公开(公告)号：US20100007004A1

公开(公告)日：2010-01-14

申请号：US12501246

申请日：2009-07-10

申请人： Hsiao Chuan CHANG ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Ho Ming Tong ,  Jian cheng Chen ,  Wei Chi Yih ,  Chang Ying Hung ,  Cheng Wei Huang ,  Chih Hsing Chen ,  Tai Yuan Huang ,  Chieh Ting Chen ,  Yi Tsai Lu

发明人： Hsiao Chuan CHANG ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Ho Ming Tong ,  Jian cheng Chen ,  Wei Chi Yih ,  Chang Ying Hung ,  Cheng Wei Huang ,  Chih Hsing Chen ,  Tai Yuan Huang ,  Chieh Ting Chen ,  Yi Tsai Lu

IPC分类号： H01L23/482 ,  H01L23/485

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05017 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05169 ,  H01L2224/05556 ,  H01L2224/05557 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05618 ,  H01L2224/05623 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05649 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05672 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48507 ,  H01L2224/48609 ,  H01L2224/48611 ,  H01L2224/48618 ,  H01L2224/48623 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48649 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48666 ,  H01L2224/48669 ,  H01L2224/48672 ,  H01L2224/48809 ,  H01L2224/48818 ,  H01L2224/48823 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48849 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/48866 ,  H01L2224/48872 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/85375 ,  H01L2224/8581 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/00 ,  H01L2224/48811 ,  H01L2224/48869 ,  H01L2924/00012

摘要： A wafer defines a plurality of chips arranged in array manner. Each chip includes at least one aluminum pad and a middle material. The middle material covers the aluminum pad and is mounted on the aluminum pad.

摘要翻译： 晶片限定以阵列方式布置的多个芯片。 每个芯片包括至少一个铝焊盘和中间材料。 中间材料覆盖铝垫，并安装在铝垫上。

公开(公告)号：US08110931B2

公开(公告)日：2012-02-07

申请号：US12501246

申请日：2009-07-10

申请人： Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Ho Ming Tong ,  Jian Cheng Chen ,  Wei Chi Yih ,  Chang Ying Hung ,  Cheng Wei Huang ,  Chih Hsing Chen ,  Tai Yuan Huang ,  Chieh Ting Chen ,  Yi Tsai Lu

发明人： Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Ho Ming Tong ,  Jian Cheng Chen ,  Wei Chi Yih ,  Chang Ying Hung ,  Cheng Wei Huang ,  Chih Hsing Chen ,  Tai Yuan Huang ,  Chieh Ting Chen ,  Yi Tsai Lu

IPC分类号： H01L23/48

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05017 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05169 ,  H01L2224/05556 ,  H01L2224/05557 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05618 ,  H01L2224/05623 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05649 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05672 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48507 ,  H01L2224/48609 ,  H01L2224/48611 ,  H01L2224/48618 ,  H01L2224/48623 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48649 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48666 ,  H01L2224/48669 ,  H01L2224/48672 ,  H01L2224/48809 ,  H01L2224/48818 ,  H01L2224/48823 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48849 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/48866 ,  H01L2224/48872 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/85375 ,  H01L2224/8581 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/00 ,  H01L2224/48811 ,  H01L2224/48869 ,  H01L2924/00012

摘要： A wafer defines a plurality of chips arranged in array manner. Each chip includes at least one aluminum pad and a middle material. The middle material covers the aluminum pad and is mounted on the aluminum pad.

摘要翻译： 晶片限定以阵列方式布置的多个芯片。 每个芯片包括至少一个铝焊盘和中间材料。 中间材料覆盖铝垫，并安装在铝垫上。