Nitride semiconductor laser device
    1.
    发明授权
    Nitride semiconductor laser device 有权
    氮化物半导体激光器件

    公开(公告)号:US08031751B2

    公开(公告)日:2011-10-04

    申请号:US12232588

    申请日:2008-09-19

    IPC分类号: H01S3/04

    摘要: The present invention relates to a nitride semiconductor laser device having a structure in which two or more of nitride semiconductor laser elements, having at least a first electrode on a first main surface of a first conductive type conductive substrate, having at least a first conductive type nitride semiconductor layer, an active layer, a second conductive type nitride semiconductor layer, and a second electrode on a second main surface of the conductive substrate, and having a stripe-waveguide structure parallel to the first main surface, are arranged in a direction parallel to the first main surface and a direction perpendicular to the direction of light that is emitted from the stripe waveguide structure in the nitride semiconductor laser device, and the first sub-mount and the first electrode of the nitride semiconductor laser element are electrically and heat-conductively connected, and the second sub-mount and the second electrode of the nitride semiconductor laser element are electrically and heat-conductively connected.

    摘要翻译: 本发明涉及一种氮化物半导体激光器件,其结构是在第一导电型导电性基板的第一主面上具有至少第一电极的至少具有第一导电型的氮化物半导体激光元件 氮化物半导体层,有源层,第二导电型氮化物半导体层和在导电性基板的第二主面上的第二电极,并且具有平行于第一主表面的条状波导结构, 并且与氮化物半导体激光器件中的条状波导结构发射的光的方向垂直的方向,并且氮化物半导体激光元件的第一子安装座和第一电极是电气和热交换的, 导电连接,氮化物半导体激光元件a的第二子座和第二电极 电和导热连接。

    Nitride semiconductor laser device
    2.
    发明申请
    Nitride semiconductor laser device 有权
    氮化物半导体激光器件

    公开(公告)号:US20090080485A1

    公开(公告)日:2009-03-26

    申请号:US12232588

    申请日:2008-09-19

    IPC分类号: H01S5/00

    摘要: The present invention relates to a nitride semiconductor laser device having a structure in which two or more of nitride semiconductor laser elements, having at least a first electrode on a first main surface of a first conductive type conductive substrate, having at least a first conductive type nitride semiconductor layer, an active layer, a second conductive type nitride semiconductor layer, and a second electrode on a second main surface of the conductive substrate, and having a stripe-waveguide structure parallel to the first main surface, are arranged in a direction parallel to the first main surface and a direction perpendicular to the direction of light that is emitted from the stripe waveguide structure in the nitride semiconductor laser device, and the first sub-mount and the first electrode of the nitride semiconductor laser element are electrically and heat-conductively connected, and the second sub-mount and the second electrode of the nitride semiconductor laser element are electrically and heat-conductively connected.

    摘要翻译: 本发明涉及一种氮化物半导体激光器件,其结构是在第一导电型导电性基板的第一主面上具有至少第一电极的至少具有第一导电型的氮化物半导体激光元件 氮化物半导体层,有源层,第二导电型氮化物半导体层和在导电性基板的第二主面上的第二电极,并且具有平行于第一主表面的条状波导结构, 并且与氮化物半导体激光器件中的条状波导结构发射的光的方向垂直的方向,并且氮化物半导体激光元件的第一子安装座和第一电极是电气和热交换的, 导电连接,氮化物半导体激光元件a的第二子座和第二电极 电和导热连接。

    Nitride semiconductor laser device and method of producing the same
    3.
    发明授权
    Nitride semiconductor laser device and method of producing the same 有权
    氮化物半导体激光器件及其制造方法

    公开(公告)号:US08124431B2

    公开(公告)日:2012-02-28

    申请号:US12805750

    申请日:2010-08-18

    申请人: Yukio Yamasaki

    发明人: Yukio Yamasaki

    IPC分类号: H01L21/00

    摘要: A method of producing a nitride semiconductor laser device includes: forming a wafer including a nitride semiconductor layer of a first conductivity type, an active layer of a nitride semiconductor, a nitride semiconductor layer of a second conductivity type, and an electrode pad for the second conductivity type stacked in this order on a main surface of a conductive substrate and also including stripe-like waveguide structures parallel to the active layer; cutting the wafer to obtain a first type and a second type of laser device chips; and distinguishing between the first type and the second type of chips by automatic image recognition. The first type and the second type of chips are different from each other in position of the stripe-like waveguide structure with respect to a width direction of each chip and also in area ratio of the electrode pad to the main surface of the substrate.

