-
公开(公告)号:US08500474B2
公开(公告)日:2013-08-06
申请号:US13206422
申请日:2011-08-09
IPC分类号: H01R13/15
CPC分类号: H01R12/853 , G01R1/0491
摘要: A wiring analyzer system with a zero-insertion-force (ZIF) connector/receiver interface. An electrical connection is made by inserting a male connector into a female receiver slot. During insertion into the female receiver slot, the male connector experiences minimal, if any, resistive force. The female receiver comprises a set of opposing spring contacts designed to pinch both sides of the wafer, making contact with the male connector. A pair of elongated plates has several sections cut out to correspond with each female slot such that when the male connector is inserted between the spring contacts the wafer passes through both plates. In order to create the necessary pinching action, a force is exerted on the plates, causing them to move a distance in opposite directions. This motion brings the plates into contact with the spring contacts, squeezing them together against the wafer and creating a firm contact.
摘要翻译: 具有零插入力(ZIF)连接器/接收器接口的接线分析仪系统。 通过将公连接器插入母接收器插槽来进行电连接。 在插入母接收器插槽中时,阳连接器经受最小(如果有的话)阻力。 阴接收器包括一组相对的弹簧触点,设计成夹紧晶片的两侧,与阳连接器接触。 一对细长板具有切割成与每个凹槽对应的多个部分,使得当阳连接器插入在弹簧触头之间时,晶片通过两个板。 为了产生必要的夹紧动作,在板上施加力,使其沿相反的方向移动一定距离。 这种运动使板与弹簧触点接触,将它们一起挤压在晶片上并产生牢固的接触。
-
公开(公告)号:US07169646B2
公开(公告)日:2007-01-30
申请号:US11237090
申请日:2005-09-27
申请人: Benjamin N. Eldridge
发明人: Benjamin N. Eldridge
IPC分类号: H01L21/44
CPC分类号: G01R1/0466 , G01R1/06711 , G01R1/07307 , G01R1/07342 , G01R1/07378 , G01R31/2886 , H01L21/67005 , H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/0508 , H01L2224/051 , H01L2224/05568 , H01L2224/05569 , H01L2224/056 , H01L2224/13 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/3025 , H01R12/57 , H01R12/714 , H01R12/853 , H01R13/2407 , H05K3/303 , H05K3/325 , H05K3/4092 , H05K2201/10568 , H05K2201/2036 , Y10S439/948 , H01L2924/00 , H01L2924/00014
摘要: Interconnect assemblies and methods for forming and using them. In one example of the invention, an interconnect assembly comprises a substrate, a resilient contact element and a stop structure. The resilient contact element is disposed on the substrate and has at least a portion thereof which is capable of moving to a first position, which is defined by the stop structure, in which the resilient contact element is in mechanical and electrical contact with another contact element. In another example of the invention, a stop structure is disposed on a first substrate with a first contact element, and this stop structure defines a first position of a resilient contact element, disposed on a second substrate, in which the resilient contact element is in mechanical and electrical contact with the first contact element. The stop structure may be formed as a sheet with openings and applied to an unsingulated semiconductor wafer with resilient contacts located in the openings.
摘要翻译: 互连组件和形成和使用它们的方法。 在本发明的一个示例中,互连组件包括基板,弹性接触元件和止动结构。 弹性接触元件设置在基板上并具有至少一部分能够移动到由止动结构限定的第一位置,其中弹性接触元件与另一个接触元件机械地和电接触 。 在本发明的另一个例子中,止动结构设置在具有第一接触元件的第一基板上,该止动结构限定弹性接触元件的第一位置,该第一位置设置在第二基板上,弹性接触元件位于其中 与第一接触元件机械和电接触。 止动结构可以形成为具有开口的片材,并且被施加到位于开口中的具有弹性接触点的未起伏半导体晶片。
-
公开(公告)号:US06948941B2
公开(公告)日:2005-09-27
申请号:US10735226
申请日:2003-12-12
申请人: Benjamin N. Eldridge
发明人: Benjamin N. Eldridge
IPC分类号: G01R31/26 , G01R1/04 , G01R1/067 , G01R1/073 , G01R31/28 , H01L21/60 , H01L21/66 , H01R12/57 , H01R12/71 , H01R12/85 , H05K1/14 , H05K3/30 , H05K3/32 , H05K3/36 , H05K3/40 , H01R12/00
CPC分类号: G01R1/0466 , G01R1/06711 , G01R1/07307 , G01R1/07342 , G01R1/07378 , G01R31/2886 , H01L21/67005 , H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/0508 , H01L2224/051 , H01L2224/05568 , H01L2224/05569 , H01L2224/056 , H01L2224/13 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/3025 , H01R12/57 , H01R12/714 , H01R12/853 , H01R13/2407 , H05K3/303 , H05K3/325 , H05K3/4092 , H05K2201/10568 , H05K2201/2036 , Y10S439/948 , H01L2924/00 , H01L2924/00014
摘要: Interconnect assemblies and methods for forming and using them. In one example of the invention, an interconnect assembly comprises a substrate, a resilient contact element and a stop structure. The resilient contact element is disposed on the substrate and has at least a portion thereof which is capable of moving to a first position, which is defined by the stop structure, in which the resilient contact element is in mechanical and electrical contact with another contact element. In another example of the invention, a stop structure is disposed on a first substrate with a first contact element, and this stop structure defines a first position of a resilient contact element, disposed on a second substrate, in which the resilient contact element is in mechanical and electrical contact with the first contact element. Other aspects of the invention include methods of forming the stop structure and using the structure to perform testing of integrated circuits, including for example a semiconductor wafer of integrated circuits. A sheet with an opening for each resilient contact element may be used as the stop structure.
