公开(公告)号：US09277682B2

公开(公告)日：2016-03-01

申请号：US13807277

申请日：2011-06-29

申请人： Yujiro Kaneko ,  Tokihito Suwa

发明人： Yujiro Kaneko ,  Tokihito Suwa

IPC分类号： H05K7/20 ,  H01L23/36 ,  H01L21/50 ,  H01L23/433 ,  H01L23/473 ,  H01L25/07 ,  H01L25/18 ,  H01L23/00

CPC分类号： H05K7/209 ,  H01L21/50 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/33 ,  H01L24/34 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/33 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A power module includes a power unit equipped with plural power semiconductor devices, heat sinks, and a housing case. The power unit includes the power semiconductor devices, lead frames, and a sealing resin. The lead frames are coupled to the surfaces of each of the power semiconductor devices, and parts of the external surfaces of the upper and lower lead frames are bared out of the sealing resin. The housing case includes a housing base and a housing cover. The housing base, heat sink, power unit, heat sink, and housing cover are layered in that order. Assuming that S1 denotes the outline size of the housing base, S2 denotes the outline size of the housing cover, S3 denotes the size of the lead frame bared part of the power unit, the relationship of S1>S2>S3 is established. The housing cover is pressed and fixed to a receiving part of the housing base.

摘要翻译： 功率模块包括配备有多个功率半导体器件，散热器和壳体的功率单元。 功率单元包括功率半导体器件，引线框架和密封树脂。 引线框架耦合到每个功率半导体器件的表面，并且上引线框架和下引线框架的外表面的部分从密封树脂中露出。 壳体包括壳体基座和壳体盖。 壳体基座，散热器，动力单元，散热器和外壳盖按顺序分层。 假设S1表示壳体基座的外形尺寸，S2表示外壳盖的轮廓尺寸，S3表示功率单元的引线框架裸露部分的尺寸，建立S1> S2> S3的关系。 壳体盖被按压并固定到壳体基座的接收部分。

公开(公告)号：US09179581B2

公开(公告)日：2015-11-03

申请号：US13163950

申请日：2011-06-20

申请人： Tokihito Suwa ,  Yujiro Kaneko ,  Yusuke Takagi ,  Shinichi Fujino ,  Takahiro Shimura

发明人： Tokihito Suwa ,  Yujiro Kaneko ,  Yusuke Takagi ,  Shinichi Fujino ,  Takahiro Shimura

IPC分类号： H05K7/00 ,  H05K7/20 ,  H01L23/473 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC分类号： H05K5/0247 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/473 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/34 ,  H01L24/36 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/291 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/40137 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/351 ,  H02M7/537 ,  H05K7/1432 ,  H05K7/20845 ,  H05K7/2089 ,  H05K7/20927 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099 ,  H01L2224/37599 ,  H01L2224/84

摘要： A power semiconductor device includes a plurality of power semiconductor elements constituting upper and lower arms of an inverter circuit, a first sealing member sealing the plurality of power semiconductor elements, a positive electrode-side terminal and a negative electrode-side terminal each connected with any of the plurality of power semiconductor elements and protruding from the first sealing member, a second sealing member sealing at least a part of the positive electrode-side terminal and at least a part of the negative electrode-side terminal, and a case in which the power semiconductor elements sealed with the first sealing member are housed.

摘要翻译： 功率半导体装置包括构成逆变器电路的上臂和下臂的多个功率半导体元件，密封多个功率半导体元件的第一密封构件，正极侧端子和负极侧端子 并且从所述第一密封部件突出的第二密封部件，密封所述正极侧端子和所述负极侧端子的至少一部分的至少一部分的第二密封部件，其中， 容纳用第一密封构件密封的功率半导体元件。

公开(公告)号：US09326425B2

公开(公告)日：2016-04-26

申请号：US13996640

申请日：2011-12-07

申请人： Tokihito Suwa ,  Yujiro Kaneko ,  Masashi Yura ,  Nobutake Tsuyuno ,  Toshiaki Ishii ,  Junpei Kusukawa

发明人： Tokihito Suwa ,  Yujiro Kaneko ,  Masashi Yura ,  Nobutake Tsuyuno ,  Toshiaki Ishii ,  Junpei Kusukawa

IPC分类号： H05K7/02 ,  H05K7/20 ,  H01L23/433 ,  H01L25/16 ,  H02M7/00 ,  H01L23/473 ,  H01L25/18 ,  H01L23/36 ,  H01L25/11 ,  H01L23/367

CPC分类号： H05K7/20509 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/473 ,  H01L25/072 ,  H01L25/115 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/32245 ,  H01L2224/40137 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H02M7/003 ,  H05K7/209 ,  H05K7/20927 ,  H01L2924/00

摘要： Provided is a power conversion device including an insulating member manufactured such that a thickness di (mm) of the insulating member made from a resin, provided between a heat dissipating surface of a conductor plate bonded to a power semiconductor device and a heat dissipating plate that dissipates the heat of the power semiconductor device satisfies a relation of di>(1.36×10-8×Vt2+3.4×10-5×Vt−0.015)×∈r, where a relative permittivity of the insulating member is ∈r and a surge voltage generated between the conductor plate and the heat dissipating plate accompanied by an ON/OFF switching operation of the power semiconductor device is Vt (V). The conductor plate of the power semiconductor device, the insulating member, and the heat dissipating plate are bonded by thermocompression bonding.

