摘要:
A semiconductor memory device includes a cell array including one or more bank groups, where each of the one or more bank groups includes a plurality of banks and each of the plurality of banks includes a plurality of spin transfer torque magneto resistive random access memory (STT-MRAM) cells. The semiconductor memory device further includes a source voltage generating unit for applying a voltage to a source line connected to the each of the plurality of STT-MRAM cells, and a command decoder for decoding a command from an external source in order to perform read and write operations on the plurality of STT-MRAM cells. The command includes a combination of at least one signal of a row address strobe (RAS), a column address strobe (CAS), a chip selecting signal (CS), a write enable signal (WE), and a clock enable signal (CKE).
摘要:
A nonvolatile memory device comprises a nonvolatile cell array comprising a memory cell and a reference cell, a clamping circuit electrically connected to the memory cell and configured to clamp a voltage applied to a data sensing line during a read operation, and a clamping voltage generation unit configured to generate a clamping voltage responsive to a first voltage having a level based on the reference cell, and to feed back the clamping voltage to the clamping circuit.
摘要:
Provided is a memory device having a first switch configured to receive a first CSL signal to input or output data. A second switch is configured to receive a second CSL signal. A sensing and latch circuit (SLC) is coupled between the first and second switches. And at least one memory cell is coupled to the second switch. The second switch is configured to control timing of read or write operations of the at least one memory cell in response to the second CSL signal, e.g., where a read operation can be performed in not more than about 5 ns. The SLC operates as a latch in a write mode and as an amplifier in a read mode. The memory device may comprise part of a memory system or other apparatus including such memory device or system. Methods of performing read and write operations using such memory device are also provided.
摘要:
Provided is a memory device having a first switch configured to receive a first CSL signal to input or output data. A second switch is configured to receive a second CSL signal. A sensing and latch circuit (SLC) is coupled between the first and second switches. And at least one memory cell is coupled to the second switch. The second switch is configured to control timing of read or write operations of the at least one memory cell in response to the second CSL signal, e.g., where a read operation can be performed in not more than about 5 ns. The SLC operates as a latch in a write mode and as an amplifier in a read mode. The memory device may comprise part of a memory system or other apparatus including such memory device or system. Methods of performing read and write operations using such memory device are also provided.
摘要:
A memory core of a resistive type memory device includes at least a first resistive type memory cell coupled to a bit-line, a first resistance to voltage converter and a bit-line sense amplifier. The first resistance to voltage converter is coupled to the bit-line at a first node. The first resistance to voltage converter converts a resistance of the first resistive type memory cell to a corresponding voltage based on a read column selection signal. The bit-line sense amplifier is coupled to the bit-line at the first node and is coupled to a complementary bit-line at a second node. The bit-line sense amplifier senses and amplifies a voltage difference of the bit-line and the complementary bit-line in response to a sensing control signal.
摘要:
A method and a memory device therefor for reconfiguring a DQ pad organization of the memory device on-the-fly. A DQ organization reconfiguration control unit generates a control signal for reconfiguring the DQ pad organization into a desired mode based on a user command. A DQ organization reconfiguration unit is provided between P DQ pads and memory cell arrays and reconfigures organization P DQ pads on-the-fly in any one among Xi DQ pad modes, where i=1, 2, 4, 8, 16, 32, 64, and 128, based on the control signal. For the reconfiguration of the organization of the DQ pads, a plurality of bus lines for data transfer, being switchable by a control signal, are provided. The bus lines are implemented utilizing at least one of the M3 and M4 metal layers of the memory device.
摘要:
A temperature sensing circuit and method are provided. An example temperature sensing circuit includes a temperature sensing unit that outputs a temperature signal indicating whether the temperature in the semiconductor device is higher or lower than a reference temperature in response to a first current control signal or a second current control signal by using a first current level that is increased when the temperature rises and a second current level that is reduced when the temperature rises. The temperature sensing unit also includes a storage unit that stores and outputs the temperature signal, and a controller that changes the first current level or the second current level in response to the temperature signal output from the storage unit and generates the first current control signal or the second current control signal used to control the reference temperature.
摘要:
The present invention comprises a memory device for compensating for a clock skew that generates a centering error, and a method of compensating for the clock skew. To compensate for a clock skew that causes a centering error between an external clock signal and an output data signal, the memory device includes a phase detector (PD) and an up-down counter. The PD detects a phase difference between the output data signal and the external clock signal and generates an up signal or a down signal depending on the detected phase difference. The up-down counter is enabled by a calibration signal that directs a compensation of the skew and generates an offset code in response to the up signal or the down signal. The offset code is fed back to a delay locked loop (DLL) circuit and aligns the middle points of the output data signal with the edges of the external clock signal.
摘要:
A temperature sensing circuit and method are provided. An example temperature sensing circuit includes a temperature sensing unit that outputs a temperature signal indicating whether the temperature in the semiconductor device is higher or lower than a reference temperature in response to a first current control signal or a second current control signal by using a first current level that is increased when the temperature rises and a second current level that is reduced when the temperature rises. The temperature sensing unit also includes a storage unit that stores and outputs the temperature signal, and a controller that changes the first current level or the second current level in response to the temperature signal output from the storage unit and generates the first current control signal or the second current control signal used to control the reference temperature.
摘要:
In an output driver circuit and method, a control circuit generates a control signal in response to a current internal data signal. An output driver generates an output data signal in response to the control signal. A pre-emphasis circuit adjusts a current flowing through a node having the control signal generated thereon in response to a previous internal data signal. The pre-emphasis circuit may also adjust the output signal in response to the previous internal data signal.