公开(公告)号：US20060246681A1

公开(公告)日：2006-11-02

申请号：US10544428

申请日：2004-01-30

申请人： Youngfu Li ,  Robert Kirchhoff ,  Jason Niu ,  Kenneth Foster

发明人： Youngfu Li ,  Robert Kirchhoff ,  Jason Niu ,  Kenneth Foster

IPC分类号： H01L21/76

CPC分类号： H01L21/02118 ,  H01L21/312 ,  H01L21/7682

摘要： A method of forming an air gap within a semiconductor structure by the steps of: (a) using a sacrificial polymer to occupy a space in a semiconductor structure; and (b) heating the semiconductor structure to decompose the sacrificial polymer leaving an air gap within the semiconductor structure, wherein the sacrificial polymer of step (a) is: (a) a copolymer of 5-ethylidene-2-norbornene and vinylbenzocyclobutene (or a vinylbenzocyclobutene derivative); or (b) a copolymer of 5-ethylidene-2-norbornene and 5-(3benzocyclobutylidene)-2-norbornene; or (c) a polymer of 5-(3benzocyclobutylidene)-2-norbornene. In addition, a semiconductor structure, having a sacrificial polymer positioned between conductor lines, wherein the sacrificial polymer is: (a) a copolymer of 5-ethylidene-2-norbornene and vinylbenzocyclobutene (or a vinylbenzocyclobutene derivative); or (b) a copolymer of 5-ethylidene-2-norbornene and 5-(3benzocyclobutylidene)-2-norbornene; or (c) a polymer of 5-(3benzocyclobutylidene)-2-norbornene.

公开(公告)号：US20060292892A1

公开(公告)日：2006-12-28

申请号：US10544415

申请日：2004-01-30

申请人： Robert Kirchhoff ,  Jason Niu ,  Younfu Li ,  Kenneth Foster

发明人： Robert Kirchhoff ,  Jason Niu ,  Younfu Li ,  Kenneth Foster

IPC分类号： H01L23/58 ,  H01L21/31

CPC分类号： H01L21/02118 ,  C08F212/34 ,  C08F222/10 ,  H01L21/312 ,  H01L21/7682 ,  H01L23/5222 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： A method of forming an air gap within a semiconductor structure by the steps of: (a) using a sacrificial polymer to occupy a space in a semiconductor structure; and (b) heating the semiconductor structure to decompose the sacrificial polymer leaving an air gap within the semiconductor structure, wherein the sacrificial polymer of step (a) is a copolymer of bis [3-(4-benzocyclobutenyl)] 1,n (n=2-12) alkyldiol diacrylate (such as bis [3-(4-benzocyclobutenyl)] 1,6 hexanediol diacrylate) and 1,3 bis 2 [4-benzocyclobutenyl (ethenyl)] benzene. In addition, a semiconductor structure, having a sacrificial polymer positioned between conductor lines, wherein the sacrificial polymer is a copolymer of bis [3-(4-benzocyclobutenyl)] 1,n (n=2-12)alkyldiol diacrylate and 1,3 bis 2 [4-benzocyclobutenyl(ethenyl)] benzene.

摘要翻译： 一种通过以下步骤在半导体结构内形成气隙的方法：（a）使用牺牲聚合物占据半导体结构中的空间; （b）加热半导体结构以分解牺牲聚合物，在半导体结构内留下空隙，其中步骤（a）的牺牲聚合物是双[3-（4-苯并环丁烯基）] 1，n（n = 2-12）二丙烯酸烷基二醇酯（例如双[3-（4-苯并环丁烯基）] 1,6-己二醇二丙烯酸酯）和1,3-双2 [4-苯并环丁烯基（乙烯基）]苯。 另外，具有位于导体线之间的牺牲聚合物的半导体结构，其中牺牲聚合物是双[3-（4-苯并环丁烯基）] 1，n（n = 2-12）烷基二醇二丙烯酸酯和1,3 双[4-苯并环丁烯基（乙烯基）]苯。

