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公开(公告)号：US20210362382A1
公开(公告)日：2021-11-25
申请号：US17238135
申请日：2021-04-22
发明人： Masahiko FUJISAWA , Hirofumi SAITO
摘要： A resin molding device that can hold a thin and large-size workpiece without positional displacement when the workpiece is conveyed even if dimensional tolerance and rigidity are different, and can convey the workpiece to a mold frame without losing flatness or damage is provided.
When a loader (4) holds a workpiece (W) aligned by a preheating part (10), a center position of a loader hand (4b) is aligned with a center position of the workpiece (W) according to an amount of positional displacement between an external form position of the workpiece (W) and a reference position in the X-Y direction and the workpiece (W) is then held.-
公开(公告)号：US20070262049A1
公开(公告)日：2007-11-15
申请号：US11798447
申请日：2007-05-14
申请人： Fumio Miyajima , Kazuhiko Kobayashi , Kazuhiko Kobayashi , Hideaki Nakazawa , Naoya Gotoh , Masahiko Fujisawa , Akira Katsuyama , Shuji Ide
发明人： Fumio Miyajima , Kazuhiko Kobayashi , Kazuhiko Kobayashi , Hideaki Nakazawa , Naoya Gotoh , Masahiko Fujisawa , Akira Katsuyama , Shuji Ide
CPC分类号： B29C33/42 , B29C43/003 , B29C43/021 , B29C43/18 , B29C2043/025 , B29C2043/3605 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： An imprinting method carries out imprinting on a workpiece by clamping UV-curable resin between a nano-imprinting mold and a workpiece and curing the UV-curable resin using UV light. In this method, the workpiece is supported on a setting table provided with through-holes that are disposed in a planar region of the setting table on which the workpiece is set and are connected to a gas pumping/evacuating mechanism. The UV-curable resin is supplied onto the workpiece and the setting table is raised to and stopped at a filling operation position where the mold surface of the nano-imprinting mold and the surface of the workpiece are apart. After this, gas is pumped toward the lower surface of the workpiece from the through-holes and the workpiece is pressed onto the nano-imprinting mold from a center of the workpiece toward a periphery of the workpiece while gradually filling the UV-curable resin between the nano-imprinting mold and the workpiece. The UV-curable resin is cured by irradiating the UV-curable resin with UV light in a state where the workpiece is pressed onto the nano-imprinting mold by the pumping pressure of the gas.
摘要翻译： 压印方法通过将UV固化树脂夹在纳米压印模和工件之间并通过UV光固化UV固化树脂，在工件上进行压印。 在该方法中，工件被支撑在设置有设置在设置工作台的平面区域中并且与气体抽吸/排气机构连接的通孔的设置台上。 将紫外线固化树脂供给到工件上，并且将安装台升高并停止在填充操作位置，其中纳米压印模具的模具表面和工件表面分开。 此后，气体从通孔向工件的下表面泵送，并且工件从工件的中心朝向工件的周边压到纳米压印模具上，同时逐渐地将UV可固化树脂填充在 纳米压印模具和工件。 在通过气体的泵送压力将工件压在纳米压印模上的状态下，通过用UV光照射UV固化树脂来固化紫外线固化树脂。
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公开(公告)号：US20020017738A1
公开(公告)日：2002-02-14
申请号：US09884054
申请日：2001-06-20
发明人： Fumio Miyajima
IPC分类号： B29C045/14 , H01L021/56
CPC分类号： H01L24/75 , B29C45/14655 , B29C2045/14663 , H01L21/563 , H01L21/565 , H01L2224/16225 , H01L2224/73203 , H01L2224/75315 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01078 , H01L2924/01079 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/351 , H01L2924/00 , H01L2224/0401
摘要： Under-fill molding is carried out by preferentially sending a sealing resin 22 under pressure into a clearance portion 21 between a semiconductor chip 6 and a substrate 2, and a molded component gate runner 25 that is connected to the under-fill portion 24 is separated at the substrate end position.
