摘要:
A method for electrolytically repairing a copper seed layer. The method includes positioning the seed layer in fluid communication with a low conductivity seed layer repair solution, wherein the low conductivity seed layer repair solution includes a copper concentration of less than about 20 g/l, a pH of less than about 4, a chlorine ion concentration of between about 20 ppm and about 100 ppm, and an additive organic surfactant configured to suppress a copper deposition rate in the concentration range of 200 ppm to 2000 ppm. The method further includes applying a seed layer repair bias configured to generate a current density of less than about 5 mA/cm2 across the seed layer and cleaning the repaired seed layer in pure water containing less than 1 ppm chloride ions.
摘要翻译:一种用于电解修复铜籽晶层的方法。 该方法包括将种子层定位成与低电导种子层修复溶液流体连通,其中低电导种子层修复溶液包括小于约20g / l的铜浓度,小于约4的pH,氯 约20ppm至约100ppm的离子浓度,以及配置为在200ppm至2000ppm的浓度范围内抑制铜沉积速率的添加剂有机表面活性剂。 该方法还包括施加晶种层修复偏压,其被配置成跨越种子层产生小于约5mA / cm 2的电流密度,并且在含有小于1ppm的纯水中清洁修复的种子层 氯离子。
摘要:
Generally, the process includes depositing a barrier layer and seed layer on a feature formed in a dielectric layer, performing a grafting process, initiating a copper layer and then filing the feature by use of a bulk copper fill process. Copper features formed according to aspects described herein have desirable adhesion properties to a barrier and seed layers formed on a semiconductor substrate and demonstrate enhanced electromigration and stress migration results in the fabricated devices formed on the substrate.
摘要:
Generally, the process includes depositing a barrier layer and seed layer on a feature formed in a dielectric layer, performing a grafting process, initiating a copper layer and then filing the feature by use of a bulk copper fill process. Copper features formed according to aspects described herein have desirable adhesion properties to a barrier and seed layers formed on a semiconductor substrate and demonstrate enhanced electromigration and stress migration results in the fabricated devices formed on the substrate.
摘要:
Generally, the process includes depositing a barrier layer on a feature formed in a dielectric layer, decorating the barrier layer with a metal, performing a grafting process, initiating a copper layer and then filing the feature by use of a bulk copper fill process. Copper features formed according to aspects described herein have desirable adhesion properties to a barrier layer formed on a semiconductor substrate and demonstrate enhanced electromigration and stress migration results in the fabricated devices formed on the substrate.
摘要:
Embodiments of the invention teach a method for depositing a copper seed layer to a substrate surface, generally to a barrier layer. The method includes placing the substrate surface into a copper solution, wherein the copper solution includes complexed copper ions. A current or bias is applied across the substrate surface and the complexed copper ions are reduced to deposit the copper seed layer onto the barrier layer.
摘要:
A method and apparatus are provided for plating metal onto a substrate. The method generally includes applying a plating solution comprising at least a leveler to a substrate; substantially filling features in the substrate by plating metal ions from the plating solution onto the substrate, and applying sonic energy to the plating solution across a surface of the substrate prior to completely filling the features.
摘要:
The present invention generally includes deposition and electropolishing methods and an apparatus comprising an electroplating cell and auxiliary cell. In one embodiment for electropolishing a substrate, a cycle is performed in which the substrate is alternately placed in an anolyte solution to remove material and a catholyte solution to deposit material. As the cycle is repeated successively, an exposed layer disposed on the substrate is planarized. In another embodiment, an auxiliary cell may be used to deposit the ultrathin seed layer prior to electroplating.
摘要:
A system and method are provided for mixing song data based on measure groupings. A player or program may recognize measure groupings in a song through identifying cuepoints. The player or program may use the cuepoints and/or other identifiers of measure groupings to generate a transition between the song and other songs. Parts of one or both songs may be time-stretched, or frames may be added or deleted, such that the beats in both songs are substantially aligned during the transition. The system and method may also involve altering the sequence of frames in one or both of the songs, so that the transition may have various sonic qualities as desired by a user. A choice of transition modes may be provided via a user interface that allow the user some control over when and how transitions between songs are executed.
摘要:
A system and method are provided for generating cuepoints for mixing song data. One or more people may listen to a song and identify measure groupings within the song. The one or more people might generate markings corresponding to these measure groupings and submit the markings to a cuepoint generation system. The markings may then be reconciled into cuepoints that may be used for mixing the song with other song data. In some embodiments, the cuepoints may be adjusted based on characteristics of the particular songs that are to be mixed together.
摘要:
An epicardial lead is passively fixed in a pericardial space by a passive fixation member. The passive fixation member extends from a distal portion of an epicardial lead and acts against a pericardial layer and an epicardial layer to hold the lead in place. The epicardial lead may include an electrode that is connected to a conductor that extends from a distal portion of the lead. In some embodiments the epicardial lead includes a material that promotes fibrosis to fix the lead to heart tissue. The passive fixation member may include a shocking coil.