部由调节空气形成的下降流被分离成具有高和低速度的下流，以分别供应到基板处理部分和基板处理部分的周边。 因此，前一下降流具有适合于控制基板表面的温度湿度的速度，并且防止基板粘附从基板散射的处理溶液的颗粒和细晶粒，同时将下降流抑制到最小 防止灰尘和颗粒通过分散而爬行所需的速度。 因此，可以在将设备的内部与外部空气隔离的同时降低在温度湿度下调节的空气的消耗。

公开(公告)号：US5677000A

公开(公告)日：1997-10-14

申请号：US699728

申请日：1996-08-19

申请人： Katsushi Yoshioka ,  Yoshiteru Fukutomi ,  Tsuyoshi Mitsuhashi ,  Kenji Sugimoto

发明人： Katsushi Yoshioka ,  Yoshiteru Fukutomi ,  Tsuyoshi Mitsuhashi ,  Kenji Sugimoto

IPC分类号： B05C11/08 ,  G03F7/16 ,  H01L21/00 ,  H01L21/027 ,  H01L21/304 ,  B05D3/12 ,  B05C11/00

CPC分类号： H01L21/6715 ,  G03F7/162

摘要： A substrate spin treating method and apparatus having a cup cleaner device for cleaning a scatter preventive cup, which cleaner device does not require attaching and/or detaching of a cleaning jig. The cleaner device is driven through engagement with a spin chuck which operates at a low torque that is provided for normal substrate spin treating operation. During the normal spin treating operation, only the spin chuck is driven by a rotary shaft, with the cup cleaner device being disengaged from the spin chuck and its driving rotary shaft. For a cup cleaning operation, the spin chuck and scatter preventive cup are vertically moved relative to each other to place the cup cleaner device at a cup cleaning height and to drivingly connect the cup cleaner device to the rotary shaft through a torque transmitter. In this state, the cup cleaner device is rotated to establish a centrifugal force that scatters a cleaning solution supplied to a cleaning solution guide of the cup cleaner device from cleaning solution supply nozzles, thereby cleaning inner surfaces of the scatter preventive cup.

摘要翻译： 一种具有用于清洁散射防止杯的杯子清洁器装置的衬底旋转处理方法和装置，该清洁装置不需要附着和/或拆卸清洁夹具。 清洁器装置通过与旋转卡盘啮合而被驱动，旋转卡盘以为正常的基底旋转处理操作提供的低扭矩操作。 在正常的旋转处理操作期间，只有旋转卡盘由旋转轴驱动，杯子清洁器装置与旋转卡盘及其驱动旋转轴脱离。 对于杯子清洁操作，旋转卡盘和防散射杯相对于彼此垂直移动，以将杯清洁器设备放置在杯清洁高度处，并且通过扭矩传递器驱动地将杯清洁器装置连接到旋转轴。 在这种状态下，杯子清洁器装置被旋转以建立离心力，该离心力将供应到杯清洁器装置的清洁溶液引导件的清洁溶液从清洁溶液供应喷嘴分散，从而清洁防散射杯的内表面。

公开(公告)号：US08851008B2

公开(公告)日：2014-10-07

申请号：US12163951

申请日：2008-06-27

申请人： Yoshiteru Fukutomi ,  Tsuyoshi Mitsuhashi ,  Hiroyuki Ogura ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

发明人： Yoshiteru Fukutomi ,  Tsuyoshi Mitsuhashi ,  Hiroyuki Ogura ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

IPC分类号： B05C13/00 ,  B05C5/00 ,  H01L21/31 ,  H01L21/00 ,  H01L21/67 ,  B05D5/12 ,  B05B15/12 ,  B05D3/04

CPC分类号： H01L21/67178 ,  B05B14/43 ,  B05B14/44 ,  B05C13/00 ,  B05C13/02 ,  B05D3/0486 ,  G03F7/26 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67225 ,  H01L23/34 ,  H01L2924/0002 ,  Y10S414/135 ,  H01L2924/00

摘要： A substrate treating apparatus includes a plurality of substrate treatment lines arranged vertically. Each substrate treatment line has a plurality of main transport mechanisms arranged horizontally, and a plurality of treating units provided for each main transport mechanism for treating substrates. A series of treatments is carried out for the substrates, with each main transport mechanism transporting the substrates to the treating units associated therewith, and transferring the substrates to the other main transport mechanism horizontally adjacent thereto. The substrate treating apparatus realizes increased processing capabilities by treating the substrates in parallel through the substrate treatment lines.