摘要翻译： 通过优先将密封树脂22在压力下进入半导体芯片6和基板2之间的间隙部分21中进行欠填充，并且连接到底部填充部分24的模制部件浇口浇道25被分离 在基板端部位置。
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公开(公告)号：US5891384A
公开(公告)日：1999-04-06
申请号：US561021
申请日：1995-11-21
申请人： Fumio Miyajima
发明人： Fumio Miyajima
CPC分类号： B29C45/463 , B29C33/68 , B29C45/02 , B29C45/14655 , B29C45/37 , H01L21/56 , B29C2045/14663 , H01L2924/0002
摘要： An object of the present invention is to provide a resin molding machine having molding dies, which have simple structures and which can be easily made. Another object is to provide a method of resin molding using release film, which is capable of employing various materials as a material for the molding dies. In the resin molding machine of the present invention, molding dies have molding sections including cavities, and the molding dies are capable of clamping a member to be molded. A pot pressurizes and sends resin melt to the cavities. A fixing mechanism fixes release film, which is capable of easily peeling off from the molding dies and resin for molding, on inner faces of the molding sections and clamping faces, and the fixing mechanism fixes the release film by sucking air.
摘要翻译： 本发明的目的是提供一种具有成型模具的树脂模塑机，其结构简单并且可以容易地制成。 另一个目的是提供使用脱模膜的树脂模制方法，该方法能够使用各种材料作为模具的材料。 在本发明的树脂成型机中，成形模具具有包括空腔的成型部，成型模具能够夹持待成型的部件。 锅加压并将树脂熔体送入空腔。 固定机构在成型部和夹紧面的内表面上固定能够容易地从模具和模塑树脂剥离的脱模膜，并且固定机构通过吸入空气来固定脱模膜。
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公开(公告)号：US20240116224A1
公开(公告)日：2024-04-11
申请号：US18276881
申请日：2022-04-28
发明人： MAKOTO YANAGISAWA , SHUSAKU TAGAMI
IPC分类号： B29C43/58
CPC分类号： B29C43/58 , B29C2043/5825 , B29C2043/5875
摘要： A compression molding device compression-molds resin to a workpiece in which components are mounted on a carrier via connection members, and produces packages each having at least one component resin-sealed therein. The compression molding device comprises: a measuring part measuring the weight of the workpiece; a calculation part calculating the supply amount of the resin based on the weight of the workpiece measured by the measuring part; a supply part supplying the resin in the supply amount calculated by the calculation part; and a molding die for compression-molding, to the workpiece, the resin supplied by the supply part. The calculation part calculates the total volume of mounted objects, including the components and the connection members, based on the weight of the workpiece and calculates the supply amount of the resin based on the total volume of the mounted objects.
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公开(公告)号：US20230382022A1
公开(公告)日：2023-11-30
申请号：US18181553
申请日：2023-03-10
发明人： Masahiko Fujisawa
CPC分类号： B29C43/32 , B29C43/18 , B29C33/305 , B29L2031/34
摘要： The resin sealing apparatus according to the present invention includes a press device for closing and opening an upper mold and a lower mold. The press device includes a fixed platen to which one of the upper mold and the lower mold is fixed and a movable platen to which the other one is fixed, a tie bar fixing the fixed platen and holding the movable platen so that the movable platen can be lifted and lowered, and a drive device lifting and lowering the movable platen. The fixed platen has a fixed portion fixed to the tie bar on the side of a first surface of a main body portion and a bell-shaped portion provided on the side of a second surface opposite to the first surface, and one of the upper mold and the lower mold is fixed to the bell-shaped portion.
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7.发明申请公开(公告)号：US20220152887A1
公开(公告)日：2022-05-19
申请号：US17489806
申请日：2021-09-30
摘要： A resin supply apparatus, a resin sealing apparatus, and a method for manufacturing a resin-sealed product are provided. A resin supply apparatus supplies a resin onto a workpiece on which elements are arranged in a first direction and a second direction intersecting the first direction, respectively. The resin supply apparatus includes: an acquisition unit for acquiring arrangement information of the elements on the workpiece; a supply unit for supplying the resin onto the workpiece; a calculation unit for calculating a resin supply pattern based on the arrangement information; and a drive unit for moving at least one of the workpiece and the supply unit relative to the other along the resin supply pattern. The resin supply pattern has linear paths extending along the first direction, and a region between the mutually adjacent linear paths in the plurality of linear paths is opened to the outside of the workpiece.
