利索-全球专利检索

  1. Login
  2. Sign Up

Search Results

19 records (took 0.011 seconds)

    Electrolytically etching method and apparatus of surface of nuclear reactor core internals
    1.
    发明授权
    Electrolytically etching method and apparatus of surface of nuclear reactor core internals 有权
    核反应堆核心内部表面的电解蚀刻方法和装置

    公开(公告)号：US08647495B2

    公开(公告)日：2014-02-11

    申请号：US12943227

    申请日：2010-11-10

    Applicant: Satoru Aoike ,  Masaaki Tanaka ,  Koichi Kurosawa ,  Shinobu Okido ,  Shinya Ohmori

    Inventor： Satoru Aoike ,  Masaaki Tanaka ,  Koichi Kurosawa ,  Shinobu Okido ,  Shinya Ohmori

    IPC: C25F3/14

    CPC classification number: C25F1/02 ,  C25F7/00 ,  G21C17/01 ,  G21C19/00

    Abstract: Even a site having a complicated curved surface shape, such as a welded spot on a bottom of a nuclear reactor core, is simply and electrolytically etched without discharging an etching liquid in a large amount, whereby grain boundary on the surface of the nuclear reactor core internals can be confirmed visually.When the surface of nuclear reactor core internals is electrolytically etched, a sponge provided with holes having a communicating structure is integrated with an etching liquid, and the etching liquid is gelled, while the integrated combination is disposed in front of an electrode, followed by the application of voltage to turn on electricity at a state in which said electrode is electrically connected to the cathode of a direct-current power supply, and brought into contact with or approximated to the surface of the core internals electrically connected to the anode of the direct-current power supply.

    Abstract translation: 即使是具有复杂曲面形状的部位，例如核反应堆芯的底部的焊接点，也不需要大量排出蚀刻液而进行电解腐蚀，从而核反应堆芯的表面上的晶界 内部可以直观地确认。 当核反应堆核心内表面被电解腐蚀时，具有连通结构的孔的海绵与蚀刻液一体化，并且蚀刻液凝胶化，同时将集成组合设置在电极前面，随后是 在所述电极与直流电源的阴极电连接的状态下施加电压以接通电力，并且与电气连接到直接电源的阳极的芯部内部件的表面接触或接近 - 电源。

    SYSTEMS AND METHODS FOR CLEANING MEDICAL DEVICE ELECTRODES
    3.
    发明申请
    SYSTEMS AND METHODS FOR CLEANING MEDICAL DEVICE ELECTRODES 审中-公开
    清洁医疗器械电极的系统和方法

    公开(公告)号：US20160143694A1

    公开(公告)日：2016-05-26

    申请号：US14877002

    申请日：2015-10-07

    Applicant: St. Jude Medical, Cardiology Division, Inc.

    Inventor： Timothy G. Curran

    IPC: C25F1/02

    CPC classification number: C25F1/02 ,  C25F1/00 ,  C25F7/00

    Abstract: An electrode cleaning system includes a medical device including a plurality of electrodes, a fluid reservoir including an electrolytic solution, and a cleaning device. The cleaning device is electrically coupled to the medical device, and is configured to channel a DC current between at least one pair of electrodes of the plurality of electrodes when the plurality of electrodes are submerged in the fluid reservoir.

    Abstract translation: 电极清洁系统包括包括多个电极的医疗装置，包括电解液的流体储存器和清洁装置。 清洁装置电耦合到医疗装置，并且被配置为当多个电极浸没在流体储存器中时，在多个电极的至少一对电极之间引导直流电流。

    LOW-RATE ELECTROCHEMICAL ETCH OF THIN FILM METALS AND ALLOYS
    4.
    发明申请
    LOW-RATE ELECTROCHEMICAL ETCH OF THIN FILM METALS AND ALLOYS 失效
    薄膜金属和合金的低速电化学蚀刻

    公开(公告)号：US20130048504A1

    公开(公告)日：2013-02-28

    申请号：US13221726

    申请日：2011-08-30

    Applicant: Jose A. Medina ,  Tiffany Yun Wen Jiang ,  Ming Jiang

    Inventor： Jose A. Medina ,  Tiffany Yun Wen Jiang ,  Ming Jiang

    IPC: C25D5/34 ,  C25F3/02

    CPC classification number: C25D5/36 ,  C25D3/12 ,  C25D3/20 ,  C25D5/40 ,  C25F1/02 ,  C25F3/02

    Abstract: Embodiments of the present invention include systems and methods for low-rate electrochemical (wet) etch that use a net cathodic current or potential. In particular, some embodiments achieve controlled etch rates of less than 0.1 nm/s by applying a small net cathodic current to a substrate as the substrate is submerged in an aqueous electrolyte. Depending on the embodiment, the aqueous electrolyte utilized may comprise the same type of cations as the material being etched from the substrate. Some embodiments are useful in etching thin film metals and alloys and fabrication of magnetic head transducer wafers.

