摘要:
A coaxial transmitter optical subassembly (TOSA) including a ball lens may be used in an optical transceiver for transmitting an optical signal at a channel wavelength. The coaxial TOSA includes a laser package with a ball lens holder section defining a lens holder cavity that receives the ball lens. The lens holder cavity is dimensioned such that the ball lens is positioned in substantial alignment with the laser diode for optically coupling a laser output from the laser diode into an optical waveguide at an optical coupling end of the TOSA. The coaxial TOSA is thus configured to allow the less expensive ball lens to be used in a relatively small package when a lower coupling efficiency and power is desired and without substantial redesign of the TOSA.
摘要:
One example of a multi-chip module includes a substrate, a semiconductor chip, and an optical transceiver. The substrate has a first side and a second side opposite the first side. The semiconductor chip is electrically coupled to the first side of the substrate. The optical transceiver is electrically coupled to the second side of the substrate.
摘要:
Improved passive optical coupling to photonic integrated circuit (PIC) chips is provided. An interposer unit (108) having one or more flexible optical waveguide members (112, 114, 116) is employed. The flexible optical waveguide members are coupled to the PIC chip (118) via their tips. The PIC chip includes alignment features to facilitate lateral, vertical and longitudinal passive alignment of the flexible optical waveguide members to on-chip optical waveguides of the PIC.
摘要:
The invention relates to a device (100a, 100b, 100c, 100d, 100e, 100f, 100g) which is provided for coupling optical signals into at least one waveguide (10) and which has at least one electro-optical converter (28), which emits the optical signals in the direction of the axis or of the core (12) of the weaveguide (10). The problem addressed by the invention is that of further developing the device such that an active alignment of the waveguide (10) is not required. This problem is solved in that the electro-optical converter (28) is received, in particular embedded, in at least one emission-side optical sub-assembly (40), the emission-side optical sub-assembly (40) has at least one guide channel (46) for aligning the waveguide (10) in relation to the electro-optical converter (28), in particular in relation to the emission opening or active surface (30) of the electro-optical converter (28), and at least one expansion (90) provided for alignment of the waveguide (10) in relation to the guide channel (46) is allocated to the emission-side optical sub-assembly (40), in particular to the guide channel (46). The invention further relates correspondingly to a device (140a, 140b, 140c, 140d, 140e, 140f, 140g) for decoupling optical signals out of at least one waveguide (10).
摘要:
The method comprises providing a semiconductor substrate (1), which has a main surface (12) and an opposite further main surface (13), arranging a contact pad (19) above the further main surface, forming a through-substrate via (4) from the main surface to the further main surface at a distance from the contact pad and, by the same method step together with the through-substrate via, forming a further through- substrate via (14) above the contact pad, arranging a hollow metal via layer (5) in the through-substrate via and, by the same method step together with the metal via layer, arranging a further metal via layer (15) in the further through- substrate via, the further metal via layer contacting the contact pad, and removing a bottom portion of the metal via layer to form an optical via laterally surrounded by the metal via layer.
摘要:
본 발명은 기기 내에서 보드 대용량 데이터 고속 전송 또는 기기 간 대용량 데이터 고속 전송을 위해 광소자, 광전송부재를 포함하여 모듈화하되, 모듈내부에서 광소자와 광전송부재 간에 광정렬을 완료함으로써 외부 PCB 기판에 실장시 발생될 수 있는 광정렬오차를 제거할 수 있는 광모듈에 관한 것으로, 광전송부재, 광전송부재(100)로 광소자(200), 기판(210), 광소자(200)와 외부회로간의 전극패드(220), 광전송부재장착부가 구비된 옵티컬블럭(300)를 포함하여 이루어지되, 광전송부재장착부는, 광축방향으로 옵티컬블럭상에 광전송효율이 최대가 되는 형성되는 것을 특징으로 하는 광 모듈을 제공한다. 또한, 상기 기판(210)의 일면에 상기 광소자(200)를 마운팅 및 실장하고, 광소자(200)의 광입출사포인트2차원평면상위치를 산출한 후, 기판(210) 위에 광소자(200)를 함입하도록 옵티컬블럭(300)의 모재(母材)를 형성하며, 이후, 모재 상에 전단계에서 산출된 광입출사포인트2차원평면상위치에 광전송부재장착부(310)를 성형하고, 광전송부재장착부(310)에 광전송부재(100)를 장착하는 과정을 갖는 광모듈의 제조방법을 제공한다.
摘要:
The invention relates to the further development of a device (100) for coupling optical signals in at least one waveguide (10), said device (100) having at least one transmission-side circuit (26), which, on the basis of signals incoming from transmission-side connection contacts (22), actuates at least one electro-optical converter (28), which transmits the optical signals in the direction of the axis (12) of the waveguide (10), such that the expense for production is low, wherein, according to the invention, the electro-optical converter (28) is received, in particular embedded, in at least one transmission-side receptacle/alignment module (40), the transmission-side receptacle/alignment module (40) has at least one groove or channel-shaped recess (46) for aligning the waveguide (10) in relation to the electro-optical converter (28) and the transmission-side receptacle/alignment module (40) is received, in particular fitted, into a recess (38) in a transmission-side substrate (20) in a substantially form and/or force-fit manner. The invention further relates to a device (140) for decoupling optical signals from at least one waveguide (10).