公开(公告)号：WO1998008672A1

公开(公告)日：1998-03-05

申请号：PCT/US1997014913

申请日：1997-08-25

Applicant: DeROCHEMONT, L., Pierre, doing business as C2 TECHNOLOGIES

Inventor： FARMER, Peter

IPC: B32B03/00

CPC classification number: H05K1/0271 ,  H01L23/142 ,  H01L23/3735 ,  H01L24/45 ,  H01L24/48 ,  H01L2221/68377 ,  H01L2224/45124 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K1/0272 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/38 ,  Y10S428/901 ,  Y10T428/12493 ,  Y10T428/12528 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2224/05599 ,  H01L2924/00

Abstract: A metal-ceramic composite comprised of a metal member bonded to a ceramic oxide member through a covalent bond formed at temperatures less than 880 DEG C, and metal-ceramic composites that are so constructed as to control internal stress or increase crack-resistance within the ceramic member under applied thermal or mechanical loads to the composite, such composite with ferrite or alumina bonded sets of such metal-ceramic computers and end use devices including printed circuit boards, EMI shields and higher level assemblies including such devices.

Abstract translation: 金属陶瓷复合材料，其通过在低于880℃的温度下形成的共价键与陶瓷氧化物构件接合的金属构件和金属陶瓷复合材料构成，所述金属陶瓷复合材料被构造成控制内部应力或增加抗裂性 陶瓷构件在施加的热或机械负载下对复合材料，这种复合材料具有铁氧体或氧化铝粘合的这种金属陶瓷计算机组以及包括印刷电路板，EMI屏蔽和包括这种装置的更高级组件的最终用途装置。

公开(公告)号：WO1997004629A1

公开(公告)日：1997-02-06

申请号：PCT/US1996011461

申请日：1996-07-09

Applicant: OLIN CORPORATION

Inventor： OLIN CORPORATION ,  ROBINSON, Peter, W. ,  MAHULIKAR, Deepak ,  HOFFMAN, Paul, R.

IPC: H05K07/20

CPC classification number: H01L23/13 ,  H01L23/142 ,  H01L23/24 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/49816 ,  H01L24/32 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/0271 ,  H05K3/305 ,  H05K2201/10477 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: The bending of a ball grid array electronic package (40) having a metallic base (12) is reduced minimizing stresses applied to the innermost row of solder balls (36) when the package base (12) is cyclically heated and cooled. Reducing the stresses applied to the solder balls (36) increases the number of thermal cycles before solder ball (36) fracture causes device (20) failure. Among the means disclosed to reduce the bending moment are a bimetallic (44, 46) composite base, an intergral stiffener (72), a centrally disposed cover (52) bonded to an external structure (30) and a package base (12) with a stress accommodating depressed portion (64).

Abstract translation: 当包装基底（12）被循环加热和冷却时，具有金属基底（12）的球栅阵列电子封装（40）的弯曲减小了施加到最内排的焊球（36）的应力的最小化。 减少施加到焊球（36）的应力增加了焊球（36）断裂导致装置（20）故障之前的热循环次数。 公开的用于减小弯矩的手段是双金属（44,46）复合基座，整体加强件（72），结合到外部结构（30）的中心设置的盖（52）和具有 应力容纳凹部（64）。

公开(公告)号：WO1996009748A1

公开(公告)日：1996-03-28

申请号：PCT/US1994013867

申请日：1994-12-02

Applicant: W.L. GORE & ASSOCIATES, INC.

Inventor： W.L. GORE & ASSOCIATES, INC. ,  SPENCER, Mark, Stephen

IPC: H05K01/11

CPC classification number: H01R12/62 ,  H05K1/0271 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09081

Abstract: This invention provides a high-density planar contact array capable of interconnecting various electronic devices using a pad to pad approach or pad to pin, which is capable of accommodating non-coplanarity in the Z axis of printed circuit boards but which still maintains good electrical contact. The array comprises an insulative substrate sheet (10) that has a plurality of parallel conductive lines (40) terminating in a pad (41) over a hole (42) in the substrate (10).

Abstract translation: 本发明提供了一种高密度平面接触阵列，其能够使用衬垫到焊盘接口或焊盘到引线互连各种电子器件，其能够在印刷电路板的Z轴上容纳非共面性，但仍保持良好的电接触 。 该阵列包括绝缘性基片（10），该绝缘性基片（10）具有多个平行的导线（40），该导线终止于衬底（10）上的孔（42）上的衬垫（41）中。

公开(公告)号：WO1994028598A1

公开(公告)日：1994-12-08

申请号：PCT/US1994001464

申请日：1994-02-09

Applicant: W.L. GORE & ASSOCIATES, INC.

