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1.发明授权Integrated circuit packaging system with bumps and method of manufacture thereof 有权具有凸块的集成电路封装系统及其制造方法公开(公告)号：US09076737B2
公开(公告)日：2015-07-07
申请号：US12487925
申请日：2009-06-19
CPC分类号： H01L23/3107 , H01L21/568 , H01L2224/73265
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base strip having a base top side; forming a terminal body with a substantially spherical shape partially in the base strip; attaching a device adjacent the terminal body and over the base top side, a device mount side of the device below a top portion of the terminal body; attaching a device connector to the device and the top portion of the terminal body; applying an encapsulant over the device connector, the device, and the top portion of the terminal body; and removing the base strip providing the terminal body partially exposed from the encapsulant.
摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有基底侧的基底条; 在所述基底条中部分地形成具有大致球形的端子体; 将设备附接到终端主体并在基座顶侧附近，该设备的设备安装侧在终端主体的顶部下方; 将设备连接器附接到所述设备和所述终端主体的顶部; 在所述设备连接器，所述设备以及所述终端主体的顶部上施加密封剂; 并且移除提供从密封剂部分露出的终端体的基底条。
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2.发明申请公开(公告)号：US20100320589A1
公开(公告)日：2010-12-23
申请号：US12487925
申请日：2009-06-19
IPC分类号： H01L23/488 , H01L21/56
CPC分类号： H01L23/3107 , H01L21/568 , H01L2224/73265
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base strip having a base top side; forming a terminal body with a substantially spherical shape partially in the base strip; attaching a device adjacent the terminal body and over the base top side, a device mount side of the device below a top portion of the terminal body; attaching a device connector to the device and the top portion of the terminal body; applying an encapsulant over the device connector, the device, and the top portion of the terminal body; and removing the base strip providing the terminal body partially exposed from the encapsulant.
摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有基底侧的基底条; 在所述基底条中部分地形成具有大致球形的端子体; 将设备附接到所述终端主体并且在所述基座顶侧上方，所述设备的设备安装侧在所述终端主体的顶部下方; 将设备连接器附接到所述设备和所述终端主体的顶部; 在所述设备连接器，所述设备以及所述终端主体的顶部上施加密封剂; 并且移除提供从密封剂部分露出的终端体的基底条。
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3.发明授权Integrated circuit packaging system with a leadframe having radial-segments and method of manufacture thereof 有权具有具有径向段的引线框的集成电路封装系统及其制造方法公开(公告)号：US08252634B2
公开(公告)日：2012-08-28
申请号：US12488043
申请日：2009-06-19
IPC分类号： H01L21/00
CPC分类号： H01L23/4951 , H01L23/3135 , H01L23/49541 , H01L23/49548 , H01L23/49572 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16245 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/0555 , H01L2224/0556
摘要： A method of manufacture of an integrated circuit packaging system includes: providing inwardly converging leadfingers having continuously decreasing widths along lengths thereof to inward ends thereof; electrically connecting an integrated circuit device on the leadfingers only on portions of the continuously decreasing widths; and encapsulating the integrated circuit device and the leadfingers with an encapsulation.
摘要翻译： 一种集成电路封装系统的制造方法，其特征在于包括：沿其长度方向向其内端提供具有连续减小的宽度的向内会聚的引线管; 仅在连续减小宽度的部分上将导线器上的集成电路器件电连接; 并用封装封装集成电路器件和引线管。
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4.发明申请INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ISOLATED PADS AND METHOD OF MANUFACTURE THEREOF 有权具有隔离垫的集成电路包装系统及其制造方法公开(公告)号：US20110284999A1
公开(公告)日：2011-11-24
申请号：US13197122
申请日：2011-08-03
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49551 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/85 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/73265 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2924/01029 , H01L2924/01074 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a lead frame having a die attach paddle, an isolated pad, and a connector; attaching an integrated circuit die to the die attach paddle and the connector; forming an encapsulation over the integrated circuit die, the connector, the die attach paddle, and the isolated pad; and singulating the connector and the die attach paddle whereby the isolated pads are electrically isolated.
摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有管芯附接焊盘，隔离焊盘和连接器的引线框架; 将集成电路管芯连接到管芯附接焊盘和连接器; 在集成电路管芯，连接器，管芯附接焊盘和隔离焊盘上形成封装; 并且分离连接器和管芯附接板，由此隔离焊盘被电隔离。
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公开(公告)号：US20100006993A1
公开(公告)日：2010-01-14
申请号：US12172095
申请日：2008-07-11
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49503 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L23/49575 , H01L24/06 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/05599 , H01L2224/32014 , H01L2224/32057 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/83385 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01082 , H01L2924/14 , H01L2924/18301 , H01L2924/30105 , H01L2924/30107 , H01L2224/45099 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes: providing a lead having a lead connection surface for connectivity to a next level system; attaching an integrated circuit over the lead having the lead connection surface substantially within a region below a perimeter of the integrated circuit without a die paddle, a substrate conductor, or a redistribution layer; and attaching a die connector to the integrated circuit and the lead.
