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    A CONDENSER MICROPHONE MOUNTABLE ON MAIN PCB
    51.
    发明申请
    A CONDENSER MICROPHONE MOUNTABLE ON MAIN PCB 审中-公开
    在主PCB上安装一个冷凝器麦克风

    公开(公告)号：WO2005069681A8

    公开(公告)日：2005-10-27

    申请号：PCT/KR2004002526

    申请日：2004-10-01

    Applicant: BSE CO LTD ,  SONG CHEONG-DAM

    Inventor： SONG CHEONG-DAM ,  LIM JUN ,  PARK SUNG-HO

    IPC: H04R1/06 ,  H04R19/04 ,  H05K1/18

    CPC classification number: H04R1/06 ,  H04R19/04 ,  H05K1/181 ,  H05K2201/09072 ,  H05K2201/10083 ,  Y02P70/611

    Abstract: A condenser microphone mountable on a main PCB is disclosed. The condenser microphone of the present invention comprises a cylinder-shaped case having one side which is opened and the other side which is closed; a first metal ring inserted into the case for an electrical connection; a disk-shaped back plate having a sound hole to be connected electrically to the case through the first metal ring; a ring-shaped spacer; a cylinder-shaped insulating ring having an open top part and an open bottom part to provide an electrical insulation and a mechanical support; a diaphragm inserted into the insulating ring and facing to the back plate while interposing the spacer between the diaphragm and the back plate; a second metal ring for being connected electrically to the diaphragm and supporting mechanically the diaphragm; and a PCB that is mounted with electronic components and is formed with a sound hole, the PCB being connected to the back plate through the second metal ring and the case, the PCB including connection terminals connected to the outside. Accordingly, the condenser microphone maintains the sound quality in a good state since the sound wave transfer path is short even if the component mount region of the main PCB on which the condenser microphone is mounted is directed toward an inner side of the electronic product at need.

    Abstract translation: 公开了一种可安装在主PCB上的电容式麦克风。 本发明的电容式麦克风包括一个圆柱形壳体，该圆柱形壳体的一侧开口而另一侧闭合; 插入壳体中用于电连接的第一金属环; 具有音孔的盘形背板，所述音板通过所述第一金属环电连接到所述壳体; 一个环形垫片; 圆柱形绝缘环，具有开放的顶部和开放的底部以提供电绝缘和机械支撑; 隔膜，插入所述绝缘环并且面对所述背板，同时将所述隔离件置于所述隔膜和所述背板之间; 第二金属环，用于电连接到所述隔膜并机械地支撑所述隔膜; 以及安装有电子组件并且形成有音孔的PCB，所述PCB通过所述第二金属环和所述壳体连接到所述背板，所述PCB包括连接到外部的连接端子。 因此，即使安装有电容器麦克风的主PCB的元件安装区域朝向需要的电子产品的内侧，由于声波传输路径较短，电容传声器保持良好状态的音质 。

    ELECTRICALLY CONNECTING INTEGRATED CIRCUITS AND TRANSDUCERS
    54.
    发明申请
    ELECTRICALLY CONNECTING INTEGRATED CIRCUITS AND TRANSDUCERS 审中-公开
    电连接集成电路和传感器

    公开(公告)号：WO01089275A3

    公开(公告)日：2002-04-04

    申请号：PCT/US2001/015758

    申请日：2001-05-15

    IPC: H01R12/00 ,  H05K1/18

    CPC classification number: H05K1/181 ,  H05K2201/10083 ,  H05K2201/1053 ,  H05K2201/10689 ,  H05K2201/10734 ,  Y02P70/611

    Abstract: Apparatus and methods of electrically connecting integrated circuits (40-50) and transducers (28-38) are described. In particular, a transducer (60) includes a base (62) mountable on a substrate (64) (e.g., a printed circuit board), and an input/output (I/O) lead (66) configured to contact an I/O lead (68) of an integrated circuit (70) mounted on the substrate (64). The transducer (60) may be mounted on the substrate (64) to contact the transducer I/O lead (66) to the integrated circuit I/O lead (68). The transducer I/O lead (66) is configured to electrically connect to the integrated circuit I/O lead (68) independently of any electrically conductive path of the substrate (64). The direct electrical connection between the transducer (60) and the integrated circuit (70) provides a high-speed communication channel that avoids the parasitic and high-inductance limitations generally associated with conventional metallic printed circuit board traces. At the same time, the transducer (60) is compatible with existing printed circuit board technologies and integrate circuit technologies and, therefore, may be readily integrated into existing computer systems.

