公开(公告)号：US20180342842A1

公开(公告)日：2018-11-29

申请号：US15953533

申请日：2018-04-16

申请人： OMRON Corporation

发明人： Yohei TSUKANAKA ,  Hiroyasu MASAGO

IPC分类号： H01R13/71 ,  H01R13/629 ,  H01R13/70

CPC分类号： H01R13/71 ,  H01R12/72 ,  H01R13/05 ,  H01R13/26 ,  H01R13/62927 ,  H01R13/701 ,  H01R23/6813 ,  H01R23/6833

摘要： A contact substrate is moved to cause a connection terminal and a connection terminal to slide on the contact substrate to change the contact state of the connection terminal and the connection terminal to a first slide contact and to a second slide contact. This switches the electrical connection/disconnection between the connection terminal and the connection terminal.

公开(公告)号：US20140242846A1

公开(公告)日：2014-08-28

申请号：US14186041

申请日：2014-02-21

申请人： FUJITSU LIMITED ,  FUJITSU COMPONENT LIMITED

发明人： Yasuyuki Miki ,  Mitsuru Kobayashi ,  Takatoshi Yagisawa

IPC分类号： H01R12/79

CPC分类号： H01R12/79 ,  H01R12/721 ,  H01R12/88 ,  H01R23/6813

摘要： A connector to be mounted on a board and connect a connection object to the board includes a housing into which the connection object is inserted through an insertion slot and multiple contacts each of which comes into contact with the connection object and the board. Each of the contacts includes a movable contact that comes into contact with a first surface of the connection object, a fixed contact that comes into contact with the board and includes fixing portions for fixing the fixed contact to the housing, and a connecting part that connects the movable contact and the fixed contact. Each of the fixing portions branches and projects from a signal transmission line provided between the connection object and the board. The movable contact is rotatable relative to the fixed contact.

摘要翻译： 要安装在板上并将连接对象连接到板的连接器包括壳体，连接对象通过插入槽插入该壳体中，并且每个触点与连接对象和板接触。 每个触点包括与连接对象的第一表面接触的可动触点，与板接触的固定触点，并且包括用于将固定触头固定到外壳的固定部分，以及连接部分 可动触点和固定触点。 每个固定部分从设置在连接对象和板之间的信号传输线分支和突出。 可动触头可相对于固定触点旋转。

公开(公告)号：US09093767B2

公开(公告)日：2015-07-28

申请号：US13879883

申请日：2011-11-29

申请人： James Rathburn

发明人： James Rathburn

IPC分类号： H01R31/06 ,  H01R13/24 ,  H05K3/32 ,  H05K3/40 ,  H05K7/10 ,  H05K3/10 ,  H05K3/12 ,  H05K1/14

CPC分类号： H01R23/6813 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01R12/73 ,  H01R12/82 ,  H01R13/2457 ,  H01R13/2485 ,  H01R31/06 ,  H05K1/092 ,  H05K1/111 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0094 ,  H05K3/10 ,  H05K3/1291 ,  H05K3/326 ,  H05K3/363 ,  H05K3/365 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/425 ,  H05K3/4694 ,  H05K7/1076 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09381 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2201/10386 ,  H05K2201/2072 ,  H05K2201/209 ,  H05K2203/041 ,  H05K2203/1476 ,  Y10T29/49165 ,  H01L2224/45099 ,  H01L2924/00

摘要： A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. The electrical interconnect includes a socket substrate with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality of electrically conductive contact tabs are bonded to the first surface of the socket substrate so that contact tips on the contact tabs extend into the openings. The contact tips electrically couple with the BGA device when the solder balls are positioned in the openings. Vias are located in the openings that electrically couple the contact tabs to contact pads located proximate the second surface of the socket substrate. Solder balls are bonded to the contact pad that are adapted to electrically and mechanically couple the electrical interconnect to the PCB.