    Abstract translation: 本发明的实施例包括使用净阴极电流或电位的低速电化学（湿）蚀刻的系统和方法。 特别地，一些实施例通过在衬底被浸没在含水电解质中时将小的净阴极电流施加到衬底上来实现小于0.1nm / s的受控蚀刻速率。 根据实施例，所使用的水性电解质可以包括与从衬底上蚀刻的材料相同类型的阳离子。 一些实施例在蚀刻薄膜金属和合金以及制造磁头换能器晶片方面是有用的。

    Process for producing environmentally-friendly steel sheet for container material, environmentally-friendly steel sheet for container material, and laminated and pre-coated steel sheet for container material using the same
    9.
    发明授权
    Process for producing environmentally-friendly steel sheet for container material, environmentally-friendly steel sheet for container material, and laminated and pre-coated steel sheet for container material using the same 有权
    用于生产用于容器材料的环保钢板，用于容器材料的环保钢板，以及使用其的容器材料层压和预涂钢板

    公开(公告)号：US09121105B2

    公开(公告)日：2015-09-01

    申请号：US13639322

    申请日：2011-04-06

    Applicant: Nobuo Kadowaki ,  Hironori Nakayama ,  Yuji Abe

    Inventor： Nobuo Kadowaki ,  Hironori Nakayama ,  Yuji Abe

    IPC: C25D5/36 ,  C25D5/34 ,  C25D9/08 ,  C25D3/54 ,  C25F1/02

    CPC classification number: C25D9/08 ,  C25D3/54 ,  C25D5/36 ,  C25F1/02 ,  Y10T428/12611

    Abstract: A method for the cathodic electrocoating of a tin-coated steel sheet in a treatment solution that does not contain any Cr compound, F or nitrite nitrogen. A tin oxide layer that is not subjected to a cathodic electrocoating treatment yet and is arranged on a tin-coated steel sheet is thinned to a specified thickness or less by a cathodic electrocoating treatment in an aqueous solution containing sodium carbonate or sodium hydrogen carbonate or an aqueous sulfuric acid solution immersion treatment, and the tin oxide layer is subjected to a cathodic electrocoating treatment in an aqueous solution of an alkaline metal sulfate containing a zirconium compound having a specified composition. In this manner, a coating film is formed on the tin oxide layer at a specific adhered amount in terms of Zr content.

    Abstract translation: 在不含任何Cr化合物，F或亚硝酸盐氮的处理溶液中的镀锡钢板的阴极电涂覆方法。 未经阴极电涂覆处理而设置在镀锡钢板上的氧化锡层通过阴极电泳处理在含有碳酸钠或碳酸氢钠的水溶液中稀释至规定厚度以下 硫酸水溶液浸渍处理，氧化锡层在含有具有规定组成的锆化合物的碱金属硫酸盐水溶液中进行阴极电泳处理。 以这种方式，在氧化锡层上以特定的附着量以Zr含量形成涂膜。

    Low-rate electrochemical etch of thin film metals and alloys
    10.
    发明授权
    Low-rate electrochemical etch of thin film metals and alloys 失效
    薄膜金属和合金的低速电化学蚀刻

    公开(公告)号：US08524068B2

    公开(公告)日：2013-09-03

    申请号：US13221726

    申请日：2011-08-30

    Applicant: Jose A. Medina ,  Tiffany Yun Wen Jiang ,  Ming Jiang

    Inventor： Jose A. Medina ,  Tiffany Yun Wen Jiang ,  Ming Jiang

    IPC: C25F3/00 ,  C25F3/02

    CPC classification number: C25D5/36 ,  C25D3/12 ,  C25D3/20 ,  C25D5/40 ,  C25F1/02 ,  C25F3/02

    Abstract: Embodiments of the present invention include systems and methods for low-rate electrochemical (wet) etch that use a net cathodic current or potential. In particular, some embodiments achieve controlled etch rates of less than 0.1 nm/s by applying a small net cathodic current to a substrate as the substrate is submerged in an aqueous electrolyte. Depending on the embodiment, the aqueous electrolyte utilized may comprise the same type of cations as the material being etched from the substrate. Some embodiments are useful in etching thin film metals and alloys and fabrication of magnetic head transducer wafers.

    Abstract translation: 本发明的实施例包括使用净阴极电流或电位的低速电化学（湿）蚀刻的系统和方法。 特别地，一些实施例通过在衬底被浸没在含水电解质中时将小的净阴极电流施加到衬底上来实现小于0.1nm / s的受控蚀刻速率。 根据实施例，所使用的水性电解质可以包括与从衬底上蚀刻的材料相同类型的阳离子。 一些实施例在蚀刻薄膜金属和合金以及制造磁头换能器晶片方面是有用的。

Patent Agency Ranking