摘要翻译: 互连组件和形成和使用它们的方法。 在本发明的一个示例中,互连组件包括基板,弹性接触元件和止动结构。 弹性接触元件设置在基板上并具有至少一部分能够移动到由止动结构限定的第一位置,其中弹性接触元件与另一个接触元件机械地和电接触 。 在本发明的另一个例子中,止动结构设置在具有第一接触元件的第一基板上,该止动结构限定弹性接触元件的第一位置,该第一位置设置在第二基板上,弹性接触元件位于其中 与第一接触元件机械和电接触。 本发明的其他方面包括形成停止结构并使用该结构来执行集成电路的测试的方法,所述集成电路包括例如集成电路的半导体晶片。 可以使用具有用于每个弹性接触元件的开口的片材作为止动结构。
-
公开(公告)号:US5102343A
公开(公告)日:1992-04-07
申请号:US658941
申请日:1991-02-22
CPC分类号: H01R12/853
摘要: An electrical connector which utilizes fluid pressure to interconnect two electrical circuit members (e.g., a circuit module and a printed circuit board) in a sound and effective manner. In one embodiment, two flexible circuits are brought together using two expandable bladders which are located within a housing located between the circuit members. When expanded, the bladders engage the flexible circuits and cause these to move toward each other such that arrays of contacts become engaged. In another embodiment, a singular flexible circuit and operatively connected bladder are used such that expansion of the bladder causes separate arrays of contacts on the flexible circuit to move toward and engage respective circuitry on the circuit members.
摘要翻译: 一种以声音和有效的方式利用流体压力来互连两个电路元件(例如电路模块和印刷电路板)的电连接器。 在一个实施例中,使用位于电路构件之间的壳体内的两个可膨胀气囊将两个柔性电路组合在一起。 当膨胀时,气囊接合柔性电路并使它们朝向彼此移动,使得触点阵列接合。 在另一个实施例中,使用单个柔性电路和可操作地连接的气囊,使得气囊的膨胀在柔性电路上引起分开的触点阵列,以朝向和接合电路构件上的各个电路。
-
公开(公告)号:US4429454A
公开(公告)日:1984-02-07
申请号:US362948
申请日:1982-03-29
申请人: Alfred P. Broyer , David R. Dines
发明人: Alfred P. Broyer , David R. Dines
CPC分类号: H01R12/88 , H01R12/853 , H01R43/26 , Y10T29/4913 , Y10T29/53209
摘要: A connector (13) having two banks of terminals (16 and 17) is seated in a nest (27) located in a terminal spreading apparatus. A first spreader (36-37) overlies the first bank of terminals (17). A printed circuit board (10) with edge contact pads (12) is advanced along ways (98 and 99) to engage a roller (107) which thrusts a slide (48) toward the nest and then upwardly to move a second spreader (41-42) to engage and spread the banks of terminals (16 and 17). The connector body (14) tilts in the nest (27) to distribute the terminal spreading forces between the two banks of terminals.
摘要翻译: 具有两组端子(16和17)的连接器(13)位于位于端子扩展装置中的嵌套(27)中。 第一吊架(36-37)覆盖在第一组端子(17)上。 具有边缘接触焊盘(12)的印刷电路板(10)沿着方向(98和99)前进,以接合将滑动件(48)推向嵌套的辊(107),然后向上移动第二扩展器(41 -42)开展和扩大码头银行(16和17)。 连接器主体(14)在嵌座(27)中倾斜以在两组端子之间分配端子铺展力。
-
公开(公告)号:US20040127074A1
公开(公告)日:2004-07-01
申请号:US10735226
申请日:2003-12-12
申请人: FormFactor, Inc.