公开(公告)号：US20060264065A1

公开(公告)日：2006-11-23

申请号：US10544416

申请日：2004-01-30

申请人： Ying So ,  Stephen Hahn ,  Robert Kirchhoff ,  Kenneth Foster

发明人： Ying So ,  Stephen Hahn ,  Robert Kirchhoff ,  Kenneth Foster

IPC分类号： H01L23/58 ,  H01L21/31 ,  H01L21/469

CPC分类号： H01L21/02118 ,  H01L21/312 ,  H01L21/7682 ,  H01L23/5222 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： A method of forming an air gap within a semiconductor structure by the steps of: (a) using a sacrificial polymer to occupy a space in a semiconductor structure; and (b) heating the semiconductor structure to decompose the sacrificial polymer leaving an air gap within the semiconductor structure, wherein the sacrificial polymer of step (a) is a copolymer of styrene or styrene derivative (such as alpha methyl styrene) and vinylbenzocyclobutene or a vinylbenzocyclobutene derivative. In addition, a semiconductor structure, having a sacrificial polymer positioned between conductor lines, wherein the sacrificial polymer is a copolymer of styrene or styrene derivative and vinylbenzocyclobutene or a vinylbenzocyclobutene derivative.

摘要翻译： 一种通过以下步骤在半导体结构内形成气隙的方法：（a）使用牺牲聚合物占据半导体结构中的空间; 并且（b）加热半导体结构以分解在半导体结构内留下空隙的牺牲聚合物，其中步骤（a）的牺牲聚合物是苯乙烯或苯乙烯衍生物（例如α-甲基苯乙烯）和乙烯基苯并环丁烯的共聚物或 乙烯基苯并环丁烯衍生物。 另外，具有位于导线之间的牺牲聚合物的半导体结构，其中牺牲聚合物是苯乙烯或苯乙烯衍生物与乙烯基苯并环丁烯或乙烯基苯并环丁烯衍生物的共聚物。

公开(公告)号：US20050124172A1

公开(公告)日：2005-06-09

申请号：US10505511

申请日：2003-04-01

申请人： Paul Townsend III ,  Kenneth Foster

发明人： Paul Townsend III ,  Kenneth Foster

IPC分类号： H01L23/522 ,  H01L21/027 ,  H01L21/311 ,  H01L21/312 ,  H01L21/316 ,  H01L21/762 ,  H01L21/768 ,  H01L23/532 ,  H01L21/31 ,  H01L21/469

CPC分类号： H01L21/02118 ,  H01L21/02203 ,  H01L21/0271 ,  H01L21/0274 ,  H01L21/31144 ,  H01L21/312 ,  H01L21/3122 ,  H01L21/31695 ,  H01L21/76289 ,  H01L21/7682 ,  H01L23/5222 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： A method of forming at least a partial air gap within a semiconducting device and the resulting devices, said method comprising the steps of: (a) depositing a sacrificial polymeric composition in one or more layers of the device during its formation; (b) coating the device with one or more layers of a relatively non-porous, organic, polymeric, insulating dielectric material (hardmask) having a density less than 2.2 g/cm3; and (c) decomposing the sacrificial polymeric composition such that the decomposition products permeate at least partially through the one or more hardmask layers, thereby forming at least a partial air gap within the device.

摘要翻译： 一种在半导体器件内形成至少部分气隙的方法和所得到的器件，所述方法包括以下步骤：（a）在器件的形成过程中将该牺牲聚合物组合物沉积在所述器件的一个或多个层中; （b）用一层或多层具有密度小于2.2g / cm 3的相对无孔的，有机的，聚合的绝缘介电材料（硬掩模）涂覆该装置; 和（c）分解牺牲聚合物组合物，使得分解产物至少部分地渗透通过一个或多个硬掩模层，从而在该装置内形成至少一部分气隙。

公开(公告)号：US20050106324A1

公开(公告)日：2005-05-19

申请号：US10936010

申请日：2004-09-08

申请人： Mitchell Dibbs ,  Michael Inbasekaran ,  Paul Townsend ,  Kenneth Foster ,  Shaoguang Feng ,  David Brennan ,  Q. Niu ,  James Godschalx ,  Dean Welsh ,  Ray Drumright