摘要翻译： 集成电路封装系统包括：提供具有用于连接到下一级系统的引线连接表面的引线; 在所述引线上附接集成电路，所述引线具有大致在所述集成电路的周边以下的区域内的引线连接表面，而没有管芯焊盘，衬底导体或再分布层; 并将管芯连接器连接到集成电路和引线。
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公开(公告)号：US08273602B2
公开(公告)日：2012-09-25
申请号：US12046430
申请日：2008-03-11
IPC分类号： H01L21/00
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/3135 , H01L23/49531 , H01L23/49548 , H01L23/49551 , H01L24/48 , H01L25/03 , H01L25/105 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/32145 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/3025 , H01L2924/00 , H01L2224/05599 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system comprising: fabricating a package base including: forming a lead frame, coupling a first integrated circuit device under the lead frame, coupling a second integrated circuit device over the first integrated circuit device, and molding an enclosure on the lead frame, the first integrated circuit device, and the second integrated circuit device for forming an integration port; and coupling a third integrated circuit device on the integration port.
摘要翻译： 一种集成电路封装系统，包括：制造封装基座，包括：形成引线框架，将引线框架下方的第一集成电路器件耦合到第一集成电路器件上的第二集成电路器件，以及将引线框架上的外壳模制成型 ，第一集成电路器件和用于形成集成端口的第二集成电路器件; 并在集成端口上耦合第三集成电路器件。
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7.发明授权Integrated circuit packaging system with isolated pads and method of manufacture thereof 有权具有隔离垫的集成电路封装系统及其制造方法公开(公告)号：US07998790B2
公开(公告)日：2011-08-16
申请号：US12474757
申请日：2009-05-29
IPC分类号： H01L21/00
CPC分类号： H01L23/49551 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/85 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/73265 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2924/01029 , H01L2924/01074 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A method of manufacture of an integrated circuit die packaging system includes: providing a lead frame having a die attach paddle, an isolated pad, and a connector; attaching an integrated circuit die to the die attach paddle and the connector; forming an encapsulation over the integrated circuit die, the connector, the die attach paddle, and the isolated pad; and singulating the connector and the die attach paddle whereby the isolated pads are electrically isolated.
摘要翻译： 一种制造集成电路管芯封装系统的方法，包括：提供具有管芯附接焊盘，隔离焊盘和连接器的引线框架; 将集成电路管芯连接到管芯附接焊盘和连接器; 在集成电路管芯，连接器，管芯附接焊盘和隔离焊盘上形成封装; 并且分离连接器和管芯附接板，由此隔离焊盘被电隔离。
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公开(公告)号：US20090230517A1
公开(公告)日：2009-09-17
申请号：US12046430
申请日：2008-03-11
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/3135 , H01L23/49531 , H01L23/49548 , H01L23/49551 , H01L24/48 , H01L25/03 , H01L25/105 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/32145 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/3025 , H01L2924/00 , H01L2224/05599 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system comprising: fabricating a package base including: forming a lead frame, coupling a first integrated circuit device under the lead frame, coupling a second integrated circuit device over the first integrated circuit device, and molding an enclosure on the lead frame, the first integrated circuit device, and the second integrated circuit device for forming an integration port; and coupling a third integrated circuit device on the integration port.
摘要翻译： 一种集成电路封装系统，包括：制造封装基座，包括：形成引线框架，将引线框架下方的第一集成电路器件耦合到第一集成电路器件上的第二集成电路器件，以及将引线框架上的外壳模制成型 ，第一集成电路器件和用于形成集成端口的第二集成电路器件; 并在集成端口上耦合第三集成电路器件。
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公开(公告)号：US20090115032A1
公开(公告)日：2009-05-07
申请号：US11936532
申请日：2007-11-07
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49551 , H01L23/552 , H01L24/48 , H01L25/105 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2225/1029 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes: forming a lead having a both top contact portion and a bottom contact portion; connecting an integrated circuit die and the lead; and forming a package encapsulation, having a top side and a bottom side, over the integrated circuit die. The forming the package encapsulation includes partially exposing the top contact portion at the top side, and partially exposing the bottom contact portion along the bottom side with the bottom contact portion extending beyond a nonhorizontal portion of the package encapsulation.
摘要翻译： 集成电路封装系统包括：形成具有两个顶部接触部分和底部接触部分的引线; 连接集成电路管芯和引线; 以及在集成电路管芯上形成具有顶侧和底侧的封装封装。 形成封装封装包括部分地暴露顶侧的顶部接触部分，并且使底部接触部分沿底部部分露出，底部接触部分延伸超过封装封装的非水平部分。
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10.发明申请INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ISOLATED PADS AND METHOD OF MANUFACTURE THEREOF 有权具有隔离垫的集成电路包装系统及其制造方法公开(公告)号：US20090302442A1
公开(公告)日：2009-12-10
申请号：US12474757
申请日：2009-05-29
IPC分类号： H01L23/495 , H01L21/50
CPC分类号： H01L23/49551 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/85 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/73265 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2924/01029 , H01L2924/01074 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A method of manufacture of an integrated circuit die packaging system includes: providing a lead frame having a die attach paddle, an isolated pad, and a connector; attaching an integrated circuit die to the die attach paddle and the connector; forming an encapsulation over the integrated circuit die, the connector, the die attach paddle, and the isolated pad; and singulating the connector and the die attach paddle whereby the isolated pads are electrically isolated.
摘要翻译： 一种制造集成电路管芯封装系统的方法，包括：提供具有管芯附接焊盘，隔离焊盘和连接器的引线框架; 将集成电路管芯连接到管芯附接焊盘和连接器; 在集成电路管芯，连接器，管芯附接焊盘和隔离焊盘上形成封装; 并且分离连接器和管芯附接板，由此隔离焊盘被电隔离。
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