Insulated wire
    7.
    发明授权
    Insulated wire 失效
    绝缘电线

    公开(公告)号:US4505980A

    公开(公告)日:1985-03-19

    申请号:US439199

    申请日:1982-11-04

    摘要: An insulated wire having excellent heat resistance, abrasion resistance and flexibility can be prepared by coating on an electric conductor directly or via another insulating material a polyamide-imide resin composition prepared by reacting an aromatic diisocyanate and a tricarboxylic acid anhydride in the presence of a basic solvent while adjusting the resin content at 40% by weight or more, and adding to the reaction system a lactam in an amount of 0.1 to 1.0 mole per mole of the aromatic diisocyanate, and if necessary, an alcohol and/or an oxime in an amount of 0.01 to 0.5 mole per mole of the aromatic diisocyanate before, during or after the above-mentioned reaction to mask terminal functional groups and to make the reduced viscosity of the composition 0.1 to 0.27, and baking the resin composition.

    摘要翻译: 具有优异的耐热性,耐磨性和柔韧性的绝缘线可以通过在电导体上直接或通过另一种绝缘材料涂覆聚酰胺酰亚胺树脂组合物来制备,所述聚酰胺酰亚胺树脂组合物通过芳基二异氰酸酯和三羧酸酐在碱存在下反应制备 溶剂,同时将树脂含量调节至40重量%以上,并且向反应体系中加入每摩尔芳族二异氰酸酯为0.1至1.0摩尔量的内酰胺,如果需要,将其中的醇和/或肟 在上述掩蔽末端官能团的反应之前,期间或之后,使组合物的比浓对数为0.1〜0.27,并将该树脂组合物烘烤,每摩尔芳族二异氰酸酯的量为0.01〜0.5摩尔。

    POLISHING COMPOSITION
    10.
    发明申请
    POLISHING COMPOSITION 有权
    抛光组合物

    公开(公告)号:US20130324015A1

    公开(公告)日:2013-12-05

    申请号:US14000319

    申请日:2012-02-20

    IPC分类号: B24B37/04 C09G1/02

    摘要: Provided is a polishing composition containing at least aluminum oxide abrasive grains and water, and having a pH of 8.5 or higher. The aluminum oxide abrasive grains have a specific surface area of 20 m2/g or less. It is preferable for the aluminum oxide abrasive grains to have an average secondary particle size of 0.1 μm or more and 20 μm or less. The polishing composition is used for polishing hard and brittle materials having a Vickers hardness of 1,500 Hv or higher, such as sapphire, silicon carbide, and gallium nitride.

    摘要翻译: 本发明提供至少含有氧化铝磨粒和水,pH值在8.5以上的抛光组合物。 氧化铝磨粒的比表面积为20m 2 / g以下。 优选氧化铝磨粒的平均二次粒径为0.1μm以上且20μm以下。 抛光组合物用于研磨维氏硬度为1500Hv或更高的硬质和脆性材料,例如蓝宝石,碳化硅和氮化镓。