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公开(公告)号：US09831187B2
公开(公告)日：2017-11-28
申请号：US14648587
申请日：2013-11-11
发明人： Kazuhiko Kobayashi , Keisuke Suda
IPC分类号： H01L23/552 , B05B5/025 , B05B5/14 , B29C33/58 , B29C33/72 , H01L21/321 , H01L21/3205 , H01L21/67 , H01L23/00 , H05K1/11
CPC分类号： H01L23/552 , B05B5/025 , B05B5/14 , B29C33/58 , B29C33/72 , G03F7/0002 , G03F7/164 , H01L21/3205 , H01L21/321 , H01L21/326 , H01L21/6715 , H01L24/19 , H01L24/24 , H01L24/48 , H01L24/76 , H01L24/82 , H01L24/85 , H01L2224/32145 , H01L2224/451 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/73265 , H01L2224/73267 , H01L2224/8592 , H01L2924/00011 , H01L2924/12041 , H01L2924/1461 , H01L2924/181 , H01L2924/3025 , H05K1/11 , H01L2924/00014 , H01L2924/00 , H01L2924/01005
摘要： Provided is a resist film forming device which uses an electrostatic spray device which is capable of forming a thin film with a uniform thickness on a workpiece. A resist film forming device (100), which forms a resist film (108) on a substrate by electrostatic spraying, comprises: a nozzle (102) which, upon application of a prescribed voltage, sprays liquid particles which form the raw material for a resist film (108) toward a substrate (105) having stepped portions (105a); a driving means (111) for causing relative movement of the substrate (105) or the nozzle (102); and a control means (110) for controlling such that the resist film (108) is formed on the substrate (105) having the stepped portions (105a) by the liquid particles.
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公开(公告)号：US09738014B2
公开(公告)日：2017-08-22
申请号：US13303340
申请日：2011-11-23
申请人： Tetsuya Maeyama , Hidemichi Kobayashi , Shusaku Tagami , Yoshikazu Muramatsu , Takayuki Yamazaki , Keiji Koyama , Hideaki Nakazawa , Hiroshi Harayama , Kenji Nishizawa , Makoto Kawaguchi , Masahiko Fujisawa , Hidetoshi Oya
发明人： Tetsuya Maeyama , Hidemichi Kobayashi , Shusaku Tagami , Yoshikazu Muramatsu , Takayuki Yamazaki , Keiji Koyama , Hideaki Nakazawa , Hiroshi Harayama , Kenji Nishizawa , Makoto Kawaguchi , Masahiko Fujisawa , Hidetoshi Oya
IPC分类号： B29C31/04 , B29C43/58 , B29C43/18 , B29C31/00 , B29C37/00 , H01L21/56 , B29C35/02 , B29C45/14
CPC分类号： B29C43/18 , B29C31/008 , B29C31/042 , B29C35/02 , B29C37/001 , B29C45/1468 , B29C2043/181 , H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： The compact resin molding machine is capable of efficiently performing a sequence of molding actions from feeding a work and resin to accommodating the molded work. The resin molding machine comprises: a work conveying mechanism including a robot, which has a robot hand for holding the work and which is capable of rotating and linearly moving; a work feeding section for feeding the work; a resin feeding section for feeding the resin; a press section including a molding die set, in which the work is resin-molded; a work accommodating section for accommodating the molded work; and a control section controlling the entire resin molding machine. The work feeding section, the resin feeding section, the press section and the work accommodating section are located to enclose a moving area of the robot of the work conveying mechanism.
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公开(公告)号：US09129203B2
公开(公告)日：2015-09-08
申请号：US14345919
申请日：2012-09-06
申请人： Fumihito Ishida , Masao Nishizawa , Kenji Kida , Tadahiko Hirano
发明人： Fumihito Ishida , Masao Nishizawa , Kenji Kida , Tadahiko Hirano
CPC分类号： G06K19/07783 , B29C45/14 , G06K19/027 , G06K19/0723 , G06K19/07724 , G06K19/07756 , G06K19/07794 , H01Q1/2225 , H01Q1/273 , H01Q1/44 , H01Q7/00 , Y10T29/41
摘要： An RFID tag is provided which does not give a user a feeling of strangeness even when contacting his/her body and is firmly attachable to a fabric such as clothes. The RFID tag is for wireless communications and includes a main antenna 30 formed by a conductive fiber, a loop antenna 12 electrically coupled to the main antenna 30 without direct conductive connection, a semiconductor device 20 electrically connected to a terminal 16 of the loop antenna 12, and a resin 28 collectively sealing the main antenna 30, the loop antenna 12, and the semiconductor device 20.
摘要翻译： 提供RFID标签，其即使在接触他/她的身体并且牢固地附接到诸如衣服的织物上时也不会给予使用者陌生的感觉。 RFID标签用于无线通信，并且包括由导电纤维形成的主天线30，没有直接导电连接而电耦合到主天线30的环形天线12，电连接到环形天线12的端子16的半导体器件20 以及共同密封主天线30，环形天线12和半导体器件20的树脂28。
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