发明人: Benjamin N. Eldridge
IPC分类号: H01R012/00
CPC分类号: G01R1/0466 , G01R1/06711 , G01R1/07307 , G01R1/07342 , G01R1/07378 , G01R31/2886 , H01L21/67005 , H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/0508 , H01L2224/051 , H01L2224/05568 , H01L2224/05569 , H01L2224/056 , H01L2224/13 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/3025 , H01R12/57 , H01R12/714 , H01R12/853 , H01R13/2407 , H05K3/303 , H05K3/325 , H05K3/4092 , H05K2201/10568 , H05K2201/2036 , Y10S439/948 , H01L2924/00 , H01L2924/00014
摘要: Interconnect assemblies and methods for forming and using them. In one example of the invention, an interconnect assembly comprises a substrate, a resilient contact element and a stop structure. The resilient contact element is disposed on the substrate and has at least a portion thereof which is capable of moving to a first position, which is defined by the stop structure, in which the resilient contact element is in mechanical and electrical contact with another contact element. In another example of the invention, a stop structure is disposed on a first substrate with a first contact element, and this stop structure defines a first position of a resilient contact element, disposed on a second substrate, in which the resilient contact element is in mechanical and electrical contact with the first contact element. Other aspects of the invention include methods of forming the stop structure and using the structure to perform testing of integrated circuits, including for example a semiconductor wafer of integrated circuits.
摘要翻译: 互连组件和形成和使用它们的方法。 在本发明的一个示例中,互连组件包括基板,弹性接触元件和止动结构。 弹性接触元件设置在基板上并具有至少一部分能够移动到由止动结构限定的第一位置,其中弹性接触元件与另一个接触元件机械地和电接触 。 在本发明的另一个例子中,止动结构设置在具有第一接触元件的第一基板上,该止动结构限定弹性接触元件的第一位置,该第一位置设置在第二基板上,弹性接触元件位于其中 与第一接触元件机械和电接触。 本发明的其他方面包括形成停止结构并使用该结构来执行集成电路的测试的方法,所述集成电路包括例如集成电路的半导体晶片。
-
公开(公告)号:US20010012704A1
公开(公告)日:2001-08-09
申请号:US09114586
申请日:1998-07-13
发明人: BENJAMIN N. ELDRIDGE
IPC分类号: H05K001/00
CPC分类号: G01R1/0466 , G01R1/06711 , G01R1/07307 , G01R1/07342 , G01R1/07378 , G01R31/2886 , H01L21/67005 , H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/0508 , H01L2224/051 , H01L2224/05568 , H01L2224/05569 , H01L2224/056 , H01L2224/13 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/3025 , H01R12/57 , H01R12/714 , H01R12/853 , H01R13/2407 , H05K3/303 , H05K3/325 , H05K3/4092 , H05K2201/10568 , H05K2201/2036 , Y10S439/948 , H01L2924/00 , H01L2924/00014
摘要: Interconnect assemblies and methods for forming and using them. In one example of the invention, an interconnect assembly comprises a substrate, a resilient contact element and a stop structure. The resilient contact element is disposed on the substrate and has at least a portion thereof which is capable of moving to a first position, which is defined by the stop structure, in which the resilient contact element is in mechanical and electrical contact with another contact element. In another example of the invention, a stop structure is disposed on a first substrate with a first contact element, and this stop structure defines a first position of a resilient contact element, disposed on a second substrate, in which the resilient contact element is in mechanical and electrical contact with the first contact element. Other aspects of the invention include methods of forming the stop structure and using the structure to perform testing of integrated circuits, including for example a semiconductor wafer of integrated circuits.