    摘要翻译: 一种生产氮化物半导体激光器件的方法包括:形成包括第一导电类型的氮化物半导体层,氮化物半导体的有源层,第二导电类型的氮化物半导体层和第二导电类型的电极焊盘的晶片 导电类型依次堆叠在导电基板的主表面上,并且还包括平行于有源层的条状波导结构; 切割晶片以获得第一类型和第二类型的激光器件芯片; 并通过自动图像识别区分第一类型和第二类型的芯片。 第一类型和第二类型的芯片在条形波导结构相对于每个芯片的宽度方向的位置上彼此不同,并且电极焊盘与基板的主表面的面积比也不同。

    Semiconductor laser device
    4.
    发明申请
    Semiconductor laser device 有权
    半导体激光器件

    公开(公告)号:US20050226295A1

    公开(公告)日:2005-10-13

    申请号:US10510324

    申请日:2003-03-26

    IPC分类号: H01S5/20 H01S5/00

    CPC分类号: H01S5/20

    摘要: A semiconductor laser device having a waveguide constructed in a stack of layers including, on a substrate transparent and having a refractive index ns for laser light, a first clad layer of a refractive index nc1, a second clad layer of a refractive index nc2, a third clad layer of a refractive index nc3, a first conductivity type guide layer of a refractive index ng, an active quantum well layer, a second conductivity type guide layer, a second conductivity type clad layer, and a second conductivity type contact layer deposited in this order, wherein the waveguide has an effective refractive index ne, and a relationship of nc2

    摘要翻译: 一种半导体激光器件,其具有以堆叠层构成的波导,所述波导包括在透明且具有用于激光的折射率n 的衬底上的折射率n C 1的第一覆盖层 折射率为n3c2的第二覆盖层,折射率为n3c3的第三覆盖层,折射率为n3c3的第一导电型引导层, 指数n N,有源量子阱层,第二导电型导向层,第二导电型覆盖层和第二导电型接触层,其中波导具有有效的折射率 (N c1,n3,c3,...,n3)的关系,N > N(N N,N,N)满足。

    Nitride semiconductor laser device and method of producing the same
    6.
    发明申请
    Nitride semiconductor laser device and method of producing the same 有权
    氮化物半导体激光器件及其制造方法

    公开(公告)号:US20070217462A1

    公开(公告)日:2007-09-20

    申请号:US11715443

    申请日:2007-03-08

    申请人: Yukio Yamasaki

    发明人: Yukio Yamasaki

    IPC分类号: H01L21/00 H01S5/00

    摘要: A method of producing a nitride semiconductor laser device includes: forming a wafer including a nitride semiconductor layer of a first conductivity type, an active layer of a nitride semiconductor, a nitride semiconductor layer of a second conductivity type, and an electrode pad for the second conductivity type stacked in this order on a main surface of a conductive substrate and also including stripe-like waveguide structures parallel to the active layer; cutting the wafer to obtain a first type and a second type of laser device chips; and distinguishing between the first type and the second type of chips by automatic image recognition. The first type and the second type of chips are different from each other in position of the stripe-like waveguide structure with respect to a width direction of each chip and also in area ratio of the electrode pad to the main surface of the substrate.

