公开(公告)号：US06791116B2

公开(公告)日：2004-09-14

申请号：US10424137

申请日：2003-04-28

申请人： Yuji Takahashi ,  Shigeru Fukumoto ,  Katsunori Arakane ,  Atsuo Hirano ,  Kunihiro Hadame ,  Kunihiko Obara ,  Toshihide Maeda ,  Hiromi Kitahara ,  Kenichi Koya ,  Yoshinobu Yamanouchi

发明人： Yuji Takahashi ,  Shigeru Fukumoto ,  Katsunori Arakane ,  Atsuo Hirano ,  Kunihiro Hadame ,  Kunihiko Obara ,  Toshihide Maeda ,  Hiromi Kitahara ,  Kenichi Koya ,  Yoshinobu Yamanouchi

IPC分类号： H01L2715

CPC分类号： H01L33/508 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/16145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48464 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a light emitting diode, a scattering material-containing light guiding/scattering layer is provided which directly receives light emitted from a light emitting element. The scattering material contained in the light guiding/scattering layer irregularly reflects and scatters the incident light. The scattered light is led to a fluorescence emitting layer formed of a transparent binder containing a phosphor material. The probability of incidence of light having high optical density, which has been emitted from the light emitting element, directly to the phosphor material contained in the fluorescence emitting layer is lowered, and light can be radiated from the whole fluorescence emitting layer. Therefore, uniform light having a desired color can be radiated with high efficiency from the light emitting diode.

摘要翻译： 在发光二极管中，提供了直接接收从发光元件发出的光的含散射材料的导光/散射层。 包含在导光/散射层中的散射材料不规则地反射和散射入射光。 将散射光导入由含有荧光体材料的透明粘合剂形成的荧光发射层。 从发光元件发射的具有高光密度的光直接进入荧光发射层中所含的荧光体材料的入射概率降低，并且可以从整个荧光发射层照射光。 因此，可以从发光二极管以高效率辐射具有所需颜色的均匀光。

公开(公告)号：US20110101399A1

公开(公告)日：2011-05-05

申请号：US12923788

申请日：2010-10-07

申请人： Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

发明人： Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

IPC分类号： H01L33/52 ,  H01L31/0203

CPC分类号： H01L33/56 ,  C03B23/20 ,  C03C8/24 ,  C03C27/06 ,  H01L24/17 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01057 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A solid element device includes a solid element, an electric power receiving and supplying part for receiving electric power from and supplying the electric power to the solid element, and an inorganic sealing material for sealing the solid element. The inorganic sealing material includes a low melting glass selected from SiO2—Nb2O5-based, B2O3—F-based, P2O5—F-based, P2O5—ZnO-based, SiO2—B2O3—La2O3-based, and SiO2—B2O3-based low melting glasses.

摘要翻译： 固体元件装置包括固体元件，用于从固体元件接收电力并向其提供电力的电力接收和供应部件，以及用于密封固体元件的无机密封材料。 无机密封材料包括选自SiO 2-Nb 2 O 5系，B 2 O 3 -F系，P 2 O 5 -F系，P 2 O 5·ZnO系，SiO2-B2O3-La2O3系，SiO2-B2O3系低 熔化眼镜。

公开(公告)号：US07497597B2

公开(公告)日：2009-03-03

申请号：US11036192

申请日：2005-01-18

申请人： Yoshinobu Suehiro ,  Hideaki Kato ,  Kunihiro Hadame

发明人： Yoshinobu Suehiro ,  Hideaki Kato ,  Kunihiro Hadame

IPC分类号： F21V29/00

CPC分类号： H01L33/62 ,  H01L33/56 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light emitting apparatus has a light emitting element, and a transparent glass section and a metal section that surround the light emitting element. The transparent glass section and the metal section have a ratio in thermal expansion coefficient to the light emitting element in a range of 150% to 500%.

