Aqueous inkjet ink compositions and ink sets

    公开(公告)号:US10513622B2

    公开(公告)日:2019-12-24

    申请号:US15729736

    申请日:2017-10-11

    IPC分类号: C09D11/00 C09D11/30 C09D11/40

    摘要: Individual aqueous inks or inks in ink sets haves a non-crosslinked, crosslinkable polyurethane having an acid number of 20-40 and is derived from an aromatic diisocyanate; and a diol mixture of D1 and D2 diols, and optionally including D3 diol, D4 diol, or both D3 and D4 diols. D1 has a C3 to C7 aliphatic group and a pendant carboxy group or neutralized carboxy group. D2 has a chain of repeating C2 to C6 alkylene oxide groups. D3 is an alkoxylated bisphenol A or an aliphatic cyclic diol, present at least 5 mol %. D4 is a hydroxy-terminated polybutadiene having a molecular weight of at least 1000 and is present in an amount of 0.1-5 mol %. The ink also contains a dispersed pigment colorant; a humectant or organic co-solvent, and optionally, a crosslinking agent.

    SILVER-CONTAINING COMPOSITIONS CONTAINING REACTIVE POLYMERS
    5.
    发明申请
    SILVER-CONTAINING COMPOSITIONS CONTAINING REACTIVE POLYMERS 有权
    含有反应性聚合物的含银组合物

    公开(公告)号:US20160274460A1

    公开(公告)日:2016-09-22

    申请号:US14661235

    申请日:2015-03-18

    IPC分类号: G03F7/06

    摘要: Silver-containing compositions contain a water-soluble complex of a reactive polymer with either reducible silver ions or silver nanoparticles, the reactive polymer comprising: (a) greater than 1 mol % of recurring units comprising sulfonic acid or sulfonate groups, (b) at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally (c) at least mol % of recurring units comprising a pendant amide, hydroxyl, lactam, phosphoric acid, or carboxylic acid group, all amounts based on the total recurring units in the reactive polymer. Other silver-containing compositions contain a water-insoluble complex of a reacted polymer with either reducible silver ions or silver nanoparticles. The reacted polymers are derived from the reactive polymers.

    摘要翻译: 含银组合物含有反应性聚合物与可还原银离子或银纳米颗粒的水溶性络合物,反应性聚合物包含:(a)大于1mol%的包含磺酸或磺酸盐基团的重复单元,(b) 至少5摩尔%的包含能够通过[2 + 2]光环加成交联的侧基的重复单元,以及任选地(c)至少含有酰胺,羟基,内酰胺,磷酸或羧酸基团的重复单元的摩尔% ,基于反应性聚合物中的总重复单元的所有量。 其它含银组合物含有反应聚合物与可还原银离子或银纳米颗粒的水不溶性络合物。 反应的聚合物衍生自反应性聚合物。

    ELECTROLESS PLATING METHOD USING BLEACHING
    6.
    发明申请
    ELECTROLESS PLATING METHOD USING BLEACHING 有权
    使用漂白的电镀方法

    公开(公告)号:US20150125787A1

    公开(公告)日:2015-05-07

    申请号:US14071951

    申请日:2013-11-05

    IPC分类号: G03F7/16

    摘要: A conductive pattern can be formed a reactive polymer comprising pendant tertiary alkyl ester groups, (b) a compound that provides an acid upon exposure to radiation, (c) a crosslinking agent that is capable of reacting in the presence of the acid, and (d) optionally, a photosensitizer. The polymeric layer is patternwise exposed to provide non-exposed regions and exposed regions comprising a polymer comprising carboxylic acid groups. Both the non-exposed regions and the exposed regions of the polymeric layer are contacted with a reducing agent, bleached to remove surface amounts of the reducing agent in both non-exposed and exposed regions of the polymeric layer, and contacted with electroless seed metal ions to oxidize the reducing agent and to form corresponding electroless seed metal nuclei in the exposed regions. The corresponding electroless seed metal nuclei are then electrolessly plated with a conductive metal.

    摘要翻译: 可以形成导电图案,该反应性聚合物包括叔烷基酯基团,(b)暴露于辐射时提供酸的化合物,(c)能够在酸存在下反应的交联剂和( d)任选的光敏剂。 聚合物层被图案化地暴露以提供非暴露区域和包含包含羧酸基团的聚合物的暴露区域。 未曝光区域和聚合物层的暴露区域与还原剂接触,漂白以除去聚合物层的未曝光和暴露区域中的表面量的还原剂,并与无电晶种金属离子 以在曝光区域中氧化还原剂并形成相应的无电子种子金属核。 然后将相应的无电子种子金属核用导电金属无电镀。

    METHODS FOR USING INK JETTABLE, UV-CURABLE COMPOSITIONS

    公开(公告)号:US20170081533A1

    公开(公告)日:2017-03-23

    申请号:US14856685

    申请日:2015-09-17

    摘要: A method for forming an ink jet image on a substrate includes ink jetting an ink jettable and UV-curable composition onto the substrate in an imagewise fashion to form an ink jetted image on the substrate. The ink jettable and UV-curable composition comprises: a reactive polymer comprising: (a1) or (a2) recurring units comprising pendant metal complexing water-solubilizing groups, (b) at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally (c) at least 1 mol % of recurring units comprising a pendant amide, hydroxyl, or lactam group, or a pendant precursor moiety for the pendant amide, hydroxyl, or lactam group. The ink jetted image is cured to form a UV-cured ink jet image on the substrate. The ink jettable and UV-curable composition can also include metal nanoparticles or reducible metal ions that can serve as catalytic sites for electroless plating.

    Methods for using silver-containing polymeric complexes
    10.
    发明授权
    Methods for using silver-containing polymeric complexes 有权
    使用含银聚合物复合物的方法

    公开(公告)号:US09512243B2

    公开(公告)日:2016-12-06

    申请号:US14661327

    申请日:2015-03-18

    摘要: A method can be used to provide electrically-conductive articles with electrolessly plated metal, or articles having antimicrobial properties for marine environments. The method includes disposing a silver-containing composition onto one or more supporting sides of a substrate such as continuous polymeric web. The silver-containing composition comprises a water-soluble complex of a reactive polymer with reducible silver ions, the reactive polymer comprising: (a) greater than 1 mol % of recurring units comprising sulfonic acid or sulfonate groups, (b) at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally (c) at least 1 mol % of recurring units comprising a pendant amide, hydroxyl, lactam, phosphonic acid, or carboxylic acid group. The reducible silver ions can be suitably reduced and the reactive polymer can be photoexposed to provide crosslinking in patternwise or uniform fashion.

    摘要翻译: 可以使用一种方法来提供具有无电镀金属的导电制品或具有用于海洋环境的抗微生物性质的制品。 该方法包括将含银组合物设置在诸如连续聚合物网的基底的一个或多个支撑侧上。 含银组合物包含反应性聚合物与可还原的银离子的水溶性络合物,反应性聚合物包含:(a)大于1mol%的包含磺酸或磺酸酯基的重复单元,(b)至少5mol 包含能够通过[2 + 2]光环加成交联的侧基的重复单元的%,和任选地(c)至少1mol%的包含侧酰胺,羟基,内酰胺,膦酸或羧酸基团的重复单元。 可还原的银离子可以适当地减少,并且反应性聚合物可以被光致曝光以以图案或均匀的方式提供交联。