发明人： Mitchell Dibbs ,  Michael Inbasekaran ,  Paul Townsend ,  Kenneth Foster ,  Shaoguang Feng ,  David Brennan ,  Q. Niu ,  James Godschalx ,  Dean Welsh ,  Ray Drumright

IPC分类号： H01L51/30 ,  H01L51/40 ,  B05D3/02

CPC分类号： H01L51/0043 ,  H01L51/0003 ,  H01L51/0035 ,  H01L51/0039 ,  H01L51/0059

摘要： The present invention relates to a method for preparing polymeric films, preferably electroactive films, with enhanced physical properties by the steps of applying to a substrate a solution of a polymer containing pendant labile solubilizing groups, then removing the solvent and a sufficient concentration of the labile solubilizing groups render the polymer less soluble in the solvent than before the labile groups were removed. It is believed that the removal of pendant soluble groups a) permits optimization of the semiconducting backbone for charge transport performance, b) allows direct control of microstructure in the final film, and c) renders the final film more robust during subsequent process steps needed to construct multilayer devices.

摘要翻译： 本发明涉及通过以下步骤制备具有增强的物理性能的聚合物薄膜，优选电活性薄膜的方法：向基材施加含有不稳定增溶基团的聚合物溶液，然后除去溶剂和足够浓度的不稳定 增溶基团使得聚合物在除去不稳定基团之前较不溶于溶剂。 据信去除侧链可溶性基团a）允许优化用于电荷传输性能的半导电骨架，b）允许直接控制最终膜中的微结构，以及c）使后续工艺步骤中的最终膜更坚固， 构建多层设备。

公开(公告)号：US20060157462A1

公开(公告)日：2006-07-20

申请号：US11299015

申请日：2005-12-09

申请人： Keith Weiss ,  Rebecca Northey ,  Robert Schwenke ,  Kenneth Foster

发明人： Keith Weiss ,  Rebecca Northey ,  Robert Schwenke ,  Kenneth Foster

IPC分类号： B60L1/02

CPC分类号： H05B3/84 ,  H05B3/86 ,  H05B2203/002 ,  H05B2203/014

摘要： A plastic window and defroster assembly that enhances the amount of heat generated in the critical viewing area of a transparent plastic glazing panel. The assembly includes a transparent plastic panel and a conductive heater grid formed by printing a conductive ink with a sheet resistivity of less than about milliohms/square @ 25.4 μm (1 mil).

摘要翻译： 一个塑料窗户和除霜器组件，增强了在透明塑料玻璃面板的关键观察区域产生的热量。 该组件包括透明塑料面板和通过印刷导电油墨而形成的导电加热器格栅，其电阻率小于约25.4mum（1密耳）的约百万欧姆/平方米。

公开(公告)号：US20070212548A1

公开(公告)日：2007-09-13

申请号：US11372656

申请日：2006-03-10

申请人： Christophe Lefaux ,  Sunitha Grandhee ,  Kenneth Foster

发明人： Christophe Lefaux ,  Sunitha Grandhee ,  Kenneth Foster

IPC分类号： B32B9/04 ,  B32B27/36 ,  B32B27/06

CPC分类号： B32B27/08 ,  B05D1/62 ,  B05D5/00 ,  B05D7/04 ,  B05D7/52 ,  B32B27/286 ,  B32B27/304 ,  B32B27/308 ,  B32B27/365 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2307/4023 ,  B32B2307/412 ,  B32B2307/584 ,  C09D11/104 ,  Y10T428/31504 ,  Y10T428/31786

摘要： A plastic glazing system for automotive windows is disclosed. The system comprises a transparent plastic substrate comprising a first surface and a second surface, and a blackout layer disposed on the periphery of the first surface of the substrate. The blackout layer has a predetermined glass transition temperature. The system further comprises an abrasion-resistant layer disposed on the first surface, the abrasion-resistant layer being compatible with the blackout layer.

摘要翻译： 公开了一种用于汽车窗的塑料玻璃窗系统。 该系统包括包括第一表面和第二表面的透明塑料基板，以及设置在基板的第一表面的周边上的遮光层。 停电层具有预定的玻璃化转变温度。 该系统还包括设置在第一表面上的耐磨层，耐磨层与遮光层相兼容。