摘要翻译： 发光装置具有发光元件，以及包围发光元件的透明玻璃部分和金属部分。 透明玻璃部分和金属部分的热膨胀系数与发光元件的比率在150％至500％的范围内。

公开(公告)号：US20120171789A1

公开(公告)日：2012-07-05

申请号：US13419093

申请日：2012-03-13

申请人： Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

发明人： Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

IPC分类号： H01L33/52 ,  H01L33/64

CPC分类号： H01L33/56 ,  C03B23/20 ,  C03C8/24 ,  C03C27/06 ,  H01L24/17 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01057 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of making a solid element device that includes a solid element, an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK, an external terminal provided separately from the element mount part and electrically connected to the solid element, and a glass sealing part directly contacting and covering the solid element for sealing the solid element, includes pressing a glass material at a temperature higher than a yield point of the glass material for forming the glass sealing part.

摘要翻译： 一种固体元件装置的制造方法，该固体元件装置包括固体元件，安装有固体元件的元件安装部件，其导热率不小于100W / mK，与元件安装部件分开设置的外部端子 并且与固体元件电连接，并且直接接触和覆盖固体元件以密封固体元件的玻璃密封部件包括在玻璃材料的高于用于形成玻璃密封部分的玻璃材料的屈服点的温度下挤压玻璃材料。

公开(公告)号：US08154047B2

公开(公告)日：2012-04-10

申请号：US12923788

申请日：2010-10-07

申请人： Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

发明人： Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

IPC分类号： H01L33/56

CPC分类号： H01L33/56 ,  C03B23/20 ,  C03C8/24 ,  C03C27/06 ,  H01L24/17 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01057 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A solid element device includes a solid element, an electric power receiving and supplying part for receiving electric power from and supplying the electric power to the solid element, and an inorganic sealing material for sealing the solid element. The inorganic sealing material includes a low melting glass selected from SiO2—Nb2O5-based, B2O3—F-based, P2O5—F-based, P2O5—ZnO-based, SiO2—B2O3—La2O3-based, and SiO2—B2O3-based low melting glasses.

摘要翻译： 固体元件装置包括固体元件，用于从固体元件接收电力并向其提供电力的电力接收和供应部件，以及用于密封固体元件的无机密封材料。 无机密封材料包括选自SiO 2-Nb 2 O 5系，B 2 O 3 -F系，P 2 O 5 -F系，P 2 O 5·ZnO系，SiO2-B2O3-La2O3系，SiO2-B2O3系低 熔化眼镜。

公开(公告)号：US20050082561A1

公开(公告)日：2005-04-21

申请号：US10972534

申请日：2004-10-26

申请人： Yoshinobu Suehiro ,  Hideaki Kato ,  Kunihiro Hadame

发明人： Yoshinobu Suehiro ,  Hideaki Kato ,  Kunihiro Hadame

IPC分类号： F21S8/10 ,  F21V11/12 ,  F21V13/10 ,  H01L33/54 ,  H01L33/60 ,  H01L33/64 ,  H01L21/00 ,  H01L33/00

CPC分类号： F21V29/83 ,  F21S43/14 ,  F21V11/12 ,  F21V13/10 ,  F21V29/74 ,  F21Y2115/10 ,  H01L33/54 ,  H01L33/60 ,  H01L33/647 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/0401

摘要： A light emitting diode has a substrate having a heat radiation conductive member therein, and a light emitting element mounted on the substrate. At least a part of the light emitting element is directly brought into contact and electrically connected with the heat radiation conductive member.

摘要翻译： 发光二极管具有其中具有散热导电构件的基板和安装在基板上的发光元件。 发光元件的至少一部分直接与放热导电部件接触并电连接。

公开(公告)号：US07842526B2

公开(公告)日：2010-11-30

申请号：US11220903

申请日：2005-09-08

申请人： Kunihiro Hadame ,  Yoshinobu Suehiro

发明人： Kunihiro Hadame ,  Yoshinobu Suehiro

IPC分类号： H01L21/00

CPC分类号： H01L33/54 ,  H01L24/97 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A light emitting device having: a light emitting element; an electricity supply portion on which the light emitting element is mounted and which supplies electricity; and an inorganic sealing material for sealing the light emitting element. The inorganic sealing material has a tapered surface which becomes wider outward in a side surface direction with respect to a center axis of the light emitting element.