    摘要翻译: 一种生产氮化物半导体激光器件的方法包括:形成包括第一导电类型的氮化物半导体层,氮化物半导体的有源层,第二导电类型的氮化物半导体层和第二导电类型的电极焊盘的晶片 导电类型依次堆叠在导电基板的主表面上,并且还包括平行于有源层的条状波导结构; 切割晶片以获得第一类型和第二类型的激光器件芯片; 并通过自动图像识别区分第一类型和第二类型的芯片。 第一类型和第二类型的芯片在条形波导结构相对于每个芯片的宽度方向的位置上彼此不同,并且电极焊盘与基板的主表面的面积比也不同。

    Semiconductor laser element and optical data recording device
    7.
    发明授权
    Semiconductor laser element and optical data recording device 有权
    半导体激光元件和光学数据记录装置

    公开(公告)号:US07142575B2

    公开(公告)日:2006-11-28

    申请号:US10769244

    申请日:2004-01-30

    IPC分类号: H01S5/00

    摘要: A semiconductor laser element has the following structure. In the clad layer, a difference in a light radiation loss between the basic horizontal-lateral mode and the 1st-order horizontal-lateral mode is 10 cm−1 or more. The refractive index of the clad layer is below an effective index against light in the basic horizontal-lateral mode, and the refractive index of the clad layer is equal to or more than an effective index against light in the 1st-order horizontal-lateral mode. The upper clad layer is provided only above a portion of the active layer, and thus is at least included in the ridge-stripe structure. This structure inhibits the I-L characteristic from suffering kink and realizes oscillations in the basic horizontal-lateral mode until output power reaches as high as 60–100 mW, in a peak output power of the semiconductor laser element at the time of a pulse current operation. This structure also enables the FFP to have an ellipticity of close to 1, thus making the spot of the semiconductor laser element close to a circular shape.

    摘要翻译: 半导体激光元件具有以下结构。 在包覆层中,基本水平横向模式和一阶水平横向模式之间的光辐射损失之差为10cm -1以上。 包覆层的折射率低于基本水平横向模式中的光的有效折射率,并且包覆层的折射率等于或大于一阶水平横向模式中的光的有效折射率 。 上覆盖层仅设置在有源层的一部分上方,因此至少包括在脊条结构中。 这种结构在脉冲电流操作时抑制了半导体激光器元件的峰值输出功率,从而抑制I-L特性遭受扭结并实现基本水平横向模式的振荡,直到输出功率达到高达60-100mW。 该结构也使得FFP具有接近1的椭圆率,从而使半导体激光元件的光斑接近圆形。

    Nitride semiconductor laser device and method of producing the same
    9.
    发明授权
    Nitride semiconductor laser device and method of producing the same 有权
    氮化物半导体激光器件及其制造方法

    公开(公告)号:US08059691B2

    公开(公告)日:2011-11-15

    申请号:US12801831

    申请日:2010-06-28

    申请人: Yukio Yamasaki

    发明人: Yukio Yamasaki

    IPC分类号: H01S3/097

    摘要: A method of producing a nitride semiconductor laser device includes forming a wafer including a nitride semiconductor layer of a first conductivity type, an active layer of a nitride semiconductor, a nitride semiconductor layer of a second conductivity type, and an electrode pad for the second conductivity type stacked in this order on a main surface of a conductive substrate and also including stripe-like waveguide structures parallel to the active layer; cutting the wafer to obtain a first type and a second type of laser device chips; and distinguishing between the first type and the second type of chips by automatic image recognition. The first type and the second type of chips are different from each other in position of the stripe-like waveguide structure with respect to a width direction of each chip and also in area ratio of the electrode pad to the main surface of the substrate.

    摘要翻译: 一种氮化物半导体激光器件的制造方法,其特征在于,包括:形成包括第一导电型的氮化物半导体层,氮化物半导体的有源层,第二导电型的氮化物半导体层和第二导电型的电极焊盘的晶片 类型堆叠在导电衬底的主表面上,并且还包括平行于有源层的条状波导结构; 切割晶片以获得第一类型和第二类型的激光器件芯片; 并通过自动图像识别区分第一类型和第二类型的芯片。 第一类型和第二类型的芯片在条形波导结构相对于每个芯片的宽度方向的位置上彼此不同,并且电极焊盘与基板的主表面的面积比也不同。