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1.发明申请PRESSURE-SENSITIVE ADHESIVE SHEET FOR LASER PROCESSING AND LASER PROCESSING METHOD 审中-公开用于激光加工和激光加工方法的压敏粘合片公开(公告)号：US20100032087A1
公开(公告)日：2010-02-11
申请号：US12482136
申请日：2009-06-10
CPC分类号： B23K26/18 , B23K26/40 , B23K2101/40 , B23K2103/50 , C09J7/29 , C09J2423/006 , C09J2433/00 , H01L21/67132 , H01L21/78 , Y10T428/263 , Y10T428/264 , Y10T428/265 , Y10T428/28 , Y10T428/2848
摘要： In performing the laser processing of a workpiece with laser light, there are provided a pressure-sensitive adhesive sheet for laser processing and a laser processing method that can perform the laser processing of a workpiece easily with good production efficiency by preventing the fusion of a substrate and an adsorption stage. According to the invention, an pressure-sensitive adhesive sheet for laser processing that is used for laser processing of a workpiece with laser light having a wavelength in an ultraviolet region or with laser light that enables light absorption in an ultraviolet region that has passed a multiphoton absorption process, comprising a substrate and an pressure-sensitive adhesive layer disposed on one surface of the substrate, wherein a melting point of the substrate at another surface is 80° C. or higher, and an etching rate (etching speed/energy fluence) in a case of radiating the laser light onto the other surface is 0.1 [(μm/pulse)/(J/cm2)] or lower.
摘要翻译： 在用激光进行工件的激光加工时，提供了一种用于激光加工的压敏粘合片和激光加工方法，其可以通过防止基板的熔化而容易地以良好的生产效率对工件进行激光加工 和吸附阶段。 根据本发明，一种用于激光加工的压敏粘合片，其用于具有在紫外区域中具有波长的激光的工件的激光加工或者通过能够通过多光子的紫外线区域中的光吸收的激光 吸收处理，其包括基板和设置在基板的一个表面上的压敏粘合剂层，其中另一表面的基板的熔点为80℃以上，蚀刻速度（蚀刻速度/能量密度） 在另一面上照射激光的情况为0.1 [（mum / pulse）/（J / cm 2）]以下。
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2.发明申请PRESSURE-SENSITIVE ADHESIVE SHEET FOR RETAINING ELEMENTS AND METHOD OF PRODUCING ELEMENTS 审中-公开用于保持元件的压敏粘合片及其制造方法公开(公告)号：US20110076490A1
公开(公告)日：2011-03-31
申请号：US12895435
申请日：2010-09-30
CPC分类号： H01L21/6836 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2103/50 , C09J7/385 , C09J2203/326 , C09J2205/31 , H01L2221/68336 , Y10T156/10 , Y10T156/1052 , Y10T428/28 , Y10T428/2809
摘要： A pressure-sensitive adhesive sheet for retaining elements according to an embodiment of the present invention includes abase material layer and a pressure-sensitive adhesive layer provided on the base material layer and capable of being cured by an external stimulus. A crack-generating elongation represented by the following equation in a case where the pressure-sensitive adhesive sheet is elongated in a state where the pressure-sensitive adhesive layer is cured is larger than 115%. Crack-generating elongation (%)=[(a length of the pressure-sensitive adhesive sheet when a crack is generated in a surface of the pressure-sensitive adhesive layer)−(an original length of the pressure-sensitive adhesive sheet)]/(the original length of the pressure-sensitive adhesive sheet)×100.
摘要翻译： 根据本发明实施例的用于保持元件的压敏粘合片包括设置在基材层上并能够通过外部刺激固化的耐磨材料层和压敏粘合剂层。 在压敏粘合剂层固化的状态下，压敏粘合片细长的情况下，由下式表示的裂纹产生伸长率大于115％。 产生裂纹的伸长率（％）= [（粘合剂层的表面产生裂纹时的粘合片的长度） - （粘合片的原始长度）] / （粘合片的原始长度）×100。
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公开(公告)号：US20120056338A1
公开(公告)日：2012-03-08
申请号：US13223629
申请日：2011-09-01
IPC分类号： H01L23/29
CPC分类号： H01L21/67132 , C08G18/4854 , C08G18/672 , C08G18/757 , C08G2170/40 , C09J7/10 , C09J175/16 , C09J2203/326 , C09J2475/00 , C08G18/48
摘要： The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet has one face having tackiness, does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.
