High-resolution method for patterning a substrate with micro-printing
    1.
    发明授权
    High-resolution method for patterning a substrate with micro-printing 有权
    用微印刷图案化基板的高分辨率方法

    公开(公告)号:US06736985B1

    公开(公告)日:2004-05-18

    申请号:US09305722

    申请日:1999-05-05

    IPC分类号: H01L2100

    摘要: A method is disclosed for producing a high-resolution patterned layer on a substrate for use in making electronic devices. The method comprises micro-printing an inked pattern on a substrate with use of a rotatable stamp; passing the substrate to an apparatus for etching or depositing materials on the substrate, where the inked pattern guides the etching or deposition of material; and then optionally removing the inked pattern from the substrate with the application of heat, ultraviolet light, or wet chemical means. A high-quality transistor with a 2-micron channel length may be fabricated using the inventive method. The method is compatible with rapid, reel-to-reel patterning and useful for a range of applications.

    摘要翻译: 公开了用于在用于制造电子器件的基板上制造高分辨率图案层的方法。 该方法包括使用可旋转印模将印刷图案印刷在基底上; 将衬底传送到用于在衬底上蚀刻或沉积材料的装置,其中着墨图案引导材料的蚀刻或沉积; 然后通过施加热,紫外线或湿化学方法任选地从基板上去除着墨图案。 可以使用本发明的方法制造具有2微米沟道长度的高质量晶体管。 该方法与快速的卷对卷图案兼容,适用于一系列应用。

    Semiconductor device encapsulation
    2.
    发明授权
    Semiconductor device encapsulation 有权
    半导体器件封装

    公开(公告)号:US07439096B2

    公开(公告)日:2008-10-21

    申请号:US09789397

    申请日:2001-02-21

    IPC分类号: H01L51/40

    摘要: An encapsulated semiconductor device and method wherein an encapsulant material is deposited on the device in an environment that enhances device performance. Illustrative encapsulant materials are organic polymers, silicon polymers and metal/polymer-layered encapsulants. Encapsulant formation environments may include inert, reducing and ammonia gas environment. Further disclosed are an encapsulated transistor and a semiconductor device.

    摘要翻译: 一种封装的半导体器件和方法,其中密封剂材料在增强器件性能的环境中沉积在器件上。 示例性的密封剂材料是有机聚合物,硅聚合物和金属/聚合物分层的密封剂。 封装形成环境可包括惰性,还原和氨气环境。 进一步公开的是封装晶体管和半导体器件。

    Method for fabricating molded microstructures on substrates
    3.
    发明授权
    Method for fabricating molded microstructures on substrates 有权
    在基板上制造模塑微结构的方法

    公开(公告)号:US06322736B1

    公开(公告)日:2001-11-27

    申请号:US09393032

    申请日:1999-09-09

    IPC分类号: B29C3338

    摘要: An improved elastomeric mold for use in fabricating microstructures, the mold having first and second surfaces, the first surface including at least one recessed microchannel and the second surface including an access opening or filling member that extends through the mold to the first surface and communicates with the recessed microchannel. The mold is used by placing it onto a substrate with the recessed microchannel facing the substrate. The access opening of the mold is filled with a liquid material which is capable of solidifying. The access opening continuously introduces the liquid material into the space defined between the microchannel and the substrate. After the liquid material solidifies, the mold is removed from the substrate thereby leaving a microstructure formed from the solidified liquid material on the substrate.

    摘要翻译: 一种用于制造微结构的改进的弹性体模具,所述模具具有第一和第二表面,所述第一表面包括至少一个凹入的微通道,所述第二表面包括通过所述模具延伸到所述第一表面并与 嵌入式微通道。 通过将模具放置在具有凹陷的微通道面向衬底的衬底上而被使用。 模具的进入口填充有能够固化的液体材料。 进入开口将液体材料连续地引入到限定在微通道和基底之间的空间中。 在液体材料固化之后,将模具从基材上除去,从而在基板上留下由固化的液体材料形成的微结构。

    Mold for non - photolithographic fabrication of microstructures
    5.
    发明授权
    Mold for non - photolithographic fabrication of microstructures 失效
    用于非光刻制造微结构的模具

    公开(公告)号:US6033202A

    公开(公告)日:2000-03-07

    申请号:US049531

    申请日:1998-03-27

    摘要: An improved elastomeric mold for use in fabricating microstructures, the mold having first and second surfaces, the first surface including at least one recessed microchannel and the second surface including an access opening or filling member that extends through the mold to the first surface and communicates with the recessed microchannel. The mold is used by placing it onto a substrate with the recessed microchannel facing the substrate. The access opening of the mold is filled with a liquid material which is capable of solidifying. The access opening continuously introduces the liquid material into the space defined between the microchannel and the substrate. After the liquid material solidifies, the mold is removed from the substrate thereby leaving a microstructure formed from the solidified liquid material on the substrate.

    摘要翻译: 一种用于制造微结构的改进的弹性体模具,所述模具具有第一和第二表面,所述第一表面包括至少一个凹入的微通道,所述第二表面包括通过所述模具延伸到所述第一表面并与 嵌入式微通道。 通过将模具放置在具有凹陷的微通道面向衬底的衬底上而被使用。 模具的进入口填充有能够固化的液体材料。 进入开口将液体材料连续地引入到限定在微通道和基底之间的空间中。 在液体材料固化之后,将模具从基材上除去,从而在基板上留下由固化的液体材料形成的微结构。

    Method of manufacturing a patterned light emitting diode devices

    公开(公告)号:US06372532B1

    公开(公告)日:2002-04-16

    申请号:US09754959

    申请日:2001-01-05

    IPC分类号: H01L2100

    摘要: An LED device that emits light in a pattern is disclosed. The LED device is a layer of active material that is sandwiched between a transparent substrate with an anode formed thereon and a cathode. The active material has a layer of light emitting material that emits light when electron/hole recombination is induced in the material. The patterned emission is defined by a patterned layer in the active material of the LED device. The patterned layer has at least a first thickness and a second thickness. When the device is on, the portion of the device associated with the first thickness of the patterned layer is visually distinct from the portion of the device that is associated with the second thickness of the patterned layer.

    Patterned light emitting diode devices
    8.
    发明授权
    Patterned light emitting diode devices 失效
    图案化的发光二极管器件

    公开(公告)号:US06252253B1

    公开(公告)日:2001-06-26

    申请号:US09095236

    申请日:1998-06-10

    IPC分类号: H01L3300

    摘要: An LED device that emits light in a pattern is disclosed. The LED device is a layer of active material that is sandwiched between a transparent substrate with an anode formed thereon and a cathode. The active material has a layer of light emitting material that emits light when electron/hole recombination is induced in the material. The patterned emission is defined by a patterned layer in the active material of the LED device. The patterned layer has at least a first thickness and a second thickness. When the device is on, the portion of the device associated with the first thickness of the patterned layer is visually distinct from the portion of the device that is associated with the second thickness of the patterned layer.

    摘要翻译: 公开了以图案发光的LED装置。 LED装置是夹在其上形成有阳极的透明基板和阴极之间的活性材料层。 活性材料具有在材料中诱发电子/空穴复合时发光的发光材料层。 图案化发射由LED器件的活性材料中的图案化层限定。 图案化层具有至少第一厚度和第二厚度。 当器件接通时,与图案化层的第一厚度相关联的器件的部分在视觉上不同于与图案化层的第二厚度相关联的器件的部分。