    Abstract translation: 描述了电连接集成电路（40-50）和换能器（28-38）的装置和方法。 特别地，换能器（60）包括可安装在基板（64）（例如，印刷电路板）上的基座（62）和被配置为接触I / O端子的输入/输出（I / O）引线（66） 安装在基板（64）上的集成电路（70）的O引线（68）。 换能器（60）可以安装在基板（64）上以将换能器I / O引线（66）接触到集成电路I / O引线（68）。 换能器I / O引线（66）被配置为独立于衬底（64）的任何导电路径电连接到集成电路I / O引线（68）。 换能器（60）和集成电路（70）之间的直接电连接提供了高速通信通道，其避免了与常规金属印刷电路板迹线通常相关联的寄生和高电感限制。 同时，传感器（60）与现有的印刷电路板技术兼容，并集成电路技术，因此可以容易地集成到现有的计算机系统中。

    CIRCUIT CARD ASSEMBLY HAVING CONTROLLED EXPANSION PROPERTIES
    55.
    发明申请
    CIRCUIT CARD ASSEMBLY HAVING CONTROLLED EXPANSION PROPERTIES 审中-公开
    具有控制扩展属性的电路卡组件

    公开(公告)号：WO01084894A1

    公开(公告)日：2001-11-08

    申请号：PCT/US2001/040448

    申请日：2001-04-03

    IPC: G01K1/14 ,  H05K1/02 ,  H05K1/18

    CPC classification number: H05K1/0271 ,  H05K1/185 ,  H05K2201/068 ,  H05K2201/10083 ,  H05K2201/10151

    Abstract: Piezoelectric material (120) is embedded in epoxy layers (220) of circuit cards (102) to control thermal expansion and contraction as a function of temperature changes. A temperature sensor (212) and thermostat (214) generates a controlled voltage as a function of temperature and applies the voltage to piezoelectric blocks (120) within the circuit card. Local areas of the circuit card can have different amounts of piezoelectric material (120) or different thermostats (214). Piezoelectric blocks (120) can be arranged in regular patterns or can be randomly or pseudorandomly placed.

    Abstract translation: 压电材料（120）嵌入在电路卡（102）的环氧树脂层（220）中，以控制热膨胀和收缩作为温度变化的函数。 温度传感器（212）和恒温器（214）产生作为温度的函数的受控电压，并将电压施加到电路卡内的压电块（120）。 电路卡的局部区域可以具有不同数量的压电材料（120）或不同的恒温器（214）。 压电块（120）可以以规则的图案布置，或者可以随机地或伪随机放置。

    PIEZO-OSCILLATOR
    56.
    发明申请
    PIEZO-OSCILLATOR 审中-公开
    压电振荡器

    公开(公告)号：WO99037018A1

    公开(公告)日：1999-07-22

    申请号：PCT/JP1999/000128

    申请日：1999-01-18

    IPC: H03B5/32 ,  H03L1/04 ,  H05K1/02

    CPC classification number: H03B5/32 ,  H03L1/04 ,  H05K1/0201 ,  H05K1/0212 ,  H05K1/0237 ,  H05K2201/10022 ,  H05K2201/10083 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10515 ,  H05K2203/165

    Abstract: A piezo-oscillator reduced in current consumption and size, comprising a crystal oscillator as a piezoelectric vibrator, an oscillation circuit, a plurality of surface mounted heaters, and a temperature control circuit for controlling the heating temperatures of the heaters, all mounted on a printed circuit board, wherein the case and lead terminals of the piezoelectric vibrator are simultaneously heated respectively by separate heaters so that the piezoelectric vibrator, the oscillation circuit and the temperature control circuit can be heated at the same time.