摘要翻译: 互连组件和形成和使用它们的方法。 在本发明的一个示例中,互连组件包括基板,弹性接触元件和止动结构。 弹性接触元件设置在基板上并具有至少一部分能够移动到由止动结构限定的第一位置,其中弹性接触元件与另一个接触元件机械地和电接触 。 在本发明的另一个例子中,止动结构设置在具有第一接触元件的第一基板上,该止动结构限定弹性接触元件的第一位置,该第一位置设置在第二基板上,弹性接触元件位于其中 与第一接触元件机械和电接触。 本发明的其他方面包括形成停止结构并使用该结构来执行集成电路的测试的方法,所述集成电路包括例如集成电路的半导体晶片。
-
公开(公告)号:US5181853A
公开(公告)日:1993-01-26
申请号:US666159
申请日:1991-03-07
IPC分类号: H01R12/61 , H01R13/193 , H01R13/637 , H05K3/32 , H05K3/36
CPC分类号: H01R12/78 , H01R13/193 , H01R12/79 , H01R12/82 , H01R12/853 , H05K3/325 , H05K3/361
摘要: An electrical connector wherein fluid pressure (pneumatics or hydraulics) is used to actuate an expandable bladder located within the housing of the connector to exert force against two flexible circuit members also located substantially within the connector's housing to cause these members to move toward each other and for highly dense arrays of electrical contacts thereon to engage each other in a predetermined manner. A first alignment means (e.g., pin and corresponding aperture) is used to provide initial alignment of the two flexible circuit members perior to contact being made. Once such contact occurs, and the expandable bladder is expanded further, the bladder is able to provide additional alignment for the engaged contacts so as to prevent movement thereof relative to each other. Such precise alignment is critical in highly dense arrays of large numbers of small contacts as required in many of today's information handling systems (computers). In another embodiment of the invention, the two flexible circuit members are actuated to contact arrays of contacts located on the surfaces of a circuit board located within the connector housing between the two flexible circuits. Once connection is initially made, and expansion of the expandable bladders continues, movement of the engaged flexible circuit electrical contacts is substantially prevented, thus assuring precisioned alignment between these contacts in the overall connector assembly. To prevent abrasion of the expandable bladder during actuation thereof, an interface member (e.g., a thin layer of polyimide) is used between the bladder and flexible circuit members, the interface having a smooth, abrasion resistant surface for this purpose.
摘要翻译: 一种电连接器,其中使用流体压力(气动或液压)来驱动位于连接器的壳体内的可膨胀囊,以对两个基本上位于连接器壳体内的柔性电路构件施加力,以使这些构件朝向彼此移动, 用于高密度的电接触阵列以预定的方式彼此接合。 使用第一对准装置(例如,销和对应的孔)来提供两个柔性电路构件对于接触的初始对准。 一旦发生这样的接触,并且可膨胀气囊进一步膨胀,则气囊能够为接合的触点提供额外的对准,以防止其相对于彼此的移动。 如今许多信息处理系统(计算机)中所要求的,这种精确对准在大量小接触的高密度阵列中是至关重要的。 在本发明的另一个实施例中,两个柔性电路构件被致动以接触位于位于两个柔性电路之间的连接器壳体内的电路板的表面上的触点阵列。 一旦开始进行连接,并且可扩展的气囊的膨胀继续,则基本上防止了接合的柔性电路电触点的移动,从而确保了整个连接器组件中的这些触点之间的精确对准。 为了防止可膨胀气囊在其致动期间的磨损,在气囊和柔性电路构件之间使用界面构件(例如,聚酰亚胺薄层),为了此目的,界面具有光滑的耐磨表面。
-
公开(公告)号:US5123852A
公开(公告)日:1992-06-23
申请号:US702258
申请日:1991-05-17
申请人: John B. Gillett
发明人: John B. Gillett
CPC分类号: H01R13/2414 , H01R12/853
摘要: A flexible film-type modular connector comprising a fixed block and a movable wedge-shaped block which is received within a V-shaped opening formed in the fixed block. The oblique angle at which contact is made between the fixed and movable blocks provides relative contact wipe and consistently reliable registration between the blocks while maintaining high contact normal force with low applied forces (i.e. zero insertion force). The oblique angle can be individually tailored to meet particular requirements as the connector is capable of connecting a variety of different components including cables, Printed Circuit Boards, Printed Circuit Cards, and other substrates.
-
公开(公告)号:US4421372A
公开(公告)日:1983-12-20
申请号:US048282
申请日:1979-06-13
申请人: Raymond Golden
发明人: Raymond Golden
CPC分类号: H01R12/82 , H01R12/7005 , H01R12/853
摘要: A mechanism for the insertion into and withdrawal from a support structure of a circuit board having an array of male contacts mounted along a lateral edge for engagement with a mating array of female contacts in a zero insertion force connector mounted in the support structure. Means are provided whereby the female contacts must be locked in an expanded position before a circuit board can be inserted into or removed from the support structure.
摘要翻译: 用于插入和退出电路板的支撑结构的机构,该电路板具有沿着侧边缘安装的阳触头阵列,用于与安装在支撑结构中的零插入力连接器中的阴触头的匹配阵列接合。 提供装置,由此,在将电路板插入支撑结构或从支撑结构移除之前,阴触头必须被锁定在扩张位置。
-
-
-
-
-
-
-
-
-