摘要翻译： 本发明提供一种用于保护半导体晶片的压敏粘合片，其在半导体晶片被研磨时不引起半导体晶片的弯曲（翘曲），对图案的追随性优异，在 研磨操作，抑制晶片中的裂纹和晶片边缘的碎裂，并且不会在晶片的表面上留下粘合剂残留物。 保护片具有一个具有粘性的面，在基材和粘合剂之间不存在界面，并且由一层制成，并且该粘合片在两个表面上具有不同的粘着强度。
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4.发明申请SUBSTRATE-LESS PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROTECTION OF SEMICONDUCTOR WAFER, METHOD FOR GRINDING BACK SIDE OF SEMICONDUCTOR WAFER USING PRESSURE-SENSITIVE ADHESIVE SHEET, AND METHOD FOR PRODUCING PRESSURE-SENSITIVE ADHESIVE SHEET 有权用于保护半导体滤波器的基片无感压敏粘合片，使用压敏粘合片研磨半导体波片的背面的方法，以及用于生产压敏粘合片的方法公开(公告)号：US20100230036A1
公开(公告)日：2010-09-16
申请号：US12720704
申请日：2010-03-10
CPC分类号： H01L21/304 , C09J133/066 , C09J2201/606 , C09J2203/326 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2924/3025
摘要： The present invention provides a substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, which is to be stuck to a front surface of a semiconductor wafer in grinding a back surface of the semiconductor wafer, the pressure-sensitive adhesive sheet consisting of a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is formed of a UV-curable pressure-sensitive adhesive containing a polymer composed mainly of an acrylic monomer polymerizable compound, the pressure-sensitive adhesive force of a surface of the pressure-sensitive adhesive layer to be stuck to the front surface of the semiconductor wafer is larger than the pressure-sensitive adhesive force of the opposite surface thereof, and the pressure-sensitive adhesive layer has an initial elastic modulus of from 0.01 MPa to 500 MPa.
摘要翻译： 本发明提供一种用于保护半导体晶片的无基板用粘合片，其将在半导体晶片的背面磨削时粘贴到半导体晶片的前表面，该压敏粘合片由 压敏粘合剂层，其中压敏粘合剂层由含有主要由丙烯酸单体可聚合化合物组成的聚合物的UV可固化压敏粘合剂形成，压力表面的压敏粘合力 要粘附到半导体晶片的前表面的敏感粘合剂层大于其相对表面的压敏粘合力，并且压敏粘合剂层的初始弹性模量为0.01MPa至500MPa。
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5.发明申请PRESSURE-SENSITIVE ADHESIVE SHEET FOR LASER PROCESSING AND METHOD FOR LASER PROCESSING 审中-公开用于激光加工的压敏粘合片和激光加工方法公开(公告)号：US20100080989A1
公开(公告)日：2010-04-01
申请号：US12571618
申请日：2009-10-01
IPC分类号： B32B15/082 , B29C65/16
CPC分类号： H01L21/6836 , B23K26/18 , C03B33/0222 , C03B33/091 , C08K5/0025 , C08K5/07 , C08K5/17 , C08K5/51 , C08K5/5397 , C09J7/385 , C09J2203/326 , C09J2205/102 , H01L21/78 , H01L2221/68327 , Y02P40/57 , Y10T428/2809
摘要： The present invention provides a pressure-sensitive adhesive sheet for laser processing, which includes a base and a pressure-sensitive adhesive layer provided on one surface of the base, the pressure-sensitive adhesive layer having an absorption coefficient at a wavelength of 355 nm of from 50 cm−1 to 900 cm−1, the pressure-sensitive adhesive layer containing a light-absorbing agent in which an absorbance of the light-absorbing agent in a 0.01% by weight acetonitrile solution at a wavelength of 355 nm is from 0.01 to 1.20, and in which the pressure-sensitive adhesive sheet is to be used at the time when a workpiece is laser-processed by a laser light having a wavelength of an ultraviolet region or a laser light enabling light absorption via multiphoton absorption process.
