Contact formation method and semiconductor device
    3.
    发明申请
    Contact formation method and semiconductor device 审中-公开
    触点形成方法和半导体器件

    公开(公告)号:US20050189651A1

    公开(公告)日:2005-09-01

    申请号:US10625546

    申请日:2003-07-24

    摘要: An object of the present invention is to reduce the resistance of an electrode of a Group III nitride semiconductor. A thin Si film and a thin Ti film are formed selectively in a contact formation region on a surface of an AlGaN layer as a Group III nitride semiconductor layer formed on a substrate, and the resulting substrate is heat-treated at a high temperature. By the heat treatment, Si is diffused into the AlGaN layer in the ohmic contact formation region at a concentration of about 1020 cm3. Further, an electron density sufficiently high to provide an ohmic characteristic through a reaction between Si and Ti is provided. Thus, a low resistance TiSi2 portion resulting from the reaction between Si and Ti, a TiN portion resulting from a reaction between Ti and AlGaN and a Group III metal portion of Ga and Al devoid of nitrogen are formed in the contact formation region thereby to provide a low resistance electrode film mainly comprising TiSi2.

    摘要翻译: 本发明的目的是降低III族氮化物半导体的电极的电阻。 在AlGaN层的表面上的接触形成区域中选择性地形成薄的Si膜和薄的Ti膜,作为形成在衬底上的III族氮化物半导体层,并将所得到的衬底在高温下进行热处理。 通过热处理,Si在欧姆接触形成区域中扩散到约10 20 cm 3的浓度的AlGaN层中。 此外,提供足够高的电子密度以通过Si和Ti之间的反应提供欧姆特性。 因此,形成由Si和Ti之间的反应产生的低电阻TiSi 2 H 2部分,由Ti和AlGaN之间的反应导致的TiN部分和缺少氮的Ga和Al的III族金属部分 在接触形成区域中,由此提供主要包含TiSi 2 N的低电阻电极膜。