摘要翻译： 本发明提供一种电力转换装置，其特征在于，包括绝缘部件，其制造成使得由与树脂形成的绝缘部件的厚度di（mm）设置在与功率半导体装置接合的导体板的散热面与散热板之间， 散发功率半导体器件的热量满足di>（1.36×10-8×Vt2 + 3.4×10-5×Vt-0.015）×∈r的关系，其中绝缘构件的相对介电常数为∈r，a 伴随功率半导体器件的ON / OFF开关操作的导体板和散热板之间产生的浪涌电压为Vt（V）。 功率半导体器件的导体板，绝缘构件和散热板通过热压接而接合。

公开(公告)号：US20130265724A1

公开(公告)日：2013-10-10

申请号：US13807277

申请日：2011-06-29

申请人： Yujiro Kaneko ,  Tokihito Suwa

发明人： Yujiro Kaneko ,  Tokihito Suwa

IPC分类号： H05K7/20

CPC分类号： H05K7/209 ,  H01L21/50 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/33 ,  H01L24/34 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/33 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A power module includes a power unit equipped with plural power semiconductor devices, heat sinks, and a housing case. The power unit includes the power semiconductor devices, lead frames, and a sealing resin. The lead frames are coupled to the surfaces of each of the power semiconductor devices, and parts of the external surfaces of the upper and lower lead frames are bared out of the sealing resin. The housing case includes a housing base and a housing cover. The housing base, heat sink, power unit, heat sink, and housing cover are layered in that order. Assuming that S1 denotes the outline size of the housing base, S2 denotes the outline size of the housing cover, S3 denotes the size of the lead frame bared part of the power unit, the relationship of S1>S2>S3 is established. The housing cover is pressed and fixed to a receiving part of the housing base.

摘要翻译： 功率模块包括配备有多个功率半导体器件，散热器和壳体的功率单元。 功率单元包括功率半导体器件，引线框架和密封树脂。 引线框架耦合到每个功率半导体器件的表面，并且上引线框架和下引线框架的外表面的部分从密封树脂中露出。 壳体包括壳体基座和壳体盖。 壳体基座，散热器，动力单元，散热器和外壳盖按顺序分层。 假设S1表示壳体基座的外形尺寸，S2表示外壳盖的轮廓尺寸，S3表示功率单元的引线框架裸露部分的尺寸，建立S1> S2> S3的关系。 壳体盖被按压并固定到壳体基座的接收部分。

公开(公告)号：US20110310585A1

公开(公告)日：2011-12-22

申请号：US13163950

申请日：2011-06-20

申请人： Tokihito SUWA ,  Yujiro Kaneko ,  Yusuke Takagi ,  Shinichi Fujino ,  Takahiro Shimura

发明人： Tokihito SUWA ,  Yujiro Kaneko ,  Yusuke Takagi ,  Shinichi Fujino ,  Takahiro Shimura

IPC分类号： H05K7/20 ,  H01L23/48

CPC分类号： H05K5/0247 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/473 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/34 ,  H01L24/36 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/291 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/40137 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/351 ,  H02M7/537 ,  H05K7/1432 ,  H05K7/20845 ,  H05K7/2089 ,  H05K7/20927 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099 ,  H01L2224/37599 ,  H01L2224/84

摘要： A power semiconductor device includes a plurality of power semiconductor elements constituting upper and lower arms of an inverter circuit, a first sealing member sealing the plurality of power semiconductor elements, a positive electrode-side terminal and a negative electrode-side terminal each connected with any of the plurality of power semiconductor elements and protruding from the first sealing member, a second sealing member sealing at least a part of the positive electrode-side terminal and at least a part of the negative electrode-side terminal, and a case in which the power semiconductor elements sealed with the first sealing member are housed.