摘要翻译： 一种发光器件，具有：发光元件; 电源部分，其上安装有发光元件并且供电; 以及用于密封发光元件的无机密封材料。 无机密封材料具有相对于发光元件的中心轴线在侧面方向向外变宽的锥形表面。

公开(公告)号：US07824937B2

公开(公告)日：2010-11-02

申请号：US10548560

申请日：2004-03-10

申请人： Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

发明人： Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

IPC分类号： H01L21/56

CPC分类号： H01L33/56 ,  C03B23/20 ,  C03C8/24 ,  C03C27/06 ,  H01L24/17 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01057 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for manufacturing a solid element device, which comprises providing a glass-containing Al2O3 substrate (3) having a GaN based LED element (2) placed thereon, setting a P2O5—ZnO based low melting point glass in parallel with the substrate, and carrying out a press working at a temperature of 415° C. or higher under a pressure of 60 kgf in a nitrogen atmosphere. Under these conditions, the low melting point glass has a viscosity of 109 poise, and is adhered via an oxide formed on the surface of the glass-containing Al2O3 substrate (3). A solid element device manufactured by the above method can be manufactured through a glass sealing working at a low temperature and also has a highly reliable sealing structure.

摘要翻译： 一种固体元件器件的制造方法，其特征在于，提供具有GaN基LED元件（2）的含有玻璃的Al 2 O 3衬底（3），设置与所述衬底平行的P2O5-ZnO系低熔点玻璃，以及 在氮气气氛下，在60kgf的压力下进行在415℃以上的温度下的加压。 在这些条件下，低熔点玻璃的粘度为109泊，并且通过形成在含玻璃Al 2 O 3衬底（3）的表面上的氧化物粘合。 通过上述方法制造的固体元件装置可以通过在低温下工作的玻璃密封来制造，并且还具有高度可靠的密封结构。

公开(公告)号：US20060261364A1

公开(公告)日：2006-11-23

申请号：US10548560

申请日：2004-03-10

申请人： Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

发明人： Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

IPC分类号： H01L33/00

CPC分类号： H01L33/56 ,  C03B23/20 ,  C03C8/24 ,  C03C27/06 ,  H01L24/17 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01057 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for manufacturing a solid element device, which comprises providing a glass-containing Al2O3 substrate (3) having a GaN based LED element (2) placed thereon, setting a P2O5—ZnO based low melting point glass in parallel with the substrate, and carrying out a press working at a temperature of 415° C. or higher under a pressure of 60 kgf in a nitrogen atmosphere. Under these conditions, the low melting point glass has a viscosity of 109 poise, and is adhered via an oxide formed on the surface of the glass-containing Al2O3 substrate (3). A solid element device manufactured by the above method can be manufactured through a glass sealing working at a low temperature and also has a highly reliable sealing structure.

摘要翻译： 一种固体元件器件的制造方法，其特征在于，提供具有GaN基LED元件（2）的含有玻璃的Al 2 O 3 N 3衬底（3） 设置与基板平行的P 2 5 5 5 5 5 在氮气气氛中压力为60kgf。 在这些条件下，低熔点玻璃的粘度为10泊，并通过形成在含玻璃Al 2 O 2的表面上的氧化物粘合， （3）。 通过上述方法制造的固体元件装置可以通过在低温下工作的玻璃密封来制造，并且还具有高度可靠的密封结构。

公开(公告)号：US20060054913A1

公开(公告)日：2006-03-16

申请号：US11220903

申请日：2005-09-08

申请人： Kunihiro Hadame ,  Yoshinobu Suehiro

发明人： Kunihiro Hadame ,  Yoshinobu Suehiro

IPC分类号： H01L33/00

CPC分类号： H01L33/54 ,  H01L24/97 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A light emitting device having: a light emitting element; an electricity supply portion on which the light emitting element is mounted and which supplies electricity; and an inorganic sealing material for sealing the light emitting element. The inorganic sealing material has a tapered surface which becomes wider outward in a side surface direction with respect to a center axis of the light emitting element.

摘要翻译： 一种发光器件，具有：发光元件; 电源部分，其上安装有发光元件并且供电; 以及用于密封发光元件的无机密封材料。 无机密封材料具有相对于发光元件的中心轴线在侧面方向向外变宽的锥形表面。