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公开(公告)号：US12129567B2
公开(公告)日：2024-10-29
申请号：US15148034
申请日：2016-05-06
发明人： Kurt F. Fischer , Alexander W. Haas , Matthew J. Horner , Peter F. Ladwig , Carl C. Minton , Paul V. Pesavento , David D. Smahel , Christopher J. Sperl , Darrell C. Sydlo , Ritesh K. Tiwari , Kyle T. Tobias , Maryam O. Yusuf
IPC分类号： C25D5/34 , C23C18/16 , C25D5/02 , C25D7/00 , C25D7/06 , G11B5/48 , H01J37/32 , H05K1/05 , H05K3/18
CPC分类号： C25D5/34 , C23C18/1653 , C25D5/022 , C25D7/00 , C25D7/0614 , C25D7/0678 , G11B5/486 , H01J37/32403 , H01J37/32825 , H05K1/053 , H05K3/182 , G11B5/484 , H05K2203/0709 , H05K2203/095
摘要： Methods for producing flexible circuits can include creating treating a surface of the flexible circuit with at least one of an atmospheric plasma and a beam of ions. The atmospheric plasma is formed by directing a flow of gas between an electrode and the surface of the flexible circuit and generating a voltage between the electrode and the flexible circuit to create a plasma from the gas. A mean ion energy of the ions in the ion beam ranges from about 500 electron volts to about 1,500 electron volts.
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公开(公告)号：US12044965B2
公开(公告)日：2024-07-23
申请号：US17171886
申请日：2021-02-09
发明人： Clark T. Olsen , Jeffery G. Ribar
IPC分类号： G03F7/00 , C09J5/00 , C23C2/02 , C23C16/02 , C23F1/02 , H01L21/02 , H01L21/027 , H01L21/683 , H01L21/768
CPC分类号： G03F7/0012 , C09J5/00 , C23C2/024 , C23C16/0227 , C23F1/02 , H01L21/02263 , H01L21/0273 , H01L21/6836 , H01L21/76801 , C09J2203/326 , C09J2301/416 , C09J2433/00 , C09J2467/005 , C09J2467/006 , H01L2221/1084 , H01L2221/68345
摘要： A method for producing a component without tabs during etching. The method includes: applying a wafer tape to the plated side of the substrate; depositing a resist layer on a metal layer on a metal side of the substrate that is opposite of the plated side; exposing the resist layer to UV light; developing the resist layer; and etching the metal layer.
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公开(公告)号：US12044219B2
公开(公告)日：2024-07-23
申请号：US17549508
申请日：2021-12-13
IPC分类号： F03G7/06 , F16F15/00 , F16F15/06 , F16M11/04 , F16M11/18 , F16M13/02 , G02B7/02 , G02B7/09 , G03B3/10 , G03B5/00 , G03B13/36 , H02N10/00 , H04N23/54 , H04N23/55 , H04N23/68
CPC分类号： F03G7/065 , F03G7/0614 , F16F15/005 , F16F15/06 , F16M11/045 , F16M11/18 , F16M13/022 , G02B7/023 , G02B7/09 , G03B5/00 , H02N10/00 , H04N23/54 , H04N23/55 , H04N23/6812 , H04N23/687 , G03B3/10 , G03B13/36 , G03B2205/0007 , G03B2205/0076
摘要： A suspension assembly is described. The suspension assembly including a static member or plate; a moving member or plate movable about an x-axis and a y-axis with respect to the static plate; a sensor mounting region on the moving plate; and one or more shape memory alloy (SMA) elements extending between and coupled to the static plate and moving plate. The SMA elements, when driven by a controller, move the moving plate and the sensor mounting region thereon about the x-axis and the y-axis with respect to the static plate.
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公开(公告)号：US20240102174A1
公开(公告)日：2024-03-28
申请号：US18536762
申请日：2023-12-12
发明人： Douglas P. Riemer , Peter F. Ladwig
CPC分类号： C23F1/16 , C09K13/06 , C23F1/02 , G11B5/484 , H05K1/0277 , H05K3/067 , H05K2203/0779
摘要： An etch chemistry solution for treating metallic surfaces in which the etch chemistry solution includes an oxidizing agent and gluconic acid. The etch chemistry solution may also include an oxidizing agent and a short-chained polyethylene polymer glycol or a short-chained polyethylene copolymer glycol. The metallic surfaces are usually used in circuits such as flexible circuits.
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5.发明授权公开(公告)号：US11898264B2
公开(公告)日：2024-02-13
申请号：US17479569
申请日：2021-09-20
摘要： Treatment solutions and methods for improving adhesion of gold electroplating onto metal surfaces are provided herein. More specifically, the disclosure relates to micro-etching stainless steel surfaces using to remove any organic contamination and chromium oxide formed on the surface, neutralize and strip the surface of any iron content, and repassivate the surface with a thin chromium oxide layer, prior to gold electroplating of the stainless steel surfaces.
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公开(公告)号：US11867575B2
公开(公告)日：2024-01-09
申请号：US17587865
申请日：2022-01-28
发明人： Michael W. Davis , Peter F. Ladwig , Matthew S. Lang , Dean E. Myers , Clark T. Olsen , Douglas P. Riemer
CPC分类号： G01L1/2268 , G01L1/146
摘要： A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.
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公开(公告)号：US11682876B2
公开(公告)日：2023-06-20
申请号：US17099373
申请日：2020-11-16
IPC分类号： H01R43/052 , B21F45/00 , B21F23/00 , B21F15/10 , H04N23/68 , G02B7/08 , G02B27/64 , F03G7/06
CPC分类号： H01R43/052 , B21F15/10 , B21F23/00 , B21F45/00 , H04N23/687 , F03G7/065 , G02B7/08 , G02B27/646 , G03B2205/0076
摘要： A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.
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公开(公告)号：US11674235B2
公开(公告)日：2023-06-13
申请号：US16366064
申请日：2019-03-27
发明人： Douglas P. Riemer , Peter F. Ladwig
IPC分类号： C25D3/48 , C25D3/62 , C25D5/04 , C25D5/18 , C25D7/00 , H05K3/18 , H05K1/09 , C25D5/10 , C25D5/00
CPC分类号： C25D7/00 , C25D3/48 , H05K1/09 , H05K3/188 , C25D5/10 , C25D5/623 , H05K2201/0347 , H05K2203/0723
摘要： A method of plating a copper substrate with gold that reduces or eliminates the presence of microvoids at the interface of the gold/copper substrate is described. Suitably, live entry of the substrate into the plating bath is performed with application of external current to the bath such that no portion of the substrate is exposed to the bath for more than one second without the application of the external current. Increase of the applied current for gold strike to the mass-transfer-limit for gold reduction accomplishes the full measure of improvement in eliminating microvoids.
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公开(公告)号：US20230176458A1
公开(公告)日：2023-06-08
申请号：US18103745
申请日：2023-01-31
CPC分类号： G03B17/563 , F03G7/0665 , G02B6/3576 , G02B6/3859 , G03B17/38 , H10N30/00 , H10N30/50 , G03B2205/0061 , G03B2205/0076
摘要： SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
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10.发明授权公开(公告)号：US11441942B2
公开(公告)日：2022-09-13
申请号：US16446506
申请日：2019-06-19
摘要： A radiometer probe for matching a spectral sensitivity of a dry-film resist is provided. The radiometer probe includes a light probe and a filter-diffuser assembly connected to the light probe. The filter-diffuser assembly includes a filter housing configured to receive an optical diffuser positioned on a filter. The optical diffuser and the filter are separated by a spacer.
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