摘要翻译： 本发明提供一种用于激光加工的压敏粘合片，其包括基底和设置在基底的一个表面上的压敏粘合剂层，压敏粘合剂层的波长为355nm处的吸收系数为 从50cm -1至900cm -1，含有光吸收剂的粘合剂层，其中吸光剂在355nm波长的0.01重量％乙腈溶液中的吸光度为0.01 至1.20，并且在通过具有紫外线区域的波长的激光或能够通过多光子吸收过程进行光吸收的激光来对工件进行激光加工时使用压敏粘合片。
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公开(公告)号：US20120070658A1
公开(公告)日：2012-03-22
申请号：US13232716
申请日：2011-09-14
申请人： Shinsuke IKISHIMA , Takashi HABU , Fumiteru ASAI , Kooki OOYAMA , Tadao TORII , Katsutoshi KAMEI , Yuuki KATOU , Tomokazu TAKAHASHI
发明人： Shinsuke IKISHIMA , Takashi HABU , Fumiteru ASAI , Kooki OOYAMA , Tadao TORII , Katsutoshi KAMEI , Yuuki KATOU , Tomokazu TAKAHASHI
CPC分类号： H01L21/67132 , B32B27/306 , B32B27/327 , B32B2250/24 , B32B2250/246 , B32B2405/00 , B32B2457/14 , C09J7/29 , C09J2201/162 , C09J2201/622 , C09J2203/326 , C09J2423/106 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68386 , Y10T428/2848
摘要： A pressure-sensitive adhesive tape according to an embodiment of the present invention includes, a heat-resistant layer; a base layer; and a pressure-sensitive adhesive layer in this order, wherein: the pressure-sensitive adhesive tape has an elastic modulus, i.e., Young's modulus at 25° C. of 150 MPa or less; and the heat-resistant layer contains a polypropylene-based resin polymerized by using a metallocene catalyst, the polypropylene-based resin having a melting point of 110° C. to 200° C. and a molecular weight distribution “Mw/Mn” of 3 or less.
摘要翻译： 根据本发明实施例的压敏粘合带包括耐热层; 基层; 和粘合剂层，其中：压敏粘合带具有弹性模量，即25℃下的杨氏模量为150MPa以下; 耐热层含有通过使用金属茂催化剂聚合的聚丙烯系树脂，该聚丙烯系树脂的熔点为110℃〜200℃，分子量分布“Mw / Mn”为3 或更少。
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公开(公告)号：US20120065350A1
公开(公告)日：2012-03-15
申请号：US13223523
申请日：2011-09-01
IPC分类号： C08F283/00
CPC分类号： C08F299/065 , C08G18/672 , C08G18/753 , C08G2170/40 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , C08G18/48
摘要： The present invention provides a resin material which can be used for a pressure-sensitive adhesive sheet for protecting a semiconductor wafer and the like, does not cause curve (warpage) in the semiconductor wafer when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer in a peeling operation. The resin material shall be a viscoelastic body containing a copolymer of a urethane polymer and an acrylic polymer, which is formed through a monomer having a functional group that can form a urethane bond with a urethane polymer and having an activated carbon double bond that can copolymerize with a (meth)acryloyl group, in one molecule.
