Abstract:
A method and apparatus for automating the testing and/or repair of printed circuit boards. Apparatus includes one or more test (11) and/or repair (15) stages and conveyor means (12, 13) to transport the components required to test and/or repair such printed circuit boards between such stages. The printed circuit boards are mounted in standardized carriers which facilitate intermixing different sizes and shapes of board without requiring adjustment of conveyor means (12, 13). The other components such as the circuit means required to electrically access the printed circuit board are adapted to also be transportable by the same conveyor means (12, 13). Apparatus further includes an automation interface (38) to efficiently and accurately load and unload the required components to and from the stages.
Abstract:
The present invention(s) provide an apparatus and method for processing substrates (150) in a screen printing chamber (102) that can deliver a repeatable and accurate screen printed pattern on one or more processed substrates. In one embodiment, the screen printing chamber is adapted to perform a screen printing process within a portion of a crystalline silicon solar cell production line in which a substrate is patterned with a desired material. In one embodiment, the screen printing chamber is a processing chamber positioned within the Rotary line tool or Softline™ tool available from Baccini S. p. A.
Abstract:
An electronic multi -component package (74, 75) is assembled by placing multiple electronic components (30) within multiple openings (16) of a package substrate (12), then depositing and curing adhesive filler (34) in gaps between the components and the inner peripheries of the openings. Circuit features (38, 42), including conductive interconnects, are formed by thin-film photolithography over both front and back surfaces (22F, 22B) of the package substrate. Preformed conductive vias (18) through the package substrate provide electrical connection between circuit features on opposite substrate surfaces. Additional electronic components (50, 54, 58) may be attached (52, 56, 60) to conductive lands on at least one side of the package. The circuit features also include contact pads (66) for external package connections, such as in a ball-grid-array or equivalent structure.
Abstract:
An apparatus for replacing a defective PCB unit formed on a PCB panel includes a location correcting table on which a nondefective PCB unit for replacing the defective PCB unit is disposed, a panel seating table, on which a PCB panel where the defective PCB unit is removed is disposed, a seating table support on which the panel seating table is detachable installed by a fastener, a location correcting driver for driving the location correcting table relative to the panel seating table to correct location of the nondefective PCB unit with respect to the PCB panel, a vision camera for reading location of specific points on the nondefective PCB unit and the PCB panel respectively disposed on the location correcting table and the panel seating table, a reading location varying driver for sequentially moving the specific points read by the vision camera below the vision camera, and a controller for controlling the location correcting driver and the reading location varying driver, receiving operation results of the vision camera, the location correcting driver and the reading location varying driver, and controlling the location correcting driver by calculating location correcting data based on the operation results.
Abstract:
According to the invention, two housings (5) which are guided in the X and Y axes and designed for receiving workpieces (6) can be displaced independently of each other and according to an alternating, cyclic sequence of movements in a shared working plane between an input station (7), a machining station (8) and an output station (9). Drive and guiding means (2, 3, 4) for the two housings (5) are positioned on both sides of the working plane. This makes it possible for the workpieces (6) to be machined almost continuously.