Inventor： W.L. GORE & ASSOCIATES, INC. ,  SPENCER, Mark

IPC: H01R09/07

CPC classification number: H01R12/62 ,  H01R12/774 ,  H05K1/0271 ,  H05K1/118 ,  H05K3/361 ,  H05K3/365 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09081

Abstract: This invention provides a high-density planar contact array capable of interconnecting various electronic devices using a pad to pad approach or pad to pin, and which is capable of accommodating non-coplanarity in the Z axis of printed circuit boards but which still maintains good electrical contact. The array comprises a flat, flexible insulative substrate sheet that has a plurality of parallel conductive lines or an array of circles or polygons of which each has had insulative material surrounding or on at least two sides of the conductive lines or polygons removed in the Z axis. The insulative material is removed in such a way as to create a generally trapezoid shape having a greater lenght side opposite the conductor when viewed through a cross section of the X or Y axis. This trapezoid shape allows free Z axis motion while limiting X and Y axis motion.

Abstract translation: 本发明提供了一种高密度平面接触阵列，其能够使用衬垫到衬垫接近或衬垫到引脚互连各种电子器件，并且能够在印刷电路板的Z轴上容纳非共面性，但是仍然保持良好的电 联系。 该阵列包括平坦的，柔性的绝缘基片，其具有多个平行的导线或圆形或多边形阵列，它们各自具有围绕导电线或至少两侧的绝缘材料或在Z轴上移除的多边形 。 绝缘材料以通过X或Y轴的横截面观察时形成具有与导体相对的较大长度侧的大致梯形形状的方式被去除。 这种梯形形状允许自由的Z轴运动，同时限制X和Y轴运动。

公开(公告)号：WO1992006495A1

公开(公告)日：1992-04-16

申请号：PCT/US1991006627

申请日：1991-09-18

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： E.I. DU PONT DE NEMOURS AND COMPANY ,  YOUNG, James, C.

IPC: H01L23/12

CPC classification number: H01L23/15 ,  H01L23/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K1/0201 ,  H05K1/0271 ,  H05K1/05 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A microelectronic package comprising a rigid substrate (1) having mounted thereon a component (3) having a plurality of sides and an electrically functional layer (9) adjacent to at least two sides of the component (3), the component (3) and the electrically functional layer (9) being spatially separated by a guard band (7), the volume of the substrate (1) underlying the guard band (7) having at least one region (13d) of reduced rigidity which permits the substrate (1) to dissipate mechanical stresses generated therein when the device is subjected to heating.

Abstract translation: 一种微电子封装，包括刚性衬底（1），其上安装有具有多个侧面的部件（3）和与所述部件（3）的至少两侧相邻的电功能层（9），所述部件（3）和 所述电功能层（9）由保护带（7）在空间上分开，所述保护带（7）下方的所述基底（1）的体积具有至少一个刚度降低的区域（13d），所述区域（13d）允许所述基底 ）以在器件经受加热时消散其中产生的机械应力。

公开(公告)号：WO1990008365A1

公开(公告)日：1990-07-26

申请号：PCT/GB1990000081

申请日：1990-01-18

Applicant: W. & T. AVERY LIMITED ,  JARVIS, Charles, Richard

Inventor： W. & T. AVERY LIMITED

IPC: G06K19/077

CPC classification number: B32B37/226 ,  B29C33/36 ,  B29C33/68 ,  B29C67/246 ,  B29C70/70 ,  G06K19/07718 ,  G06K19/07728 ,  G06K19/07745 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01039 ,  H05K1/0271 ,  H05K1/189 ,  H05K3/284 ,  H01L2924/00014

Abstract: In order to allow a thin portable token of the Smart Card type to be flexible, yet protect the electronic components (2) within it, the token is manufactured from a resin material and includes high tensile foil inserts (7a, 7b) above and below the component, producing a double skinned effect to stiffen and strengthen the token in the region of the component. The components are mounted on a substrate (3), which also acts as a hinge between components to enable flexing of the token as a whole. Alternative comprise frames (15) encircling each component (2) or moulded resin members (11) encapsulating the components (2).