摘要翻译： 功率半导体装置包括构成逆变器电路的上臂和下臂的多个功率半导体元件，密封多个功率半导体元件的第一密封构件，正极侧端子和负极侧端子 并且从所述第一密封部件突出的第二密封部件，密封所述正极侧端子和所述负极侧端子的至少一部分的至少一部分的第二密封部件，其中， 容纳用第一密封构件密封的功率半导体元件。

公开(公告)号：US09241429B2

公开(公告)日：2016-01-19

申请号：US14124172

申请日：2012-05-22

申请人： Yujiro Kaneko ,  Tokihito Suwa ,  Shinji Hiramitsu ,  Takahiro Shimura

发明人： Yujiro Kaneko ,  Tokihito Suwa ,  Shinji Hiramitsu ,  Takahiro Shimura

IPC分类号： H05K7/20 ,  H02M7/00 ,  B60L11/14 ,  H01L23/34

CPC分类号： H05K7/20927 ,  B60L11/14 ,  B60L2200/26 ,  B60L2210/40 ,  H01L23/36 ,  H01L23/3736 ,  H01L23/473 ,  H01L24/36 ,  H01L24/40 ,  H01L2224/33 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H02M7/003 ,  H02P27/06 ,  H02P29/60 ,  H05K7/209 ,  H05K7/20909 ,  Y02T10/70 ,  Y02T10/7077 ,  Y02T10/7241 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A power module includes a plurality of semiconductor devices constituting upper/lower arms of an inverter circuit, a plurality of conductive plates arranged to face electrode surfaces of the semiconductor devices and a module case configured to accommodate the semiconductor devices and conductive plates, wherein the module case includes a heat-radiation member made of plate-like metal and facing a surface of the conductive plate and a metallic frame body having an opening that is closed by the heat-radiation member, and wherein a heat-radiation fin unit having a plurality of heat-radiation fins vertically arranged thereon is provided at a center of the heat-radiation member, and a joint portion with the frame body is provided at an peripheral edge of the heat-radiation member, and the heat radiation member has a heat conductivity higher than that of the frame body, and the frame body has a higher rigidity than that of the heat-radiation member.

摘要翻译： 功率模块包括构成逆变器电路的上臂/下臂的多个半导体器件，布置成面对半导体器件的电极表面的多个导电板和被配置为容纳半导体器件和导电板的模块壳体，其中模块 壳体包括由板状金属制成并面对导电板的表面的散热构件和具有由散热构件封闭的开口的金属框体，并且其中具有多个散热构件的散热片单元 垂直设置在其上的散热片设置在散热构件的中心，并且与散热构件的周边边缘处设置有与框架体的接合部分，并且散热构件具有导热性 高于框体，并且框体具有比散热构件更高的刚性。

公开(公告)号：US20140098588A1

公开(公告)日：2014-04-10

申请号：US14124172

申请日：2012-05-22

申请人： Yujiro Kaneko ,  Tokihito Suwa ,  Shinji Hiramitsu ,  Takahiro Shimura

发明人： Yujiro Kaneko ,  Tokihito Suwa ,  Shinji Hiramitsu ,  Takahiro Shimura

IPC分类号： H05K7/20

CPC分类号： H05K7/20927 ,  B60L11/14 ,  B60L2200/26 ,  B60L2210/40 ,  H01L23/36 ,  H01L23/3736 ,  H01L23/473 ,  H01L24/36 ,  H01L24/40 ,  H01L2224/33 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H02M7/003 ,  H02P27/06 ,  H02P29/60 ,  H05K7/209 ,  H05K7/20909 ,  Y02T10/70 ,  Y02T10/7077 ,  Y02T10/7241 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A power module includes a plurality of semiconductor devices constituting upper/lower arms of an inverter circuit, a plurality of conductive plates arranged to face electrode surfaces of the semiconductor devices and a module case configured to accommodate the semiconductor devices and conductive plates, wherein the module case includes a heat-radiation member made of plate-like metal and facing a surface of the conductive plate and a metallic frame body having an opening that is closed by the heat-radiation member, and wherein a heat-radiation fin unit having a plurality of heat-radiation fins vertically arranged thereon is provided at a center of the heat-radiation member, and a joint portion with the frame body is provided at an peripheral edge of the heat-radiation member, and the heat radiation member has a heat conductivity higher than that of the frame body, and the frame body has a higher rigidity than that of the heat-radiation member.

摘要翻译： 功率模块包括构成逆变器电路的上臂/下臂的多个半导体器件，布置成面对半导体器件的电极表面的多个导电板和被配置为容纳半导体器件和导电板的模块壳体，其中模块 壳体包括由板状金属制成并面对导电板的表面的散热构件和具有由散热构件封闭的开口的金属框体，并且其中具有多个散热构件的散热片单元 垂直设置在其上的散热片设置在散热构件的中心，并且与散热构件的周边边缘处设置有与框架体的接合部分，并且散热构件具有导热性 高于框体，并且框体具有比散热构件更高的刚性。

公开(公告)号：US20130279230A1

公开(公告)日：2013-10-24

申请号：US13996640

申请日：2011-12-07

申请人： Tokihito Suwa ,  Yujiro Kaneko ,  Masashi Yura ,  Nobutake Tsuyuno ,  Toshiaki Ishii ,  Junpei Kusukawa