摘要翻译： 基板处理装置包括垂直布置的多个基板处理线。 每个基板处理线具有水平布置的多个主传送机构，以及为每个用于处理基板的主传送机构设置的多个处理单元。 对于基板进行一系列处理，每个主传送机构将基板传送到与其相关联的处理单元，并将基板传送到与其水平相邻的另一主传送机构。 基板处理装置通过基板处理线平行地处理基板来实现增加的处理能力。

公开(公告)号：US07641405B2

公开(公告)日：2010-01-05

申请号：US12031677

申请日：2008-02-14

申请人： Yoshiteru Fukutomi

发明人： Yoshiteru Fukutomi

IPC分类号： G03D5/00 ,  G03B27/32

CPC分类号： H01L21/67051 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/68707 ,  H01L21/68728 ,  H01L21/68764 ,  Y10S134/902

摘要： A substrate processing apparatus arranged adjacent to an exposure device includes a processing section that subjects a substrate to processing and an interface provided adjacent to one end of the processing section configured to transfer and receive the substrate between the processing section and the exposure device. The processing section includes a photosensitive film formation unit configured to form a photosensitive film composed of a photosensitive material on the substrate that has not been subjected to exposure processing by the exposure device, a top surface and edge cleaning unit configured to clean a top surface and an edge of the substrate, and a development unit configured to subject the substrate to development processing after the exposure processing by the exposure device.

摘要翻译： 布置在曝光装置附近的基板处理装置包括处理基板进行处理的处理部分和与处理部分的一端相邻设置的接口，该处理部分配置成在处理部分和曝光装置之间传送和接收基板。 处理部包括：感光膜形成单元，被配置为在未被曝光装置进行曝光处理的基板上形成由感光材料构成的感光膜;上表面和边缘清洁单元，被配置为清洁顶表面;以及 基板的边缘，以及显影单元，其构造成在曝光装置的曝光处理之后对基板进行显影处理。

公开(公告)号：US20090165711A1

公开(公告)日：2009-07-02

申请号：US12343302

申请日：2008-12-23

申请人： Hiroyuki Ogura ,  Tsuyoshi Mitsuhashi ,  Yoshiteru Fukutomi ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

发明人： Hiroyuki Ogura ,  Tsuyoshi Mitsuhashi ,  Yoshiteru Fukutomi ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

IPC分类号： B05C11/00

CPC分类号： H01L21/67745 ,  H01L21/6715 ,  H01L21/67178 ,  H01L21/67276 ,  H01L21/67754 ,  H01L21/6776

摘要： A treating section has substrate treatment lines arranged one over the other for treating substrates while transporting the substrates substantially horizontally. An IF section transports the substrates fed from each substrate treatment line to an exposing machine provided separately from this apparatus. The substrates are transported to the exposing machine in the order in which the substrates are loaded into the treating section. The throughput of this apparatus can be improved greatly, without increasing the footprint, since the substrate treatment lines are arranged one over the other. Each substrate can be controlled easily since the order of the substrates transported to the exposing machine is in agreement with the order of the substrates loaded into the treating section.

摘要翻译： 一个处理部分具有一个相互排列的衬底处理线，用于处理衬底，同时基本上水平地传送衬底。 IF部分将从每个基板处理线馈送的基板输送到与该装置分开设置的曝光机。 将基板按照将基板装入处理部的顺序输送到曝光机。 由于基板处理线彼此排列，因此能够大大提高该装置的生产量，而不增加占用面积。 可以容易地控制每个基板，因为输送到曝光机的基板的顺序与装载到处理部中的基板的顺序一致。

公开(公告)号：US20080198341A1

公开(公告)日：2008-08-21

申请号：US12031667

申请日：2008-02-14

申请人： Yoshiteru Fukutomi ,  Masami Ohtani

发明人： Yoshiteru Fukutomi ,  Masami Ohtani

IPC分类号： G03B27/52

CPC分类号： H01L21/68764 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/68707 ,  H01L21/68728

摘要： In a substrate processing apparatus, an indexer block, a resist film processing block, a cleaning/drying processing block, a development processing block, and an interface block are provided side by side in this order. An exposure device is arranged adjacent to the interface block. The exposure device subjects a substrate to exposure processing by means of a liquid immersion method. Substrate platforms are provided in close proximity one above the other between the cleaning/drying processing block and the development processing block for receiving and transferring the substrate therebetween. Reversing units that reverse one surface and the other surface of the substrate are respectively stacked above and below the substrate platforms.