    Abstract translation: 压电振荡器降低了电流消耗和尺寸，包括作为压电振动器的晶体振荡器，振荡电路，多个表面安装的加热器，以及用于控制加热器的加热温度的温度控制电路，所有温度控制电路全部安装在印刷 电路板，其中压电振动器的壳体和引线端子分别通过单独的加热器同时加热，使得可以同时加热压电振动器，振荡电路和温度控制电路。

    DISPOSABLE PORTABLE ELECTRONIC DEVICES AND METHOD OF MAKING
    57.
    发明申请
    DISPOSABLE PORTABLE ELECTRONIC DEVICES AND METHOD OF MAKING 审中-公开
    便携式便携式电子设备及其制造方法

    公开(公告)号：WO99005760A1

    公开(公告)日：1999-02-04

    申请号：PCT/US1998/012760

    申请日：1998-06-18

    IPC: H05K1/16 ,  H05K1/18 ,  H02G3/08 ,  H05K1/00 ,  H05K5/00

    CPC classification number: H05K1/189 ,  H05K1/16 ,  H05K1/182 ,  H05K2201/055 ,  H05K2201/10053 ,  H05K2201/10083 ,  H05K2201/10136

    Abstract: A disposable portable electronic device has a body (22) of prescribed length and thickness and constructed of elongated, ribbon-like substrate (64) of dielectric material. The substrate has a contiuous length much greater than the length of the body and a thickness much less than the thickness of the body. Conductors and components are formed on the substrate. The dielectrical material of the substrate is folded upon itself into short lengths juxtaposed on one another within the thickness of the body, and the juxtaposed lengths of the substrate are secured together to establish a self-sustaining structure which forms the body of the device.

    Abstract translation: 一次性便携式电子设备具有规定长度和厚度的本体（22），并且由介电材料的细长的带状基底（64）构成。 衬底具有比身体长度大得多的连续长度，并且其厚度远小于身体的厚度。 在基板上形成导体和部件。 衬底的介电材料本身折叠成在本体的厚度内彼此并排的短长度，衬底的并置长度被固定在一起以建立形成器件主体的自持结构。

    A METHOD AND DEVICE TO FASTEN A LOUDSPEAKER TO A CIRCUIT BOARD
    58.
    发明申请
    A METHOD AND DEVICE TO FASTEN A LOUDSPEAKER TO A CIRCUIT BOARD 审中-公开
    将电路板放在电路板上的方法和装置

    公开(公告)号：WO1997016913A1

    公开(公告)日：1997-05-09

    申请号：PCT/SE1996001376

    申请日：1996-10-25

    Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (publ) ,  LINDMAN, Lennart ,  MELLGREN, Ronny ,  GUSTAFSSON, Sune

    Inventor： TELEFONAKTIEBOLAGET LM ERICSSON (publ)

    IPC: H04M01/02

    CPC classification number: H04M1/62 ,  H04M1/0202 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/09063 ,  H05K2201/10083 ,  Y02P70/611 ,  Y10T29/49005

    Abstract: With the intention of simplifying the manner in which a loudspeaker is mounted on a circuit board while maintaining requisite sealing and damping between the loudspeaker and the circuit board, the loudspeaker is affixed directly to the circuit board (1) by means of a double-side adhesive annulus (3) with the diaphragm of the loudspeaker facing towards the board, wherein the board has holes (4) located opposite the loudspeaker. The number of holes (4) provided and the size of the holes may be adapted to provide the best sound production in accordance with application. When a loudspeaker is mounted in this way, all components can be collected on the circuit board and therewith simplify manufacture of the telephone apparatus as such, irrespective of whether the circuit board is in the handset or some other part of the apparatus.

    Abstract translation: 为了简化扬声器安装在电路板上的方式，同时保持扬声器和电路板之间的必要的密封和阻尼，扬声器通过双面直接固定到电路板（1） 粘合剂环（3），其中扬声器的隔膜面向板，其中板具有位于扬声器对面的孔（4）。 提供的孔（4）的数量和孔的尺寸可以适于根据应用提供最佳的声音产生。 当以这种方式安装扬声器时，所有组件都可以被收集在电路板上，从而简化了电话设备的制造，而不管电路板是在手机还是设备的其他部分。

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