发明人： Tokihito Suwa ,  Yujiro Kaneko ,  Masashi Yura ,  Nobutake Tsuyuno ,  Toshiaki Ishii ,  Junpei Kusukawa

IPC分类号： H02M7/00 ,  H05K7/20

CPC分类号： H05K7/20509 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/473 ,  H01L25/072 ,  H01L25/115 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/32245 ,  H01L2224/40137 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H02M7/003 ,  H05K7/209 ,  H05K7/20927 ,  H01L2924/00

摘要： Provided is a power conversion device including an insulating member manufactured such that a thickness di (mm) of the insulating member made from a resin, provided between a heat dissipating surface of a conductor plate bonded to a power semiconductor device and a heat dissipating plate that dissipates the heat of the power semiconductor device satisfies a relation of di>(1.36×10-8×Vt2+3.4×10-5×Vt−0.015)×εr, where a relative permittivity of the insulating member is Er and a surge voltage generated between the conductor plate and the heat dissipating plate accompanied by an ON/OFF switching operation of the power semiconductor device is Vt (V). The conductor plate of the power semiconductor device, the insulating member, and the heat dissipating plate are bonded by thermocompression bonding.

摘要翻译： 本发明提供一种电力转换装置，其特征在于，包括绝缘部件，其制造成使得由与树脂形成的绝缘部件的厚度di（mm）设置在与功率半导体装置接合的导体板的散热面与散热板之间， 消耗功率半导体器件的热量满足di>（1.36×10-8×Vt2 + 3.4×10-5×Vt-0.015）×ε的关系，其中绝缘部件的相对介电常数为Er，浪涌电压 在导体板和散热板之间产生的功率半导体器件的ON / OFF开关操作是Vt（V）。 功率半导体器件的导体板，绝缘构件和散热板通过热压接而接合。

公开(公告)号：US06990053B2

公开(公告)日：2006-01-24

申请号：US10822786

申请日：2004-04-13

申请人： Kyohji Hattori ,  Kenichi Aihara ,  Katsuyuki Yamada ,  Fumiya Ohmi ,  Eiji Noda ,  Yujiro Kaneko ,  Yuki Nakamura ,  Hiroko Iwasaki

发明人： Kyohji Hattori ,  Kenichi Aihara ,  Katsuyuki Yamada ,  Fumiya Ohmi ,  Eiji Noda ,  Yujiro Kaneko ,  Yuki Nakamura ,  Hiroko Iwasaki

IPC分类号： G11B7/00

CPC分类号： G11B7/26 ,  G11B7/268

摘要： A method and apparatus for initializing optical recording media is provided that detects the intensity of a reflective light off of an optical recording media and analyzes the initializing condition based on the detected intensity during an initializing process. The light is radiated on a rotating phase-change optical recording medium. The light may be moved in a radial direction of the optical recording medium. The detected intensity of the reflected light may be used to identify crystallized portions and amorphous portions of the optical media. The initialization process can be adaptively controlled to ensure proper initialization. If desired, re-initialization can be limited to those areas detected to be outside of the predetermined parameters.

公开(公告)号：US06373802B1

公开(公告)日：2002-04-16

申请号：US09199472

申请日：1998-11-25

申请人： Kyohji Hattori ,  Kenichi Aihara ,  Katsuyuki Yamada ,  Fumiya Ohmi ,  Eiji Noda ,  Yujiro Kaneko ,  Yuki Nakamura ,  Hiroko Iwasaki

发明人： Kyohji Hattori ,  Kenichi Aihara ,  Katsuyuki Yamada ,  Fumiya Ohmi ,  Eiji Noda ,  Yujiro Kaneko ,  Yuki Nakamura ,  Hiroko Iwasaki

IPC分类号： G11B700

CPC分类号： G11B7/26 ,  G11B7/268

摘要： A method and apparatus for initializing optical recording media is provided that detects the intensity of a reflective light off of an optical recording media and analyzes the initializing condition based on the detected intensity during an initializing process. The light is radiated on a rotating phase-change optical recording medium. The light may be moved in a radial direction of the optical recording medium. The detected intensity of the reflected light may be used to identify crystallized portions and amorphous portions of the optical media. The initialization process can be adaptively controlled to ensure proper initialization. If desired, re-initialization can be limited to those areas detected to be outside of the predetermined parameters.

摘要翻译： 提供一种用于初始化光学记录介质的方法和装置，其检测来自光学记录介质的反射光的强度，并且在初始化过程期间基于检测到的强度来分析初始化条件。 光照射在旋转的相变光学记录介质上。 光可以在光记录介质的径向方向上移动。 检测到的反射光的强度可以用于识别光学介质的结晶部分和非晶部分。 可以自适应地控制初始化过程，以确保正确的初始化。 如果需要，可以将重新初始化限制在检测到超出预定参数的那些区域。