摘要翻译： 适于在BGA器件上的焊球和PCB之间提供界面的表面贴装电互连。 电互连包括具有第一表面，第二表面和多个开口的插座基板，其尺寸和构造用于接收BGA器件上的焊球。 多个导电接触片接合到插座衬底的第一表面，使得接触片上的接触尖端延伸到开口中。 当焊球定位在开口中时，接触尖端与BGA器件电耦合。 通孔位于开口中，其将接触片电耦合到位于插座衬底的第二表面附近的接触垫。 焊球被接合到接触焊盘上，适于电连接和机械地将电互连件耦合到PCB。

公开(公告)号：US09350124B2

公开(公告)日：2016-05-24

申请号：US14408039

申请日：2013-03-13

申请人： HSIO TECHNOLOGIES, LLC

发明人： James Rathburn

IPC分类号： H01R12/68 ,  H01R12/50 ,  H01R13/24 ,  H01R12/82 ,  H05K3/36 ,  H05K3/40 ,  H01R12/73 ,  H01L23/00 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

CPC分类号： H01R23/6813 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01R12/73 ,  H01R12/82 ,  H01R13/2457 ,  H01R13/2485 ,  H01R31/06 ,  H05K1/092 ,  H05K1/111 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0094 ,  H05K3/10 ,  H05K3/1291 ,  H05K3/326 ,  H05K3/363 ,  H05K3/365 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/425 ,  H05K3/4694 ,  H05K7/1076 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09381 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2201/10386 ,  H05K2201/2072 ,  H05K2201/209 ,  H05K2203/041 ,  H05K2203/1476 ,  Y10T29/49165 ,  H01L2224/45099 ,  H01L2924/00

摘要： A method of making an array of integral terminals on a circuit assembly. The method includes the steps of depositing at least a first liquid dielectric layer on the first surface of a first circuit member, imaged to include a plurality of first recesses corresponding to the array of integral terminals. The selected surfaces of the first recesses are processed to accept electro-less conductive plating deposition. Electro-lessly plating is applied to the selected surfaces of the first recesses to create a plurality of first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. Electro-plating is applied to the electro-less plating to substantially first recesses with a conductive material. The steps of depositing, processing, electro-less plating, and electro-plating are repeated to form the integral terminals of a desired shape. The dielectric layers are removed to expose the terminals.

摘要翻译： 一种在电路组件上制成集成端子阵列的方法。 该方法包括以下步骤：在第一电路构件的第一表面上沉积至少第一液体电介质层，成像为包括与集成端子阵列相对应的多个第一凹部。 处理第一凹槽的选定表面以接受无电导电电镀沉积。 对所述第一凹槽的所选择的表面施加无电镀以产生电耦合到所述第一电路层并且大致垂直于所述第一电路层延伸的多个第一导电结构。 使用导电材料将电镀施加到基本上第一凹部的无电镀。 重复沉积，加工，无电镀和电镀的步骤以形成所需形状的整体端子。 去除电介质层以露出端子。

公开(公告)号：US09099822B2

公开(公告)日：2015-08-04

申请号：US14186041

申请日：2014-02-21

申请人： FUJITSU COMPONENT LIMITED ,  FUJITSU LIMITED

发明人： Yasuyuki Miki ,  Mitsuru Kobayashi ,  Takatoshi Yagisawa

IPC分类号： H01R13/62 ,  H01R12/79 ,  H01R12/50 ,  H01R12/88 ,  H01R12/72

CPC分类号： H01R12/79 ,  H01R12/721 ,  H01R12/88 ,  H01R23/6813

摘要： A connector to be mounted on a board and connect a connection object to the board includes a housing into which the connection object is inserted through an insertion slot and multiple contacts each of which comes into contact with the connection object and the board. Each of the contacts includes a movable contact that comes into contact with a first surface of the connection object, a fixed contact that comes into contact with the board and includes fixing portions for fixing the fixed contact to the housing, and a connecting part that connects the movable contact and the fixed contact. Each of the fixing portions branches and projects from a signal transmission line provided between the connection object and the board. The movable contact is rotatable relative to the fixed contact.