公开(公告)号：WO1989012871A1

公开(公告)日：1989-12-28

申请号：PCT/GB1989000693

申请日：1989-06-21

Applicant: W & T AVERY LIMITED ,  JARVIS, Charles, Richard

Inventor： W & T AVERY LIMITED

IPC: G06K19/06

CPC classification number: B32B37/226 ,  B29C33/36 ,  B29C33/68 ,  B29C67/246 ,  B29C70/70 ,  G06K19/07718 ,  G06K19/07728 ,  G06K19/07745 ,  G06K19/07749 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/189 ,  H05K3/284 ,  H01L2924/00

Abstract: A small article such as portable electronic token of the smart card type is manufactured by means of a reaction injection moulding technique in which electronic circuitry (1, 2) is encapsulated within a hardenable plastics material (8). The labels on the faces of the card (6) are used as a mould release agent to enable easy release of the token, once hardened, from the mould (10). The articles are conveniently manufactured by a continuous process using moving belts.

公开(公告)号：WO2019033753A1

公开(公告)日：2019-02-21

申请号：PCT/CN2018/079617

申请日：2018-03-20

Applicant: 深圳市道通智能航空技术有限公司

Inventor： 陈法全

IPC: G01C21/18

CPC classification number: G01C21/18 ,  G01C25/00 ,  H05K1/0271 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/10151 ,  H05K2201/10409 ,  H05K2201/2045

Abstract: 一种惯性测量装置以及机械设备，惯性测量装置包括PCB板和惯性测量单元，PCB板包括PCB主体部，以及自PCB板的一侧开槽形成并与PCB主体部固定连接的隔离部，惯性测量单元设置在隔离部。通过优化惯性测量结构的PCB板设计，使得传递到惯性测量结构的机械应力减小乃至于消除，使得机械应力对惯性测量结构中的惯性测量单元例如陀螺仪和加速度计等影响较小，从而降低噪声及减小零偏，有利于发挥出陀螺仪和加速度计的最好性能，进而提升了惯性测量结构的控制精度，特别适合应用于云台、机器人、无人机或载人航空器等设备或领域。

公开(公告)号：WO2019020594A1

公开(公告)日：2019-01-31

申请号：PCT/EP2018/069974

申请日：2018-07-24

Applicant: IFM ELECTRONIC GMBH

Inventor： WEBER, Michael ,  HÖSS, Heribert

IPC: H05K3/34 ,  H02G15/007 ,  H05K1/02 ,  H05K1/11 ,  H05K5/00 ,  H05K5/02

CPC classification number: H05K3/3405 ,  G01D11/245 ,  H05K1/0271 ,  H05K1/111 ,  H05K1/117 ,  H05K2201/094 ,  H05K2201/09427 ,  H05K2201/09445 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/10356 ,  H05K2201/10446 ,  H05K2203/173

Abstract: Elektronisches Schaltgerät mit einem Gehäuse (1), einem Anschlusskabel (3) und einer Leiterplatte (2) mit einer elektronischen Schaltung, wobei die Litzen (4) des Anschlusskabels (3) jeweils mit einem auf der Leiterplatte (2) angeordneten und zur Versorgung der elektronischen Schaltung dienenden ersten Kontaktpad (5) verbunden sind, wobei die Litzen (4) des Anschlusskabels (3) erfindungsgemäß jeweils mit einem auf der Leiterplatte (2) angeordneten zweiten Kontaktpad (6) verbunden sind, das von der Elektronikeinheit isoliert ist, näher am Kabeleintritt angeordnet ist, und lediglich der Zugentlastung dient. Außerdem ist ein Verfahren zur Kabelauszugsprüfung angegeben.

公开(公告)号：WO2018104090A1

公开(公告)日：2018-06-14

申请号：PCT/EP2017/080478

申请日：2017-11-27

Applicant: CONTI TEMIC MICROELECTRONIC GMBH

Inventor： RUMRICH, Thomas

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/12

CPC classification number: H05K1/111 ,  H05K1/0271 ,  H05K3/1275 ,  H05K2201/0133 ,  Y02P70/611

Abstract: Leiterplattenaufbau zur Reduzierung des mechanischen Stresses Die Erfindung betrifft eine Leiterplatte (100), aufweisend eine Leiterbahn (120) mit einem Anschlussbereich (125), eine flexible Schicht (110) im Anschlussbereich (125) der Leiterbahn (120), und ein Kontaktpad (140), welches zumindest teilweise auf der flexiblen Schicht (110) aufgebracht ist. Die flexible Schicht (110) ist ausgelegt, eine Scherkraft aufzunehmen, die durch eine Verformung der Leiterplatte (100) erzeugt wird, um eine mechanische Spannung im Kontaktpad (140) zu reduzieren.