摘要翻译： 在基板处理装置中，按顺序并排设置分度器块，抗蚀剂膜处理块，清洁/干燥处理块，显影处理块和界面块。 曝光装置设置在接口块附近。 曝光装置通过液浸法对基板进行曝光处理。 在清洁/干燥处理块和用于在其间接收和转移基板的显影处理块之间彼此靠近地提供基板平台。 将基板的一个表面和另一个表面反转的反转单元分别堆叠在基板平台的上方和下方。

公开(公告)号：US5765072A

公开(公告)日：1998-06-09

申请号：US803618

申请日：1997-02-21

申请人： Masami Ohtani ,  Yoshiteru Fukutomi

发明人： Masami Ohtani ,  Yoshiteru Fukutomi

IPC分类号： B05C11/08 ,  B05C11/10 ,  G03D3/06 ,  H01L21/027 ,  G03D3/02

CPC分类号： G03D3/06

摘要： A substrate treating apparatus includes a substrate treating station for performing a predetermined treatment of substrates by supplying a predetermined treating solution to the substrates, and at least one treating solution supply mechanism for supplying the treating solution in a forced feed under gas pressure to the substrate treating station. The solution supply mechanism has a treating solution storage tank, a pressurizing mechanism, a pressure release mechanism and a valve for selectively allowing and stopping supply of the treating solution. The storage tank begins to be pressurized a predetermined time before the treating solution is supplied to a first substrate in a lot including a plurality of substrates to be treated successively with the same solution. Pressure is released from the storage tank based on a time at which the treating solution is stopped being supplied to a last substrate in the lot or at a predetermined slightly later time. Such control is effected lot by lot. Gas dissolution in the treating solution is reduced without using an expensive gas which would result in high running cost.

摘要翻译： 基板处理装置包括：基板处理台，用于通过向基板供给预定的处理溶液来进行基板的预定处理;以及至少一个处理溶液供给机构，用于将处理液在气体压力下供给至基板处理 站。 溶液供给机构具有处理液储存罐，加压机构，压力释放机构和用于选择性地允许和停止处理溶液供应的阀。 储存罐在预定时间开始加压，然后将处理溶液以相同的溶液依次供给到包括多个待处理基板的批次中的第一基板。 基于停止处理液的时间，从储罐释放压力，供给到批次中的最后一个基板或预定的稍后时间。 这种控制是按批次进行的。 在处理溶液中的气体溶解减少，而不使用昂贵的气体，这将导致高的运行成本。

公开(公告)号：US08545118B2

公开(公告)日：2013-10-01

申请号：US12324794

申请日：2008-11-26

申请人： Hiroyuki Ogura ,  Tsuyoshi Mitsuhashi ,  Yoshiteru Fukutomi ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

发明人： Hiroyuki Ogura ,  Tsuyoshi Mitsuhashi ,  Yoshiteru Fukutomi ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

IPC分类号： G03D5/00

CPC分类号： B05C13/00 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67225

摘要： The invention provides coating units, heat-treating units, and a first main transport mechanism for transporting substrates to each of these treating units. The substrates are transferred from the first main transport mechanism to a second main transport mechanism through a receiver. When a substrate cannot be placed on the receiver, this substrate is placed on a buffer. Thus, the first main transport mechanism can continue transporting other substrates. The other substrates in the treating units are transported between the treating units without delay, to receive a series of treatments including coating treatment and heat treatment as scheduled. This prevents lowering of the quality of treatment for forming film on the substrates.

摘要翻译： 本发明提供涂覆单元，热处理单元和用于将基底输送到这些处理单元中的每一个的第一主输送机构。 基板通过接收器从第一主输送机构传送到第二主输送机构。 当基板不能放置在接收器上时，将该基板放置在缓冲器上。 因此，第一主输送机构可以继续输送其它基板。 处理单元中的其它基材在处理单元之间没有延迟地输送，以接收包括涂覆处理和热处理的一系列处理。 这防止了在基板上形成膜的处理质量的降低。