摘要翻译： 要安装在板上并将连接对象连接到板的连接器包括壳体，连接对象通过插入槽插入该壳体中，并且每个触点与连接对象和板接触。 每个触点包括与连接对象的第一表面接触的可动触点，与板接触的固定触点，并且包括用于将固定触头固定到外壳的固定部分，以及连接部分 可动触点和固定触点。 每个固定部分从设置在连接对象和板之间的信号传输线分支和突出。 可动触头可相对于固定触点旋转。

公开(公告)号：US20150136467A1

公开(公告)日：2015-05-21

申请号：US14408039

申请日：2013-03-13

申请人： HSIO TECHNOLOGIES, LLC

发明人： James Rathburn

IPC分类号： H01R12/77 ,  H01R12/82 ,  H01R12/79

CPC分类号： H01R23/6813 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01R12/73 ,  H01R12/82 ,  H01R13/2457 ,  H01R13/2485 ,  H01R31/06 ,  H05K1/092 ,  H05K1/111 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0094 ,  H05K3/10 ,  H05K3/1291 ,  H05K3/326 ,  H05K3/363 ,  H05K3/365 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/425 ,  H05K3/4694 ,  H05K7/1076 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09381 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2201/10386 ,  H05K2201/2072 ,  H05K2201/209 ,  H05K2203/041 ,  H05K2203/1476 ,  Y10T29/49165 ,  H01L2224/45099 ,  H01L2924/00

摘要： A method of making an array of integral terminals on a circuit assembly. The method includes the steps of depositing at least a first liquid dielectric layer on the first surface of a first circuit member, imaged to include a plurality of first recesses corresponding to the array of integral terminals. The selected surfaces of the first recesses are processed to accept electro-less conductive plating deposition. Electro-lessly plating is applied to the selected surfaces of the first recesses to create a plurality of first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. Electro-plating is applied to the electro-less plating to substantially first recesses with a conductive material. The steps of depositing, processing, electro-less plating, and electro-plating are repeated to form the integral terminals of a desired shape. The dielectric layers are removed to expose the terminals.

摘要翻译： 一种在电路组件上制成集成端子阵列的方法。 该方法包括以下步骤：在第一电路构件的第一表面上沉积至少第一液体电介质层，成像为包括与集成端子阵列相对应的多个第一凹部。 处理第一凹槽的选定表面以接受无电导电电镀沉积。 对所述第一凹槽的所选择的表面施加无电镀以产生电耦合到所述第一电路层并且大致垂直于所述第一电路层延伸的多个第一导电结构。 使用导电材料将电镀施加到基本上第一凹部的无电镀。 重复沉积，加工，无电镀和电镀的步骤以形成所需形状的整体端子。 去除电介质层以露出端子。

公开(公告)号：US20130244490A1

公开(公告)日：2013-09-19

申请号：US13879883

申请日：2011-11-29

申请人： James Rathburn

发明人： James Rathburn

IPC分类号： H01R31/06 ,  H05K3/12 ,  H05K3/10

CPC分类号： H01R23/6813 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01R12/73 ,  H01R12/82 ,  H01R13/2457 ,  H01R13/2485 ,  H01R31/06 ,  H05K1/092 ,  H05K1/111 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0094 ,  H05K3/10 ,  H05K3/1291 ,  H05K3/326 ,  H05K3/363 ,  H05K3/365 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/425 ,  H05K3/4694 ,  H05K7/1076 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09381 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2201/10386 ,  H05K2201/2072 ,  H05K2201/209 ,  H05K2203/041 ,  H05K2203/1476 ,  Y10T29/49165 ,  H01L2224/45099 ,  H01L2924/00

摘要： A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. The electrical interconnect includes a socket substrate with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality of electrically conductive contact tabs are bonded to the first surface of the socket substrate so that contact tips on the contact tabs extend into the openings. The contact tips electrically couple with the BGA device when the solder balls are positioned in the openings. Vias are located in the openings that electrically couple the contact tabs to contact pads located proximate the second surface of the socket substrate. Solder balls are bonded to the contact pad that are adapted to electrically and mechanically couple the electrical interconnect to the PCB.

摘要翻译： 适于在BGA器件上的焊球和PCB之间提供界面的表面贴装电互连。 电互连包括具有第一表面，第二表面和多个开口的插座基板，其尺寸和构造用于接收BGA器件上的焊球。 多个导电接触片接合到插座衬底的第一表面，使得接触片上的接触尖端延伸到开口中。 当焊球定位在开口中时，接触尖端与BGA器件电耦合。 通孔位于开口中，其将接触片电耦合到位于插座衬底的第二表面附近的接触垫。 焊球被接合到接触焊盘上，适于电连接和机械地将电互连件耦合到PCB。