摘要翻译： 本发明提供一种可用于保护半导体晶片等的压敏粘合片的树脂材料，当半导体晶片被研磨时，不会导致半导体晶片中的弯曲（翘曲），因此具有优异的随机性 图案在研磨操作中具有足够的应力分散性，抑制晶片中的裂纹和晶片边缘的碎裂，并且在剥离操作中不会在晶片的表面上留下粘合剂残留物。 树脂材料应为包含聚氨酯聚合物和丙烯酸类聚合物的共聚物的粘弹性体，该共聚物通过具有可与氨基甲酸酯聚合物形成氨基甲酸酯键并具有可共聚的活性炭双键的官能团的单体形成 与（甲基）丙烯酰基在一个分子中。
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公开(公告)号：US20120070661A1
公开(公告)日：2012-03-22
申请号：US13232476
申请日：2011-09-14
申请人： Shinsuke IKISHIMA , Takashi HABU , Fumiteru ASAI , Kooki OOYAMA , Tadao TORII , Katsutoshi KAMEI , Yuuki KATOU , Tomokazu TAKAHASHI
发明人： Shinsuke IKISHIMA , Takashi HABU , Fumiteru ASAI , Kooki OOYAMA , Tadao TORII , Katsutoshi KAMEI , Yuuki KATOU , Tomokazu TAKAHASHI
IPC分类号： C09J7/02 , B29C47/06 , C09J123/14 , B32B27/08
CPC分类号： C09J123/142 , C08L23/0853 , C09J7/22 , C09J7/24 , C09J7/38 , C09J2423/046 , C09J2423/10 , C09J2431/006 , H01L21/6836 , Y10T428/2878
摘要： A pressure-sensitive adhesive tape according to an embodiment of the present invention includes, a pressure-sensitive adhesive layer; and a base layer, wherein: the pressure-sensitive adhesive layer contains an amorphous propylene- (1-butene) copolymer polymerized by using a metallocene catalyst, the amorphous propylene-(1-butene) copolymer having a weight-average molecular weight (Mw) of 200,000 or more and a molecular weight distribution (Mw/Mn) of 2 or less; and the base layer contains an ethylene-vinyl acetate copolymer.
摘要翻译： 根据本发明实施例的压敏粘合带包括：压敏粘合剂层; 和基础层，其中：所述压敏粘合剂层含有通过使用茂金属催化剂聚合的无定形丙烯 - （1-丁烯）共聚物，所述无定形丙烯 - （1-丁烯）共聚物具有重均分子量（Mw ）为20万以上，分子量分布（Mw / Mn）为2以下; 并且基层含有乙烯 - 乙酸乙烯酯共聚物。
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公开(公告)号：US20120058319A1
公开(公告)日：2012-03-08
申请号：US13223966
申请日：2011-09-01
申请人： Akiyoshi YAMAMOTO , Takashi HABU , Fumiteru ASAI , Tomokazu TAKAHASHI , Eiichi IMOTO , Yuta SHIMAZAKI
发明人： Akiyoshi YAMAMOTO , Takashi HABU , Fumiteru ASAI , Tomokazu TAKAHASHI , Eiichi IMOTO , Yuta SHIMAZAKI
CPC分类号： H01L21/67132 , C09J7/10 , C09J2201/622 , C09J2203/326 , Y10T428/24942 , Y10T428/26 , Y10T428/28
摘要： The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.
摘要翻译： 本发明提供一种用于保护半导体晶片的压敏粘合片，其在半导体晶片被研磨时不引起半导体晶片的弯曲（翘曲），对图案的追随性优异，在 研磨操作，抑制晶片中的裂纹和晶片边缘的碎裂，并且不会在晶片的表面上留下粘合剂残留物。 保护片在基材和粘合剂之间不存在界面，并且由一层制成，并且该粘合片在两个表面上具有不同的粘着强度。
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公开(公告)号：US20110254176A1
公开(公告)日：2011-10-20
申请号：US13088737
申请日：2011-04-18
CPC分类号： H01L21/6836 , C09J7/20 , C09J2201/36 , C09J2201/606 , C09J2203/326 , C09J2205/31 , H01L21/561 , H01L23/3164 , H01L24/81 , H01L2221/68327 , H01L2224/16225 , H01L2224/81007 , H01L2224/81191 , H01L2924/14 , Y10T428/2809 , H01L2924/00
摘要： The present invention provides a dicing tape-integrated film for semiconductor back surface including: a dicing tape including a base material and a pressure-sensitive adhesive layer on the base material; and a film for flip chip type semiconductor back surface, which is provided on the pressure-sensitive adhesive layer, in which at least a part of the pressure-sensitive adhesive layer has been cured beforehand by irradiation with a radiation ray.
摘要翻译： 本发明提供了一种用于半导体背面的切割带一体化膜，包括：在基材上包括基材和压敏粘合剂层的切割带; 以及设置在压敏粘合剂层上的倒装芯片型半导体背表面的膜，其中至少一部分粘合剂层已经通过辐射线照射被预先固化。
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